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    sandisk flash controller

    Abstract: SANDISK flash ID code sandisk date code X32C 08051C103KATMA sandisk flash chipset Sandisk Flash memory SanDisk controller qualitek "Humidity Indicator Card"
    Text: Flash ChipSet Product Manual 13.0 Flash ChipSet Manufacturabiltv Specifications 13.1 H ow the Flash ChipSet LCC is Received The Flash ChipSet LCC is shipped in packages that each contain 360 pieces in 4 trays with 90 pieces in each tray. The LCC trays are dry packed and vacuum sealed with a desiccant in a moisture barrier bag.


    OCR Scan     		60pSet. RB471E 60Hz1 sandisk flash controller SANDISK flash ID code sandisk date code X32C 08051C103KATMA sandisk flash chipset Sandisk Flash memory SanDisk controller qualitek "Humidity Indicator Card" PDF

    POWER TRANSFORMER E154515

    Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
    Text: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD


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    Sandisk Flash memory

    Abstract: Sandisk TSOP sandisk flash controller SDTB-64 sandisk flash drive 48 pin controller SDTB-32 SanDisk TSOP 56 socket 14x14 circuit diagram sandisk 64 mb SDFCSTB
    Text: Flash ChipSet Product Manual CORPORATE HEADQUARTERS 140 Caspian Court Sunnyvale, CA 94089-9820 408-542-0500 FAX: 408-542-0503 URL: http://www.sandisk.com SanDisk Corporation general policy does not recommend the use of its products in life support applications where in a


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    ACTEL CCGA 624 mechanical

    Abstract: CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste
    Text: Application Note AC190 Ceramic Column Grid Array Introduction Ceramic Column Grid Array CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections


    Original     		AC190 624-pin CG624) CG1152) 1272-pin ACTEL CCGA 624 mechanical CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste PDF

    BGA Package 0.35mm pitch

    Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
    Text: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed


    Original     		CH-1072 BGA Package 0.35mm pitch E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide PDF