STLC4560
Abstract: JESD97 STLC4560TRAY wireless switch diagram
Text: 34 .80 7IRELESS IMPORTANT NOTICE Dear customer, As from August 2nd 2008, the wireless operations of STMicroelectronics have moved to a new company, ST-NXP Wireless. As a result, the following changes are applicable to the attached document. ● Company name - STMicroelectronics NV is replaced with ST-NXP Wireless.
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JESD97
Abstract: STLC4560 STLC4560TRAY
Text: STLC4560 Single chip 802.11b/g WLAN radio Data Brief Features • Extremely small footprint ■ Ultra low power consumption ■ Fully compliant with the IEEE 802.11b and 802.11g WLAN standards ■ Support for 54, 48, 36, 24, 18, 12, 9, and 6 Mbit/s OFDM, 11 and 5.5 Mbit/s CCK and
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STLC4560
11b/g
LFBGA240
STLC4560
JESD97
STLC4560TRAY
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1-406541-1
Abstract: No abstract text available
Text: 6 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 4 2 3 RELEASED FOR PUBLICATION LOC ALL RIGHTS RESERVED. By - REVISIONS DIST 00 AA LTR M9 DESCRIPTION ECR— 1 2 —0061 22 DATE DWN APVD 28M AR12 JJ AC M A T E R IA L : HOUSING - HIGH TEMPERATURE THERMOPLASTIC,
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27/xm
03//m
09JAN2008
1-406541-1
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Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 4 6 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST AA 00 REVISIONS LTR DESCRIPTION M1 A REV PER E C R - 0 8 - 0 1 1569 DATE DWN APVD 1 2JA N 2009 DZ SY M A T E R IA L : HOUSING - HIGH TEMPERATURE THERMOPLASTIC,
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27/xm
31MAR2000
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Untitled
Abstract: No abstract text available
Text: 6 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 4 2 3 RELEASED FOR PUBLICATION By - REVISIONS DIST LOC ALL RIGHTS RESERVED. 00 AA LTR M8 DESCRIPTION REVISED PER DATE 24M AR1' ECO-11-005033 APVD DWN RK HMR MATERIAL: HOUSING - HIGH TEMPERATURE THERMOPLASTIC,
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24MAR11
09JAN2008
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