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    2N6925

    Abstract: TO3 package 2n6924
    Text: O General Semiconductor Industries, Inc. * NPN TRANSISTOR CHIP " Typical Device Types: 2N6924, 2N6925 37 " 35 AMP Bonding Pad Areas Fast Switching Base 1 135x28 mils Emitter (1)49 x 30 mils Typical Switching Front Metallization: Aluminum Back Metallization:


    OCR Scan     		2N6924, 2N6925 135x28 20nsec 90nsec 1300nsec 150nsec 50mAckage) 2N6925 TO3 package 2n6924 PDF