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    rabbit processor 4000

    Abstract: rabbit processor 3000 CMOS 4000 rabbit assembly source code rabbit 4000 optical quadrature encoder 32bit optical quadrature decoder 32bit
    Text: Rabbit 4000 Microprocessor MODEL | 4000 | Key Features Key Features ƒ Up to 60 MHz ƒ Powerful Rabbit 3000 ƒ Integrated 10Base-T Ethernet microprocessor @ 22.1 MHz ƒƒ ƒ ƒ ƒ 10/100Base-T Ethernet Eight independent DMA channels Low-Power Supports 8 or 16 – bit Flash and


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    PDF 10Base-T 10/100Base-T 32-bit 24-bit 8/16-bit 10-bit 16-bit rabbit processor 4000 rabbit processor 3000 CMOS 4000 rabbit assembly source code rabbit 4000 optical quadrature encoder 32bit optical quadrature decoder 32bit

    IS43DR83200A

    Abstract: IS43DR16160A-3DBLI datasheet IS43DR16160A-37CBLI IS43DR83200A-37CBLI IS43DR32160A DDR2 x32
    Text: IS43DR83200A IS43/46DR16160A, IS43DR32160A 32Mx8, 16Mx16, 16Mx32 stacked die DDR2 DRAM FEATURES • Vdd = 1.8V ±0.1V, Vddq = 1.8V ±0.1V • JEDEC standard 1.8V I/O (SSTL_18-compatible) • Double data rate interface: two data transfers per clock cycle


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    PDF IS43DR83200A IS43/46DR16160A, IS43DR32160A 32Mx8, 16Mx16, 16Mx32 18-compatible) IS43DR32160A-37CBLI 400Mhz IS43DR32160A-5BBLI IS43DR83200A IS43DR16160A-3DBLI datasheet IS43DR16160A-37CBLI IS43DR83200A-37CBLI IS43DR32160A DDR2 x32

    S30MS-P

    Abstract: AMB128 S29WS-P S75WS256PEFJF5 S75WS256PEFKFF S75WS-P UtRAM Density Spansion NAND Flash DIE MS512P
    Text: S75WS-P based MCP/POP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash NOR Interface S30MS-P (NAND Interface) ORNAND Flash pSRAM Type 2 S75WS-P based MCP/POP Products Cover Sheet Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion


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    PDF S75WS-P S30MS-P S30MS-P AMB128 S29WS-P S75WS256PEFJF5 S75WS256PEFKFF UtRAM Density Spansion NAND Flash DIE MS512P

    BU-6474XB

    Abstract: BU-64840R3 BU-64860B3
    Text: Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


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    PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 BU-6474XB BU-64840R3 BU-64860B3

    Micro-ACE-TE

    Abstract: No abstract text available
    Text: Micro-ACE , Micro-ACE-TE, and PCI Micro-ACE-TE Product Brief Models: BU-6474XB, BU-6484/6486/6586XB, BU-61740/61840/61860B3 DDC's Micro-ACE series of MIL-STD-1553 terminals with 1553 protocol, memory, and either +3.3V or +5V transceiver, in a small plastic BGA. This series is ideal for use in mixed voltage applications where PC board space is limited.


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    PDF BU-6474XB, BU-6484/6486/6586XB, BU-61740/61840/61860B3 MIL-STD-1553 MIL-STD-1760 128-ball 324-ball AS9100 Micro-ACE-TE

    block diagram of energy saving system

    Abstract: JA108 java ubga 7x7 Nazomi Communications
    Text: JA108 – Universal Java Accelerator Product Brief Introduction The JA108 Java accelerator chip targets mobile wireless applications, such as 2G/2.5G/3G phones, and it improves Java software execution while extending battery life. The JA108 is the first in a


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    PDF JA108 JA108 block diagram of energy saving system java ubga 7x7 Nazomi Communications

    DZ2J

    Abstract: PDCR 940 rabbit 5000 Transistor 5C5 HD64180 NC7SP14 SN74AHC1GU04 TN303 Z180
    Text: Rabbit 3000 Microprocessor User’s Manual 019–0108T Rabbit 3000 Microprocessor User’s Manual Part Number 019-0108T • Printed in U.S.A. 2002–2009 Digi International Inc. • All rights reserved. Digi International reserves the right to make changes and


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    PDF 0108T 019-0108T DZ2J PDCR 940 rabbit 5000 Transistor 5C5 HD64180 NC7SP14 SN74AHC1GU04 TN303 Z180

    BU-61843

    Abstract: No abstract text available
    Text: Make sure the next Card you purchase has. BU-6174X/6184X/6186X ENHANCED MINIATURE ADVANCED COMMUNICATIONS ENGINE [ENHANCED MINI-ACE/µ-ACE MICRO-ACE ] FEATURES • Fully Integrated 1553A/B Notice 2, McAir, STANAG 3838 Interface Terminal • Compatible with Mini-ACE (Plus)


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    PDF BU-6174X/6184X/6186X 553A/B MIL-STD-1553 bu482 1-800-DDC-5757 A5976 G1-01/02-0 BU-61843

    BU-61843

    Abstract: No abstract text available
    Text: Make sure the next Card you purchase has. BU-6174X/6184X/6186X ENHANCED MINIATURE ADVANCED COMMUNICATIONS ENGINE [ENHANCED MINI-ACE/µ-ACE MICRO-ACE ] FEATURES • Fully Integrated 1553A/B Notice 2, McAir, STANAG 3838 Interface Terminal • Compatible with Mini-ACE (Plus)


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    PDF BU-6174X/6184X/6186X 553A/B MIL-STD-1553 bu16-2482 1-800-DDC-5757 A5976 M-12/04-0 BU-61843

    dss-1005 bu6484

    Abstract: dss-1003 bu64863
    Text: Make sure the next Card you purchase has. BU-6474X/6484X/6486X Mini-ACE Mark3/Micro-ACE®*-TE ® FEATURES • Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal • World’s First all 3.3 Volt Terminal • Transceiver Power-Down Options • World’s Smallest CQFP MIL-STD-1553


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    PDF BU-6474X/6484X/6486X MIL-STD-1553 80-pin 324-Ball MIL-STD1553 1-800-DDC-5757 A5976 N-10/07-0 dss-1005 bu6484 dss-1003 bu64863

    BU-61860B

    Abstract: BU-61843 bu 61865 BU-61743
    Text: Make sure the next Card you purchase has. BU-6174X/6184X/6186X ENHANCED MINIATURE ADVANCED COMMUNICATIONS ENGINE [ENHANCED MINI-ACE /µ-ACE MICRO-ACE® ] ® FEATURES • Fully Integrated 1553A/B Notice 2, McAir, STANAG 3838 Interface Terminal • Compatible with Mini-ACE (Plus)


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    PDF BU-6174X/6184X/6186X 553A/B MIL-STD-1553 1553ion 1-800-DDC-5757 A5976 BU-61860B BU-61843 bu 61865 BU-61743

    STANAG 3838

    Abstract: BU-61740B3
    Text: www.ddc-web.com TM µ-ACE Micro-ACE MODEL: BU-61740B3/61840B3/61860B3 FEATURES • • • • • .80 X .80 inches Industry's Smallest 1553 Terminal 128-Ball Plastic BGA Package 0.140 inch Max Height Enhanced Mini-ACE Architecture Multiple Configurations:


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    PDF BU-61740B3/61840B3/61860B3 128-Ball 553A/B A5976 1-800-DDC-5757 STANAG 3838 BU-61740B3

    BU-64863B

    Abstract: bu64863 BU-64840B3-E02 DSS-3330 mark s07 BU-61860 BU-64863E8
    Text: Make sure the next Card you purchase has. BU-6474X/6484X/6486X MINI-ACE MARK3/MICRO-ACE®*-TE ® FEATURES • Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal • World’s First all 3.3 Volt Terminal • Transceiver Power-Down Options • World’s Smallest CQFP MIL-STD-1553


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    PDF BU-6474X/6484X/6486X MIL-STD-1553 80-pin 324-Ball J-STD-020 BU-64XXXXC/D) BU-64863B bu64863 BU-64840B3-E02 DSS-3330 mark s07 BU-61860 BU-64863E8

    S72NS128RD0AHBL

    Abstract: 2118 FAMILY DRAM block diagram 2118 FAMILY DRAM S29NS-R S72NS512RD0 S72NS512RE0 S72NS128RD0AHBL0
    Text: S72NS-R Based MCPs MirrorBit Flash Memory and DRAM 128/256/512 Mb 8/16/32 M x 16 bit , 1.8 Volt-only, Multiplexed Simultaneous Read/Write, Burst Mode Flash Memory 128/256 Mb (8/16 M x 16 bit) DDR DRAM on Split Bus S72NS-R Based MCPs Cover Sheet Data Sheet (Advance Information)


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    PDF S72NS-R S72NS128RD0AHBL 2118 FAMILY DRAM block diagram 2118 FAMILY DRAM S29NS-R S72NS512RD0 S72NS512RE0 S72NS128RD0AHBL0

    SA266-4

    Abstract: S71WS128JB0 S71WS128JC0 S71WS256JC0 S71WS-J FBGA 12x12 TRAY
    Text: S71WS-J Based MCPs Stacked Multi-Chip Product MCP Package-on-Package (PoP) 128/64 Megabit (8M/4M x 16-bit) CMOS 1.8 Volt-only, Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM ADVANCE INFORMATION Data Sheet Notice to Readers: The Advance Information status indicates that this


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    PDF S71WS-J 16-bit) SA266-4 S71WS128JB0 S71WS128JC0 S71WS256JC0 FBGA 12x12 TRAY

    ball 128 mcp

    Abstract: MCP NAND, DRAM, NOR LJ512 S29NS-P S72NS128PD0 S72NS256PD0 S72NS512PD0 S72NS-P MCP NAND D3-D16
    Text: S72NS-P MCP/PoP Memory System Solutions MirrorBit Flash Memory and DRAM 128/256/512 Mb 8/16/32 M x 16 bit , 1.8 Volt-only, Multiplexed Simultaneous Read/Write, Burst Mode Flash Memory 128/256 Mb (8/16 M x 16 bit) DDR DRAM on Split Bus S72NS-P MCP/PoP Memory System Solutions Cover Sheet


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    PDF S72NS-P ball 128 mcp MCP NAND, DRAM, NOR LJ512 S29NS-P S72NS128PD0 S72NS256PD0 S72NS512PD0 MCP NAND D3-D16

    Untitled

    Abstract: No abstract text available
    Text: IS43/46DR32160C 16Mx32 512Mb DDR2 DRAM FEATURES ADVANCED INFORMATION OCTOBER 2010 DESCRIPTION • Vdd = 1.8V ±0.1V, Vddq = 1.8V ±0.1V • JEDEC standard 1.8V I/O SSTL_18-compatible • Double data rate interface: two data transfers per clock cycle • Differential data strobe (DQS, DQS)


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    PDF IS43/46DR32160C 16Mx32 512Mb 18-compatible) -40oC DDR2-400B IS46DR32160C-5BBLA1

    DDR2 x32

    Abstract: K4T1G313QI-MCE7
    Text: DDR2 SDRAM K4T1G313QI 1Gb x32 I-die DDR2 SDRAM Specification 128FBGA with Lead-Free & Halogen-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE


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    PDF K4T1G313QI 128FBGA DDR2 x32 K4T1G313QI-MCE7

    Sync generator VGA

    Abstract: AD9928 transistor h1a "bias control" ldo ldo image timing generator sync AD9920A AD9990 rgb 18 bit to lvds AD9920
    Text: Dual-Channel, 14-Bit CCD Signal Processor with V-Driver and Precision Timing Generator AD9928 FEATURES GENERAL DESCRIPTION Registers similar to AD9920A and AD9990 Timing generator with 18-channel V-driver Serial data output with reduced range LVDS interface


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    PDF 14-Bit AD9928 AD9920A AD9990 18-channel 10-bit 14-bit, D08261F-0-6/10 Sync generator VGA AD9928 transistor h1a "bias control" ldo ldo image timing generator sync AD9990 rgb 18 bit to lvds AD9920

    MX29GL256

    Abstract: 28F512P30 Numonyx M29W256G 28F00AP30 w25q128 MX25L6445 28F00AM29EW M29DW127G 28F128P30 PF38F3040M0Y3D
    Text: Spansion NOR Flash Memory Competitive Cross Reference Guide December 2009 Parallel 1.8V Density Voltage Bus Mb (V) VIO (V) Type Bus Sector Width Type # Initial Access Burst Speed Banks Times (ns) (MHz) Packages Temp Range Recommended Pin Software Spansion OPN Compatible Compatible Notes


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    PDF AT49SV163D 48-Pin 48-Ball S29AS016J EN29SL800 S29AS00gest MX29GL256 28F512P30 Numonyx M29W256G 28F00AP30 w25q128 MX25L6445 28F00AM29EW M29DW127G 28F128P30 PF38F3040M0Y3D

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET 512M bits DDR2 SDRAM EDE5132AABG-1 16M words x 32 bits, 1066Mbps Specifications Features • Density: 512M bits • Organization  4M words × 32 bits × 4 banks • Package  128-ball FBGA  Lead-free (RoHS compliant) and Halogen-free


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    PDF EDE5132AABG-1 1066Mbps) 128-ball 1066Mbps M01E0706 E1067E10

    DDR2-667

    Abstract: DDR2-800
    Text: PRELIMINARY DATA SHEET 512M bits DDR2 SDRAM EDE5132AABG 16M words x 32 bits Specifications Features • Density: 512M bits • Organization  4M words × 32 bits × 4 banks • Package  128-ball FBGA  Lead-free (RoHS compliant) and Halogen-free


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    PDF EDE5132AABG 128-ball 800Mbps/667Mbps M01E0706 E1115E40 DDR2-667 DDR2-800

    AT76C505

    Abstract: No abstract text available
    Text: Features • • • • • • • • • • • • • • • • • • • • • IEEE 802.11b MAC and Baseband for Supporting Standard Rates Up to 11 Mbps Wireless Interface Following the IEEE 802.11b Standard Wireless LAN MAC Unit with ARM7TDMI RISC Processor


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    PDF 128-byte AT76C505 2364CS

    Untitled

    Abstract: No abstract text available
    Text: Make sure the next Card you purchase has. BU-6474X/6484X/6486X MINI-ACE MARK3/MICRO-ACE®*-TE TM ® FEATURES • Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal • World’s First all 3.3 Volt Terminal • Transceiver Power-Down Options • World’s Smallest CQFP MIL-STD-1553


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    PDF BU-6474X/6484X/6486X MIL-STD-1553 80-pin 324-Ball BU-64840B3-E02â BU-64840B 3-E02. MIL-STD-1553