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DSAZSAA00019969.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline DFN3333-8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3.3 x 3.3 x 1.0 mm SOT873-1 X B D A E terminal 1 index area A
Datasheet Type
Original
ECAD Model
Part Details
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