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    UV-tape

    Abstract: wafer map
    Text: SL2 ICS51 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 136630 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-L HC Label ICs on an NXP C075EE


    Original     		ICS51 C075EE ICS5101EW/V7 15Contents UV-tape wafer map PDF

    SECS II wafer map format

    Abstract: C075EE uv-tape ICODE SLI-S ICS5401 SL2ICS54 wafer map format
    Text: SL2 ICS54 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 135930 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-S HC Label ICs on an NXP C075EE


    Original     		ICS54 C075EE ICS5401EW/V7 15Contents SECS II wafer map format C075EE uv-tape ICODE SLI-S ICS5401 SL2ICS54 wafer map format PDF