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DSASL004365.pdf
Manufacturer
Texas Instruments
Partial File Text
TEXAS INSTRUMENTS Final Notification for the Manufacture of 48/56 Pin TSSOP Package (DGG) at the TI Sherman Assembly/Test Facility November 12, 1996 Abstract As previously notified in March by P
Datasheet Type
Original
ECAD Model
Part Details
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User Tagged Keywords
KMC-166
TEXAS INSTRUMENTS, Mold Compound
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