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SMC Corporation of America CG5EA63TNSV-152-X165US WATER RESISTANT CYLINDER, CG5 SERIES
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CG5EA63TNSV-152-X165US	Bulk		5 Weeks	1	1 $334.86 10 $311.42 100 $311.42 1000 $311.42 10000 $311.42	Get Quote
SMC Corporation of America CG5GA63TNSV-152-X165US CYLINDER, AIR, STAINLESS STEEL, CG5 SERIES
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CG5GA63TNSV-152-X165US	Bulk		5 Weeks	1	1 $351.6 10 $323.47 100 $323.47 1000 $323.47 10000 $323.47	Get Quote
SMC Corporation of America CG5BA63TNSV-152-X165US CYLINDER, AIR, STAINLESS STEEL, CG5 SERIES
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CG5BA63TNSV-152-X165US	Bulk		5 Weeks	1	1 $324.6 10 $298.63 100 $298.63 1000 $298.63 10000 $298.63	Get Quote
SMC Corporation of America CG5EN80TNSR-152-X165US CYLINDER, AIR, STAINLESS STEEL, CG5 SERIES
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CG5EN80TNSR-152-X165US	Bulk		5 Weeks	1	1 $312.17 10 $312.17 100 $312.17 1000 $312.17 10000 $312.17	Get Quote
Dichtomatik 120X152X16SA (75003165) Oil Seal, 120mm ID, 152mm OD, 16mm Width
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	120X152X16SA (75003165)	Bulk		3 Weeks	14	1 - 10 - 100 $28.2 1000 $28.2 10000 $28.2	Get Quote

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152X16 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
LHMN5 Abstract: 48TSOP LH5332600 LH5332600N LH5332600T LH5332C00D TSOP048-P-1218 LH5332500 2sj au LHMV Contextual Info: NBA/ INFORMATION LH5332600 • High-speed 32M-bit Mask-Programmable ROM Pin Connections Description The LH5332600N/T User's No. : LHMN56XX/LHMN5FXX is a CM OS 32M-bit mask-programmable ROM organized as 4 194 304X8 bits (Byte mode) or 2 097 152X 16 bits (Word	OCR Scan	LH5332600 32M-bit LH5332600N/T LHMN56XX/LHMN5FXX) 32\l-bit 304X8 LH5332600N 44-pin OP044-P-0600) LH5332600T LHMN5 48TSOP LH5332600 LH5332C00D TSOP048-P-1218 LH5332500 2sj au LHMV	PDF
heat sink Contextual Info: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130 heat sink	PDF
EPOXY RESIN Contextual Info: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130 EPOXY RESIN	PDF
a3020 Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130 a3020	PDF
Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130	PDF