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DSA0032003.pdf
Manufacturer
International Rectifier
Partial File Text
A New Generation of Wafer Level Packaged HEXFET ® Devices by Tim Sammon, Hazel Schofield, Aram Arzumanyan, & Dan Kinzer, International Rectifier As presented at PCIM Europe 2000 Introduction & Summ
Type
Original
ECAD Model
Alternative Parts
IRF6100PBF
Part Details
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DSA0032003.pdf preview
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User Tagged Keywords
IRF6100
IRF6150
PCB design for very fine pitch csp package
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