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DSA00109760.pdf
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Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel
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Original
ECAD Model
DSA00109760.pdf preview
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User Tagged Keywords
intel C4 package
Low viscosity underfill for flip chip
microwave oven
underfill
underfill for good adhesion and low viscosity
with or without underfill
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