QFP128-P-2828-0
Abstract: QFP128 QFP-128 128P6
Text: 128P6-C Plastic 128pin 28✕28mm body QFP EIAJ Package Code QFP128-P-2828-0.80 Weight g 4.49 JEDEC Code – Lead Material Alloy 42 MD e HD D b2 ME 97 128 1 96 I2 Symbol HE E Recommended Mount Pad 65 32 33 64 A c A2 L1 y F b A1 e L Detail F A A1 A2 b c D E
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128P6-C
128pin
QFP128-P-2828-0
QFP128
QFP-128
128P6
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LQFP128
Abstract: LQFP128-P-1420-0
Text: 128P6D-D Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g MD e JEDEC Code – Lead Material Cu Alloy HD 128 102 b2 103 ME D 1 l2 Symbol HE E Recommended Mount Pad 38 65 64 39 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E
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128P6D-D
128pin
LQFP128-P-1420-0
LQFP128
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LQFP128
Abstract: P-LQFP-128 PLQP0128KB-A ZD 103 128P6Q-A PACKAGE LQFP128
Text: JEITA Package Code P-LQFP128-14x20-0.50 RENESAS Code PLQP0128KB-A Previous Code 128P6Q-A MASS[Typ.] 0.9g HD *1 D 102 65 103 64 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. bp E c *2 HE c1 b1 Reference
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P-LQFP128-14x20-0
PLQP0128KB-A
128P6Q-A
LQFP128
P-LQFP-128
PLQP0128KB-A
ZD 103
128P6Q-A
PACKAGE LQFP128
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128P6
Abstract: QFP128 QFP128-P-2828-0
Text: 128P6-A Plastic 128pin 28✕28mm body QFP EIAJ Package Code QFP128-P-2828-0.80 Weight g 4.49 JEDEC Code – Lead Material Alloy 42 MD e HD D ME 97 b2 128 1 96 I2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 65 32 33 64 A c A2 L1 y F b
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128P6-A
128pin
QFP128-P-2828-0
128P6
QFP128
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LQFP Package 128-pin
Abstract: NQPACK128RD 128-PIN HQPACK128RD M3T-F160-128NRD YQPACK128RD 128P6Q-A
Text: M3T-F160-128NRD Converter for Connecting 160-core Flexible Board FLX160 to 128-pin 0.5mm-pitch LQFP External View and Dimensions Function The M3T-F160-128NRD is a converter for connecting the FLX160 160-core flexible board to a foot pattern of a 128-pin 0.5mm-pitch LQFP 128P6Q-A . This converter can be used
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M3T-F160-128NRD
160-core
FLX160
128-pin
M3T-F160-128NRD
128P6Q-A)
NQPACK128RD
LQFP Package 128-pin
128-PIN
HQPACK128RD
YQPACK128RD
128P6Q-A
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LQFP128
Abstract: LQFP128-P-1420-0 128P6D-A D1102
Text: 128P6D-A Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g 0.85 Lead Material Alloy 42 MD e JEDEC Code – HD 103 b2 128 ME D 1 102 I2 E HE Recommended Mount Pad Symbol 65 38 39 64 L1 A F A1 c A2 e b y L Detail F A A1 A2 b
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128P6D-A
128pin
LQFP128-P-1420-0
LQFP128
128P6D-A
D1102
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LQFP128
Abstract: LQFP128-P-1420-0
Text: 128P6D-C Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD b2 128 103 1 ME D 102 l2 HE D Recommended Mount Pad Symbol 65 38 39 64 A L1 F b A1 c A2 e y L Detail F A A1 A2 b c D E
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128P6D-C
128pin
LQFP128-P-1420-0
LQFP128
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M3062
Abstract: TA2140 csc 2313 m3062lfgpgp u3
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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M16C/62P
M16C/62P,
M16C/62PT)
REJ09B0185-0241
M3062
TA2140
csc 2313
m3062lfgpgp u3
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7335B
Abstract: NQPACK128RD
Text: M3T-F160-128NRD Converter Board for Connecting FLX160 to 128-pin 0.5-mm-pitch LQFP User's Manual Keep safety first in your circuit designs! • Renesas Technology Corporation and Renesas Solutions Corporation put the maximum effort into making semiconductor products better and more
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M3T-F160-128NRD
FLX160
128-pin
mat100
7335B
NQPACK128RD
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Untitled
Abstract: No abstract text available
Text: Datasheet M16C/65C Group RENESAS MCU 1. R01DS0015EJ0100 Rev.1.00 Feb 07, 2011 Overview 1.1 Features The M16C/65C Group microcomputer MCU incorporates the M16C/60 Series CPU core and flash memory, employing sophisticated instructions for a high level of efficiency. This MCU has 1 MB of address
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M16C/65C
R01DS0015EJ0100
M16C/60
in9044
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R5F3650NNFB
Abstract: R5F3650NDFA 13000H cec p77
Text: Datasheet M16C/65 Group RENESAS MCU 1. R01DS0031EJ0200 Rev.2.00 Feb 07, 2011 Overview 1.1 Features The M16C/65 Group microcomputer MCU incorporates the M16C/60 Series CPU core and flash memory, employing sophisticated instructions for a high level of efficiency. This MCU has 1 MB of address
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M16C/65
R01DS0031EJ0200
M16C/60
R5F3650NNFB
R5F3650NDFA
13000H
cec p77
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M30622MEP-XXXGP
Abstract: M30620FCPFP M30622F8PGP M30622F8PFP
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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PC14
Abstract: 2ah 2037 philips ak 141-15
Text: REJ09B0126-0101Z M16C/6N Group 16 M16C/6NL, M16C/6NN Hardware Manual RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / M16C/60 SERIES Before using this material, please visit our website to verify that this is the most updated document available. Rev. 1.01
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REJ09B0126-0101Z
M16C/6N
M16C/6NL,
M16C/6NN)
16-BIT
M16C/60
PC14
2ah 2037
philips ak 141-15
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100P6S-A
Abstract: LQFP100-P-1414-0 LQFP128-P-1420-0 QFP100-P-1420-0 128P6Q-A
Text: Renesas microcomputers M16C / 62P Group Package Dimensions SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Package Dimensions MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code –
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16-BIT
100P6S-A
QFP100-P-1420-0
100pin
1420mm
LQFP100-P-1414-0
1414mm
100P6Q-A
128pin
100P6S-A
LQFP128-P-1420-0
128P6Q-A
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432W6
Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P
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240K6X-A
240P6Y-A
240P6Z-A
255F7F
256F7B
256F7X-A/B
256P6J-E
256P6K-E
272F7X-A/B
281S8-C
432W6
48P4B
hssop
44P3W-R
28P0
5P5T
tsop 2-54
42P9R
70P3S-M
479F7G
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M30622F8PGP
Abstract: M16C/62P M30622F8PFP M16C M30626FHPFP hardware manual op amp marking P3 M30622M6P-XXXFP M30622M6P-XXXGP M30622M8P-XXXFP M30622M8P-XXXGP M30623M6P-XXXGP
Text: M16C/62P Group M16C/62P, M16C/62PT SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0001-0230Z Rev.2.30 Sep 01, 2004 1. Overview The M16C/62P Group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the highperformance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin,
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M16C/62P
M16C/62P,
M16C/62PT)
16-BIT
REJ03B0001-0230Z
M16C/60
80-pin,
M30622F8PGP
M30622F8PFP
M16C M30626FHPFP hardware manual
op amp marking P3
M30622M6P-XXXFP
M30622M6P-XXXGP
M30622M8P-XXXFP
M30622M8P-XXXGP
M30623M6P-XXXGP
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X00000002
Abstract: CM211
Text: REJ09B0016-0110Z 16 M16C/62 Group M16C/62P Hardware Manual RENESAS 16-BIT CMOS SINGLE-CHIP MICROCOMPUTER M16C FAMILY / M16C/60 SERIES Before using this material, please visit the our website to confirm that this is the most current document available. Rev. 1.10
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REJ09B0016-0110Z
M16C/62
M16C/62P)
16-BIT
M16C/60
X00000002
CM211
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M30622F8PGP
Abstract: M30622MEP-XXXGP M30622F8PFP M30620FCPFP
Text: M16C/62 Group M16C/62P, M16C/62PT SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0001-0200Z Rev.2.00 Oct. 29, 2003 1. Overview The M16C/62 group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin,
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M16C/62
M16C/62P,
M16C/62PT)
16-BIT
REJ03B0001-0200Z
M16C/60
80-pin,
M30622F8PGP
M30622MEP-XXXGP
M30622F8PFP
M30620FCPFP
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DIN 41612 connector 24 pin
Abstract: 107109
Text: DIN SPECIFICATIONS Series DIN 41612 Style 6033 6043 B&C Q&R GENERAL No. of Contacts 32,48,64,96 20,32,48,96 Temperature Range -60°C to +140°C -65°C to +140°C ELECTRICAL DATA Current Rating 1 Amp @ 70°C 1 Amp @ 70°C Contact Resistance 20 Milliohms Max
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96P604307310
48P604307310
32P604307310
20P604307310
120P604307310
150P604307310
704396P
704348P
DIN 41612 connector 24 pin
107109
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42P-6063-0731-0
Abstract: dacron
Text: DIN SPECIFICATIONS Series DIN 41612 Style 6033 6043 B&C Q&R GENERAL No. of Contacts 32,48,64,96 20,32,48,96 Temperature Range -60°C to +140°C -65°C to +140°C ELECTRICAL DATA Current Rating 1 Amp @ 70°C 1 Amp @ 70°C Contact Resistance 20 Milliohms Max
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01S6063
42P-6063-0731-0
dacron
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SRF 7016
Abstract: M30624FGPFP M30624FGPGP 100P6S-A 10MHZ 24MHZ TA40 8259ER SIM 300 AT COMMANDS
Text: er nt Preliminary Specifications Rev.1.0 Und opme l e v e Specifications in this manual are tentative and subject to change. d Overview Mitsubishi microcomputers M16C / 62P Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Overview The M16C/62P group of single-chip microcomputers are built using the high-performance silicon gate
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16-BIT
M16C/62P
M16C/60
100-pin
128-pin
M16C/62
M16C/62P)
SRF 7016
M30624FGPFP
M30624FGPGP
100P6S-A
10MHZ
24MHZ
TA40
8259ER
SIM 300 AT COMMANDS
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100MHZ
Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,
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136P6S-C
100P6S-C
80P6N-C
208P6Y-A
64P6N-B
160P6E-A
44P6N-B
100MHZ
IC PACKAGE ELECTRICAL CHARACTERISTIC LCR
24p2n-a
136P6S-C
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ic tlp 759
Abstract: SL-BC050515TJ-1 JHB-TQ121214-M L196-49 L196-65A PTB54C SL-BG060615TJ-2 SL-BG060615TJ-1 ST-TQ070710TJ-1 PVQN0020KB-A
Text: Unit:mm The pin1 is located in the hatching portion Note : Numbers in parentheses are the numbers of Ics contained in five trays per inner box, and those without parentheses are the numbers of Ics contained in eight or nine trays per inner box.
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PVQN0020KB-A
PVQN0052KA-A
PVQN0064LB-A
PVQN0032KA-A
PVQN0032KB-A
PVQN0068KA-A
PVQN0048KA-A
PVQN0052LE-A
PVQN0036KA-A
JHB-PBG3131173
ic tlp 759
SL-BC050515TJ-1
JHB-TQ121214-M
L196-49
L196-65A
PTB54C
SL-BG060615TJ-2
SL-BG060615TJ-1
ST-TQ070710TJ-1
PVQN0020KB-A
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R5F72543
Abstract: r5f61725 SH7724 R5F2136Can R5F72543RKBGV R5F35L83 R8A77240D500BG 2332 prom R5F70834AD80FTV R5F70835
Text: Renesas MPU & MCU General Catalog 2009.10 2009.10 Renesas MPU & MCU General Catalog Renesas MPU & MCU General Catalog RJJ01B0001-1200 2009. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon 11.1 Renesas Technology www.renesas.com
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RJJ01B0001-1200
REJ01B0008-1200
R5F72543
r5f61725
SH7724
R5F2136Can
R5F72543RKBGV
R5F35L83
R8A77240D500BG
2332 prom
R5F70834AD80FTV
R5F70835
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