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    ixp435

    Abstract: Si3050-FT KENDIN KSZ8995M PNX1702EH/G rt9214 PC28F128J3D PNX1702 TM3260 SI3201-FS IXDP465
    Text: Intel IXP435 Multi-Service Residential Gateway Reference Platform User’s Guide June 2007 Document Number: 316848; Revision: 001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


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    IXP435 001US 0x50000000 0x00080000 0x00000000 0x50800000 Si3050-FT KENDIN KSZ8995M PNX1702EH/G rt9214 PC28F128J3D PNX1702 TM3260 SI3201-FS IXDP465 PDF

    XC7K325TFFG900-2

    Abstract: XC7K325TFFG900 PC28F00AP30TF XC7K325T-ffg900 pc28f00ap30 adv7511 pcie microblaze RS232-UART pc28f00 DSP48E1s
    Text: 29 AXI Interface Based KC705 Embedded Kit MicroBlaze Processor Subsystem Data Sheet DS669 v1.1 November 2, 2012 Product Specification Introduction The KC705 Embedded Kit MicroBlaze Processor Subsystem showcases various features of the KC705 evaluation board.


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    KC705 DS669 XC7K325TFFG900-2 XC7K325TFFG900 PC28F00AP30TF XC7K325T-ffg900 pc28f00ap30 adv7511 pcie microblaze RS232-UART pc28f00 DSP48E1s PDF

    powerpc 405

    Abstract: CHN 628 marking code H5C SMD Transistor mac 7a8 transistor PowerISA 203
    Text: MPC5744P Reference Manual Document Number: MPC5744PRM Rev. 2, 06/2013 Preliminary MPC5744P Reference Manual, Rev. 2, 06/2013 2 Preliminary Freescale Semiconductor, Inc. Contents Section number Title Page Chapter 1 Preface 1.1


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    MPC5744P MPC5744PRM powerpc 405 CHN 628 marking code H5C SMD Transistor mac 7a8 transistor PowerISA 203 PDF

    W25Q64

    Abstract: WINBOND W25q64 winbond 25q64bv 25q64 25q64bv w25Q64BV sp605 winbond* W25Q w25q64 datasheet W25Q
    Text: Application Note: Spartan-6 FPGAs Embedded Platform Software and Hardware In-the-Field Upgrade Using Linux XAPP1146 v1.0 May 5, 2010 Author: Brian Hill Summary This application note describes an in-the-field upgrade of the Spartan -6 FPGA bitstream, Linux kernel, and loader flash images, using the presently running Linux kernel. Upgrade files


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    XAPP1146 SP605 W25Q64 WINBOND W25q64 winbond 25q64bv 25q64 25q64bv w25Q64BV winbond* W25Q w25q64 datasheet W25Q PDF

    XC7K325TFFG900

    Abstract: XC7K325TFFG900-2 kintex7 XC7K325TFFG900 -2
    Text: 28 AXI Interface Based KC705 Embedded Kit MicroBlaze Processor Subsystem Data Sheet DS669 v2.0 April 23, 2013 Product Specification Introduction The KC705 Embedded Kit MicroBlaze Processor Subsystem showcases various features of the KC705 evaluation board.


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    KC705 DS669 KC705 XC7K325TFFG900 XC7K325TFFG900-2 kintex7 XC7K325TFFG900 -2 PDF