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    11SMN Search Results

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    SCANSTA111SM/NOPB Texas Instruments Enhanced SCAN Bridge Multidrop Addressable IEEE 1149.1 (JTAG) Port 49-NFBGA -40 to 85 Visit Texas Instruments Buy
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    11SMN Price and Stock

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    Rochester Electronics LLC NB4N11SMNG

    IC TRANSLTR UNIDIRECTIONAL 16QFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey NB4N11SMNG Tube 30,156 60
    • 1 -
    • 10 -
    • 100 $5.05
    • 1000 $5.05
    • 10000 $5.05
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    Rochester Electronics LLC NB4N11SMNR2G

    IC TRANSLTR UNIDIRECTIONAL 16QFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey NB4N11SMNR2G Bulk 5,721 60
    • 1 -
    • 10 -
    • 100 $5.05
    • 1000 $5.05
    • 10000 $5.05
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    onsemi NB6L11SMNR2G

    IC CLK BUFFER 1:2 2GHZ 16QFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey NB6L11SMNR2G Cut Tape 1,092 1
    • 1 $12.58
    • 10 $8.665
    • 100 $6.4917
    • 1000 $6.22536
    • 10000 $6.22536
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    NB6L11SMNR2G Digi-Reel 1,092 1
    • 1 $12.58
    • 10 $8.665
    • 100 $6.4917
    • 1000 $6.22536
    • 10000 $6.22536
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    NB6L11SMNR2G Reel 3,000
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    • 10000 $6.22537
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    Avnet Americas NB6L11SMNR2G Reel 18 Weeks 3,000
    • 1 -
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    • 10000 $6.14852
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    Mouser Electronics NB6L11SMNR2G 1,650
    • 1 $12.58
    • 10 $8.67
    • 100 $6.5
    • 1000 $6.23
    • 10000 $6.22
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    Newark NB6L11SMNR2G Reel 3,000
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    • 1000 -
    • 10000 $5.93
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    Bristol Electronics NB6L11SMNR2G 3,000
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    Avnet Silica NB6L11SMNR2G 19 Weeks 3,000
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    EBV Elektronik NB6L11SMNR2G 20 Weeks 3,000
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    Flip Electronics NB6L11SMNR2G 12,000
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    IBS Electronics NB6L11SMNR2G 3,000
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    • 10000 $7.3682
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    Rochester Electronics LLC SCANSTA111SM-NS

    MICROPROCESSOR CIRCUIT, CMOS, PB
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SCANSTA111SM-NS Bulk 503 28
    • 1 -
    • 10 -
    • 100 $11.06
    • 1000 $11.06
    • 10000 $11.06
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    onsemi NB6L11SMNG

    IC CLK BUFFER 1:2 2GHZ 16QFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey NB6L11SMNG Tube 434 1
    • 1 $12.78
    • 10 $8.809
    • 100 $7.7756
    • 1000 $6.3555
    • 10000 $6.3555
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    Avnet Americas NB6L11SMNG Tube 38 18 Weeks 123
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    NB6L11SMNG Tube 0 Weeks, 2 Days 140
    • 1 -
    • 10 -
    • 100 -
    • 1000 $5.82646
    • 10000 $5.7855
    		Buy Now
    Mouser Electronics NB6L11SMNG 1,173
    • 1 $12.78
    • 10 $8.81
    • 100 $6.47
    • 1000 $6.35
    • 10000 $6.35
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    Newark NB6L11SMNG Bulk 39 1
    • 1 $13.29
    • 10 $9.16
    • 100 $7.18
    • 1000 $6.61
    • 10000 $6.61
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    NB6L11SMNG Bulk 123
    • 1 -
    • 10 -
    • 100 $9.1
    • 1000 $8.28
    • 10000 $8.28
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    RS NB6L11SMNG Bulk 2
    • 1 -
    • 10 $13.7
    • 100 $12.26
    • 1000 $12.26
    • 10000 $12.26
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    TME NB6L11SMNG 1
    • 1 $9.61
    • 10 $9.61
    • 100 $7.36
    • 1000 $6.77
    • 10000 $6.22
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    Avnet Silica NB6L11SMNG 19 Weeks 123
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    EBV Elektronik NB6L11SMNG 20 Weeks 123
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    Flip Electronics NB6L11SMNG 1,968
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    IBS Electronics NB6L11SMNG 123
    • 1 -
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    • 1000 $8.2593
    • 10000 $8.2593
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    Vyrian NB6L11SMNG 130
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    Win Source Electronics NB6L11SMNG 268
    • 1 -
    • 10 $11.112
    • 100 $9.028
    • 1000 $9.028
    • 10000 $9.028
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    Find more 11SMN price and stock on Findchips.com

    11SMN Datasheets Context Search

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    PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: 971160151 971160151 Material: 11SMn Pb30 STEEL SPACER, external/internal L = 16.0mm l3 = 6.0mm G1,G2 = M2,5 l2 = 7.0mm SW5 Surface: zinc plated Drawn Mark Wirth 2009-12-09 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400


    Original     		11SMn PDF

    Untitled

    Abstract: No abstract text available
    Text: 971080151 971080151 Material: 11SMn Pb30 STEEL SPACER, external/internal L = 8.0mm l3 = 6.0mm G1,G2 = M2,5 l2 = 5.5mm SW5 Surface: zinc plated Drawn Mark Wirth 2009-12-09 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400


    Original     		11SMn PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: 970230321 L [mm] C [mm] M SW 23.0 7.0 M3 5.5 Material: 11SMnPb30 1.0718 970230321 Surface: zinc-plated (A3F) STEEL SPACER internal/internal Drawn Mark Wirth 2012-11-22 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400


    Original     		11SMnPb30 PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF

    Untitled

    Abstract: No abstract text available
    Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original     		11SMnPB30 2768m PDF