0.35mm BGA
Abstract: FR4 1.6mm substrate 0.35mm pitch BGA SF-BGA48C-B-03 FR4 substrate 1.6mm BGA 0.35mm pitch bga 6x8
Text: Compatible BGA Footprint 16mm [0.630"] 13.5mm [0.531"] 13.2mm [0.520"] 7.29mm [0.287"] 11mm [0.433"] 10.72mm [0.422"] 10.85mm [0.427"] 0.75mm 0.35mm [0.014"] 7.4mm [0.291"] Top View 9.8mm [0.386"] D 0.8 mm x4 0.38mm [0.015"] 9.75mm [0.384"] End View 0.75mm pitch typ.
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FR4/G10
SF-BGA48C-B-03
SF-BGA048C-B-03
0.35mm BGA
FR4 1.6mm substrate
0.35mm pitch BGA
FR4 substrate 1.6mm
BGA 0.35mm pitch
bga 6x8
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PDF
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0.35mm BGA
Abstract: BGA 0.35mm pitch 17X17 SF-BGA208D-B-01 SN63 0.35mm pitch BGA
Text: 15.00mm [0.591"] 1.13mm [0.044"] 0.80mm pitch typ. 1.13mm [0.044"] Top View 15.00mm [0.591"] 0.35mm [0.014"] dia. Side View 2 0.33mm [0.013"] 5.64mm [0.222"] 8.70mm [0.342"] 1 0.80mm pitch typ. 3 Bottom View Patent # 6,351,392 1 Substrate: 0.0985"±0.006" FR4/G10 or
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FR4/G10
17X17X4
127mm
SF-BGA208D-B-01
0.35mm BGA
BGA 0.35mm pitch
17X17
SN63
0.35mm pitch BGA
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PDF
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0.35mm BGA
Abstract: BGA 0.35mm pitch SF-BGA107C-B-62F 0.35mm pitch BGA
Text: Top View RoHS Compliant 8mm [0.315"] 1.1mm [0.043"] 0.8mm [0.031"] 0.8mm typ. 11mm [0.433"] 8.8mm [0.346"] Detail A 0.89mm [0.035"] 2.83mm [0.112"] 6.4mm [0.252"] Side View Detail A 2 2.48mm [0.098"] 1 3 0.35mm ± 0.05mm [0.014" ± 0.002"] 1 CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins
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254mm/0
203mm
254mm0
FR4/G10
SF-BGA107C-B-62F
0.35mm BGA
BGA 0.35mm pitch
0.35mm pitch BGA
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PDF
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0.35mm BGA
Abstract: SG-MLF-7022
Text: GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly IC guide prevents over compression of elastomer
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025mm
275mm
075mm
SG-MLF-7022
0.35mm BGA
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PDF
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1mm pitch BGA socket
Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
Text: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)
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MIL-STD202,
1mm pitch BGA socket
thermal shock standard
papst 3412
25M1
Muffin
Thermal Resistance Calculation TO
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PDF
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IC 7108
Abstract: SG-BGA-7108 7108 and/cj 7108
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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f/4/09,
725mm
025mm
SG-BGA-7108
125mm.
IC 7108
7108
and/cj 7108
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PDF
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0.35mm BGA
Abstract: 7060 SG-BGA-7060
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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475mm.
725mm
025mm
SG-BGA-7060
125mm.
0.35mm BGA
7060
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PDF
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SG-BGA-7056
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7056
725mm
025mm
125mm.
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PDF
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SG-BGA-7084
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer
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Original
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725mm
025mm
SG-BGA-7084
125mm.
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PDF
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BOX21151
Abstract: SG-BGA-6153 fillister head screw st 6153
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer
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225mm
SG-BGA-6153
725mm
725mm
025mm
BOX21151
fillister head screw
st 6153
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PDF
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ic 7085
Abstract: FR4 thickness 7085 ic SG-BGA-7085 FR4 1.6mm thickness 0.35mm BGA FR4 0.8mm thickness
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
SG-BGA-7085
725mm
025mm
ic 7085
FR4 thickness
7085 ic
FR4 1.6mm thickness
0.35mm BGA
FR4 0.8mm thickness
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PDF
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0.35mm BGA
Abstract: 7063 transistor SG-BGA-7063
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
725mm
025mm
SG-BGA-7063
125mm.
0.35mm BGA
7063 transistor
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PDF
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7062
Abstract: ic 7062 SG-BGA-7062 0.35mm BGA
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
525mm
725mm
025mm
SG-BGA-7062
125mm.
7062
ic 7062
0.35mm BGA
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PDF
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7086
Abstract: BGA Solder Ball 0.6mm 0.35mm BGA SG-BGA-7086 BGA Solder Ball 0.35mm
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Top View Compression plate distributes forces evenly Easily removable swivel socket lid
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Original
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475mm.
525mm
725mm
025mm
SG-BGA-7086
125mm.
7086
BGA Solder Ball 0.6mm
0.35mm BGA
BGA Solder Ball 0.35mm
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PDF
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SG-BGA-6111
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required 32.225mm Compression plate distributes forces evenly Ball guide prevents over compression of elastomer
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Original
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225mm
725mm
725mm
025mm
SG-BGA-6111
125mm.
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PDF
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0.65mm pitch BGA
Abstract: 0.35mm pitch BGA BGA Solder Ball 0.35mm .65mm bga land pattern BGA 0.35mm pitch bga socket bpw 50 0.35mm BGA 202 ball bga
Text: Ball / Land Grid Array Sockets EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Screw Lock Type E-tec is now the leading BGA socket manufacturer. Sockets range from 5 x 5 upwards and some of the existing patterns are shown on the following
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PDF
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SG-BGA-7112
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Top View (Transparent) Compression plate distributes forces evenly Ball guide prevents over compression of elastomer
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Original
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SG-BGA-7112
125mm.
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PDF
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SG-BGA-7028
Abstract: No abstract text available
Text: Top View GHz BGA Socket - Epoxy mount, solderless Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 18.125mm Easily removable socket lid
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125mm
DP110
SG-BGA-7028
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PDF
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"0.4mm" bga "ball collapse" height
Abstract: BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 TMS320
Text: TMS320 DSP Number 89 DESIGNER’S NOTEBOOK TMS320C6x Manufacturing with the BGA Package Contributed by David Bell April 14, 1998 Design Problem How do I solder the TMS320C6x to a board? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller
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TMS320
TMS320C6x
TMS320C6201
AN1231.
"0.4mm" bga "ball collapse" height
BGA Solder Ball 0.35mm collapse
BGA Package 0.35mm pitch
BGA Solder Ball collapse
BGA Solder Ball 0.35mm
0.4mm pitch BGA routing
tms320 solder reflow
TMS320 bga
AN1231
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PDF
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General Micro-electronics
Abstract: SMT pitch roadmap ansys darveaux ansys CP-01019-1 Electronic Arrays FR4 thermal expansion constant vs temperature neural network BGA cte amkor flip
Text: Building Reliability Into Full-Array BGAs Yuan Li, Ph.D., Anil Pannikkat, Ph.D., Larry Anderson, Tarun Verma, Bruce Euzent Altera Corporation 101 Innovation Drive, San Jose, CA 95134 Electronic Arrays, NEC, IMP and Altera Corp. He joined Altera in 1992 and is currently Director
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PDF
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"0.4mm" bga "ball collapse" height
Abstract: TMS320C6x BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch
Text: TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital Signal Processing Solutions March 1998 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of
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TMS320C6x
SPRA429
AN1231.
TMS320C6201
"0.4mm" bga "ball collapse" height
BGA Solder Ball 0.35mm collapse
SPRA429
BGA Package 0.35mm pitch
0.35mm BGA
BGA Solder Ball 0.35mm
0.4mm pitch BGA routing
BGA Solder Ball collapse
BGA 0.35mm pitch
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PDF
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BGA Solder Ball 0.6mm
Abstract: SF-BGA240N-B-61F
Text: 0.6mm [0.024"] 18mm [0.709"] 0.6mm [0.024"] 18mm [0.709"] 0.8mm typ. 16.8mm square [0.661"] Top View 0.2mm dia. [0.008"] 2 1 3.87mm ± 0.254mm [0.152"±0.010"] 0.8mm typ. 3 Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non
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Original
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254mm
FR4/G10
22x22
SF-BGA240N-B-61F
BGA Solder Ball 0.6mm
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PDF
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BGA Package 0.35mm pitch
Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
Text: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed
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CH-1072
BGA Package 0.35mm pitch
E-tec Interconnect
.65mm bga land pattern
1072 Diode, SMD
3M Touch Systems
bpw 50
TEC Driver
8 pin ic base socket round pin type lead
qualitek
BGA reflow guide
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PDF
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TSM4405P
Abstract: TSM8405P Ultra Low Qg
Text: TSM8405P Single P-Channel 1.8V Specified MicroSURFTM MOSFET D D S Lateral Power for Load Switching and PA Switch S S G D G VDS = - 12V RDS on , Vgs @ - 4.5V, Ids @ - 4.9A = 50mΩ RDS (on), Vgs @ - 2.5V, Ids @ - 4.4A = 70mΩ RDS (on), Vgs @ - 1.8V, Ids @ - 4.0A = 90mΩ
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TSM8405P
TSM8405P
TSM4405P
TSM4405P
Ultra Low Qg
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PDF
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