132-PIN CERAMIC PIN GRID ARRAY CPGA Search Results
132-PIN CERAMIC PIN GRID ARRAY CPGA Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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MG80C186-12/BZC |
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Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. | |||
MC68040RC33A |
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Rochester Manufactured 68040, RISC 32-bit Microprocessor 33MHz, 179 CPGA Package, Commercial Temp spec. | |||
MG80C186-12/BZA |
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Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. | |||
TA80C186XL-20 |
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Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Industrial Temp spec. | |||
MG80C186-10/BZA |
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Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. |
132-PIN CERAMIC PIN GRID ARRAY CPGA Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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transistor K 1413
Abstract: k 1413 CPGA132 transistor a 1413 CPGA sot771 D 1413 transistor K 3531 ceramic pin grid array package
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OT771-1 CPGA132: transistor K 1413 k 1413 CPGA132 transistor a 1413 CPGA sot771 D 1413 transistor K 3531 ceramic pin grid array package | |
CERAMIC PIN GRID ARRAY 120 pins
Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
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MS101111 UA65A CERAMIC PIN GRID ARRAY 120 pins 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A | |
Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
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and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13 | |
CERAMIC CHIP CARRIER LCC 68 socket
Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
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88 lead cpga
Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
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CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING | |
MO-143
Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
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PBGA329 51xxxxx-x/1 MO-143 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP | |
PQFP 132 PACKAGE DIMENSION intel
Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
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ppga package
Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
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outline of the heat slug for JEDEC
Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
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Side Brazed Ceramic Dual-In-Line Packages
Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
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Theta JC of FBGA
Abstract: cpga dimensions cpga weight 84 pin plcc ic base
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diode databook package outline
Abstract: sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC
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A5579-01 A5580-01 diode databook package outline sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC | |
QFN108
Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
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84-Pin A1010B A1020B 100-Pin QFN108 QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch | |
Actel a1280
Abstract: VKS FPGA CQFP 172 actel 1020 A1020 smd TRANSISTOR 5962-9215601MXA 5962-9096503MTC equivalent transistor A1020 y 7 b Actel A1020 ACTEL A1010 actel 1020 datasheet
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20-pin Actel a1280 VKS FPGA CQFP 172 actel 1020 A1020 smd TRANSISTOR 5962-9215601MXA 5962-9096503MTC equivalent transistor A1020 y 7 b Actel A1020 ACTEL A1010 actel 1020 datasheet | |
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ms-029
Abstract: FBGA1152
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231369
Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
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A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package | |
KD 2107
Abstract: A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
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A5580-01 KD 2107 A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS | |
Intel 1702 eprom
Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
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CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28 | |
BGA-56 DATASHEET
Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
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CY7C386A-1AC
Abstract: CY7C386A-0AC 7C385A CY7C385A-2AC
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CY7C385A CY7C386A 84pin 100pin 144pin 160pin 16bit CY7C386A-1AC CY7C386A-0AC 7C385A CY7C385A-2AC | |
Untitled
Abstract: No abstract text available
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OCR Scan |
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P/N146071
Abstract: No abstract text available
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OCR Scan |
16-bit P/N146071 | |
CPGA
Abstract: cpga dimensions
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OCR Scan |
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Actel A1225
Abstract: M9AD Actel a1280 actel a1240 A1225 A1240 A1280
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176-Pin A1240 A1225) 50-MHz 000023S T-46-19-11 Actel A1225 M9AD Actel a1280 actel a1240 A1225 A1240 A1280 |