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    06DEC2000 Search Results

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    108-18214

    Abstract: No abstract text available
    Text: BY TYCO ELECTRONICS R E L E A S E D FOR P U B L I C A T I O N FREI F U E R VE R O E F F E M T L I CHUNG CORPORATION. ALL RIGHTS RESERVED. Al I F R F C H T F V O R R F H A I T F N I9 - MAT ED W I T H : P A S S E N D ZU: LOC A 37+0.0 5 1 REV S IONS D 1S T AENDERUNGEN


    OCR Scan     		EG00-2749-00 06DEC2000 27MAR200 NOV200 108-18214 PDF

    84-1lmis

    Abstract: mold compound AND S6300H bond 84-1-lmis-r4
    Text: ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-05457XXXEAK Effective : 06-DEC-2000 09:18:54 Package : EAK 14 LEAD PDIP Metal ID : Issue : 7 Status : RELEASED Scale : 20X Printed : 09-APR-2001 09:16:04 EST PLASTIC_PKG Data as of 09-APR-2001 09:16:05 by sherpa at farview


    Original     		ADD-05457XXXEAK 06-DEC-2000 09-APR-2001 84-1LMISR4 S6300H R004-0003 84-1lmis mold compound AND S6300H bond 84-1-lmis-r4 PDF