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    15X19 Search Results

    15X19 Result Highlights (2)

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    7312S0815X19LF Amphenol Communications Solutions Connectors for Portable Environments, hinge and cover Lead Free Visit Amphenol Communications Solutions
    7112S0815X19LF Amphenol Communications Solutions Connectors for Portable Environments, hinge and cover Lead Free Visit Amphenol Communications Solutions
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    Amphenol Communications Solutions 7112S0815X19LF

    CONN SIM/SAM CARD R/A SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 7112S0815X19LF Cut Tape 15,471 1
    • 1 $0.94
    • 10 $0.799
    • 100 $0.6789
    • 1000 $0.6364
    • 10000 $0.6364
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    7112S0815X19LF Digi-Reel 15,471 1
    • 1 $0.94
    • 10 $0.799
    • 100 $0.6789
    • 1000 $0.6364
    • 10000 $0.6364
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    7112S0815X19LF Reel 14,300 650
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    • 1000 $0.47589
    • 10000 $0.44163
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    Newark 7112S0815X19LF Cut Tape 382 1
    • 1 $0.416
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    IBS Electronics 7112S0815X19LF 3,900 650
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    Master Electronics 7112S0815X19LF 3,250
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    • 10000 $0.4593
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    MB MANUFACTURING INC SMT15X19.5

    Adjustable SMT Carrier 15" x 19.
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SMT15X19.5 Bulk 1
    • 1 $1157.97
    • 10 $1157.97
    • 100 $1157.97
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    Fix Supply ZUSAH1.5X19

    O-RING BUNA-N BLACK PK100
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    DigiKey ZUSAH1.5X19 Bulk 1
    • 1 $17.38
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    • 100 $17.38
    • 1000 $17.38
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    Fix Supply ZUSAQH1.5X19

    O-RING BUNA-N BLACK PK10
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    DigiKey ZUSAQH1.5X19 Bulk 1
    • 1 $28.43
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    • 100 $28.43
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    Amphenol Communications Solutions 7112S0815X19

    CONN SIM/SAM CARD R/A SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 7112S0815X19 Reel 800
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    • 1000 $0.8803
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    15X19 Datasheets Context Search

    Catalog Datasheet
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    PDF

    Untitled

    Abstract: No abstract text available
    Text: The documentation and process conversion measures necessary to comply with this document shall be completed by 30 June 2013. INCH-POUND MIL-PRF-19500/376K 30 March 2013 SUPERSEDING MIL-PRF-19500/376J 20 November 2010 PERFORMANCE SPECIFICATION SHEET * SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, LOW-POWER,


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    MIL-PRF-19500/376K MIL-PRF-19500/376J 2N2484, 2N2484UA, 2N2484UB, 2N2484UBC, 2N2484UBN, 2N2484UBCN PDF

    Untitled

    Abstract: No abstract text available
    Text: O K I Semiconductor MSM38S0000/MSM98S000 0.8|im Mixed 3-V/5-V Sea of Gates and Customer Structured Arrays DESCRIPTION OKI's 0.8 tm ASIC products, specially designed for mixed 3-V /5-V applications, are now available in both Sea Of Gates (SOG and Customer Structured Array (CSA) architectures. Both the SOG-based MSM38S


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    MSM38S0000/MSM98S000 MSM38S MSM98S 16-Mbit 38S/98S 44x44 35x35 28x28 33x33 38x38 PDF

    qfp144p

    Abstract: 425M QFP208-P-2828-0 QFP144-P-2828 QFP128 QFP144 QFP160 QFP44 QFP60 QFP80
    Text: J2N0016-38-81 作成:1998年 8月 前回作成:1996年10月 パッケージ l n パッケージ パッケージはシリーズ毎に豊富に用意しています。パッケージタイプやI/Oピン数等からお客様の 要求に合ったパッケージをお選びください。


    Original
    J2N0016-38-81 SSOP32-P-430-1 QFP44-P-910-0 80-2K QFP56-P-910-0 65-2K QFP60-P-1519-1 QFP64-P-1414-0 80-BK QFP128-P-2828-0 qfp144p 425M QFP208-P-2828-0 QFP144-P-2828 QFP128 QFP144 QFP160 QFP44 QFP60 QFP80 PDF

    Untitled

    Abstract: No abstract text available
    Text: 3QE D • 7^5^537 SCS-THOMSON 00301SM EILKgMMtgS T ■ s 6 s-fHonioN BUZ32 CHIP N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR IN DIE FORM DIE SIZE: 156x156 mils METALLIZATION: Top Al Back A u /C r/N i/A u BACKSIDE THICKNESS: 6100 A DIETHICKNESS: 16 ± 2 mils


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    00301SM BUZ32 156x156 15x19 PDF

    1040B

    Abstract: 2N3910 svt6062 2n5100
    Text: =1 TYPE 1015 NPN 1 GEOMETRY PHYSICAL CHARACTERISTICS 1. 2. 3. 4. Chip size. Chip hickness. Top metal. Back metal. 5. Backside. 6. Bonding pad. 2020 PNP 1. 2. 3. 4. Chip size. Chip thickness. Top metal.


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    1020B 15X19 3kA/10kA/I0kA 3kA/10kA/10kA 2N6674 2N6675 2N6676 2N6677 1040B 2N3910 svt6062 2n5100 PDF

    marking cab

    Abstract: SMA marking code 1R 901101
    Text: NOTES: 1. M A T E R I A L S AND F I N I S H E S : BODY - B R A S S . GOLD P L A T IN G CONTACTS - B E R Y L L I U M C O P P E R , GOLD P L A T I N G FE R R U LE - B R A S S . GOLD PLATE S L E E V E - B R A S S , GOLD PLATE INSULATOR • PTFE HEX NUT • S . S . , GOLD PLATE


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    13-Sep-11 ASSYF65 15X-19 marking cab SMA marking code 1R 901101 PDF

    MH 74151

    Abstract: Cxt01 38S02 74151 data sheet 74151 pin configuration bel 188 transistor MSM98S 065x0
    Text: O K I Semiconductor MSM38S0000/MSM98S000 0.8|im Mixed 3-V/5-V Sea of Gates and Customer Structured Arrays D E S C R IP TIO N OKI's 0.8 im ASIC products, specially designed for mixed 3-V /5-V applications, are now available in both Sea Of Gates (SOG and Customer Structured Array (CSA) architectures. Both the SOG-based MSM38S


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    MSM38S0000/MSM98S000 MSM38S MSM98S 16-Mbit MSM38S/98S 068x068 071x071 074x074 077x077 080x080 MH 74151 Cxt01 38S02 74151 data sheet 74151 pin configuration bel 188 transistor 065x0 PDF

    LS 2027 audio amp

    Abstract: ECG transistor replacement guide book free 2sb337 TRANSISTOR REPLACEMENT GUIDE 980510 S9510 2sb508 C24850772 2N339 bc149c
    Text: TABLE OF CONTENTS Introduction. Page 2 How to Use This Book. Page 2 Care and Handling of T ran sisto rs. Page 3


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    PDF

    hep 154 silicon diode

    Abstract: zy 406 transistor motorola HEP 801 hep 154 diode hep R1751 triac zd 607 2sb337 RS5743.3 F82Z hep 230 pnp
    Text: SEMICONDUCTOR This guide has been prepared by the Motorola HEP technical staff to provide a cross-reference for the Hobbyist, Experimenter, and Profes­ sional service technician. The information contained herein is based on an analysis of the published specifications of each device listed. This


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    MY110B Z0206 Z0208 Z0210 Z0211 Z0212 Z0214 Z0215 Z0217 Z0219 hep 154 silicon diode zy 406 transistor motorola HEP 801 hep 154 diode hep R1751 triac zd 607 2sb337 RS5743.3 F82Z hep 230 pnp PDF

    Untitled

    Abstract: No abstract text available
    Text: SGS-THOMSON ilLiraMOIgi BUZ32 CHIP N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR IN DIE FORM DIE SIZE: 156x156 mils METALLIZATION: Top Al Back A u/C r/N i/A u BACKSIDE THICKNESS: 6100 A DIE THICKNESS: 16 ± 2 mils PASSIVATION: P-Vapox BONDING PAD SIZE:


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    BUZ32 156x156 15x19 PDF

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original
    PDF

    38S02

    Abstract: MSM98S MSM98S000 MSM OKI
    Text: DATA SHEET O K I A S I C P R O D U C T S MSM38S Sea of Gates and MSM98S Customer Structured Arrays 0.8µm Mixed 3-V/5-V July 2001 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––


    Original
    MSM38S MSM98S MSM38S/98S 38S02 MSM98S000 MSM OKI PDF

    SMB5000-1

    Abstract: SMB500 21A1 SMB61 HT56
    Text: 7 4 REVISIONS ISS ZONE D E S C R IP T IO N ^ER REQUEST\DATE — 2 — - r 2 -7 - 5 .2 - -1 . CRIMPED FERRULE HEX CRIMP SIZE .1 2 8 " 2 , CONTACT PIN TO SOLDER - H RECOMMENDED CABLE STRIPPING DIM’S NOTES: FINISH PLATING THICKNESS IN MICRO-INCHES


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    OO-B-626 DQ-C-530 HT-56/5X193 FR-38/3X7C SMB61 B2-5-096/Ã SMB5000-1 SM05000-6 SM061 -4-23/17-C SMB5000-1 SMB500 21A1 HT56 PDF

    triac zd 607

    Abstract: hep c6004 2sb504 2SC 968 NPN Transistor sje 607 motorola c6004 diode BY127 specifications K872 af118 Motorola Semiconductor hep c3806p
    Text: & SEM ICO N DU CTO R This guide has been prepared by the Motorola HEP technical staff to provide a cross-reference for the Hobbyist, Experimenter, and Professional service techni­ cian. The information contained herein is based on an analysis of the published


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    thT404 ZV15A ZY33A ZT696 ZV15B ZY33B ZT697 ZT706 ZV27A ZY62A triac zd 607 hep c6004 2sb504 2SC 968 NPN Transistor sje 607 motorola c6004 diode BY127 specifications K872 af118 Motorola Semiconductor hep c3806p PDF