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    Untitled

    Abstract: No abstract text available
    Text: Product Preview GS832218 B/E /GS832236(B/E)/GS832272(C) 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation


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    GS832218 /GS832236 /GS832272 209-Pin 133MHz x18/x36 PDF

    Untitled

    Abstract: No abstract text available
    Text: GS8322Z18 B/E /GS8322Z36(B/E)/GS8322Z72(C) 119, 165 & 209 BGA Commercial Temp Industrial Temp 36Mb Pipelined and Flow Through Synchronous NBT SRAM Features 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Because it is a synchronous device, address, data inputs, and


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    GS8322Z18 /GS8322Z36 /GS8322Z72 119table 8322Z18 PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation


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    GS88218/36CB/D-333/300/250/200/150 165-Bump x18/x36 88218C 119-BGA PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS81302S08/09/18/36E-333/300/250/200/167 144Mb SigmaSIOTM DDR -II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–167 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaSIO Interface • JEDEC-standard pinout and package


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    GS81302S08/09/18/36E-333/300/250/200/167 165-Bump 165-bump, 144Mb GS81302Sx36E-300T. 81302Sxx 165-BGA PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88218/36CB/D-xxxI 119- and 165-Bump BGA Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable


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    GS88218/36CB/D-xxxI 165-Bump x18/x36 88218C PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C1484V25 CY7C1485V25 72-Mbit 2M x 36/4M x 18 Pipelined DCD Sync SRAM Functional Description[1] Features • Supports bus operation up to 250 MHz • Available speed grades are 250, 200, and 167 MHz • Registered inputs and outputs for pipelined operation


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    CY7C1484V25 CY7C1485V25 72-Mbit 36/4M 250-MHz 200-MHz 167-MHz PDF

    165BGA

    Abstract: No abstract text available
    Text: CY7C1484V25 CY7C1485V25 PRELIMINARY 72-Mbit 2M x 36/4M x 18 Pipelined DCD Sync SRAM Functional Description[1] Features • Supports bus operation up to 250 MHz • Available speed grades are 250, 200, and 167 MHz • Registered inputs and outputs for pipelined operation


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    CY7C1484V25 CY7C1485V25 72-Mbit 36/4M 250-MHz 200-MHz 167-MHz 165FBGA 119-BGA 225-MHz 165BGA PDF

    Untitled

    Abstract: No abstract text available
    Text: GS8644Z18E/GS8644Z36E 165-Pin BGA Commercial Temp Industrial Temp 72Mb Pipelined and Flow Through Synchronous NBT SRAM Features 250 MHz–133MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Because it is a synchronous device, address, data inputs, and read/write control inputs are captured on the rising edge of the


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    GS8644Z18E/GS8644Z36E 165-Pin 133MHz 8644Zxx PDF

    Untitled

    Abstract: No abstract text available
    Text: GS81302S08/09/18/36E-375/350/333/300/250 144Mb SigmaSIOTM DDR -II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 375 MHz–250 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaSIO Interface • JEDEC-standard pinout and package


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    GS81302S08/09/18/36E-375/350/333/300/250 144Mb 165-Bump 165-BGA 81302Sxx PDF

    GS88218CB-250

    Abstract: GS88236CD-200I GS88236CD
    Text: GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation


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    GS88218/36CB/D-333/300/250/200/150 165-Bump x18/x36 88218C 119-BGA 165-BGA GS88218CB-250 GS88236CD-200I GS88236CD PDF

    GS8322Z18

    Abstract: GS8322Z72 d 209 l
    Text: GS8322Z18 B/E /GS8322Z36(B/E)/GS8322Z72(C) 119, 165 & 209 BGA Commercial Temp Industrial Temp 36Mb Pipelined and Flow Through Synchronous NBT SRAM Features 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Because it is a synchronous device, address, data inputs, and


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    GS8322Z18 /GS8322Z36 /GS8322Z72 8322Z18 GS8322Z72 d 209 l PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88218/36CB/D-xxx 119- and 165-Bump BGA Commercial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable


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    GS88218/36CB/D-xxx 165-Bump x18/x36 88218C PDF

    Untitled

    Abstract: No abstract text available
    Text: GS81302S08/09/18/36E-375/350/333/300/250 144Mb SigmaSIOTM DDR -II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 375 MHz–250 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaSIO Interface • JEDEC-standard pinout and package


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    GS81302S08/09/18/36E-375/350/333/300/250 165-Bump 165-bump, 144Mb 81302Sxx 165-BGA PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS832218 B/E /GS832236(B/E)/GS832272(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs Features 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Flow Through/Pipeline Reads


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    GS832218 /GS832236 /GS832272 209-Pin x18/x36 PDF

    112-011A

    Abstract: No abstract text available
    Text: GS8662Q08/09/18/36E-278/250/200/167 165-Bump BGA Commercial Temp Industrial Temp 278 MHz–167 MHz 1.8 V VDD 1.8 V and 1.5 V I/O 72Mb SigmaQuad-II Burst of 2 SRAM Clocking and Addressing Schemes • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


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    GS8662Q08/09/18/36E-278/250/200/167 165-Bump 144Mb 165-bump, 165-BGA 112-011A PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS832218 B/E /GS832236(B/E)/GS832272(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs Features 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Flow Through/Pipeline Reads


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    GS832218 /GS832236 /GS832272 209-Pin x18/x36 PDF

    Untitled

    Abstract: No abstract text available
    Text: GS8322Z18 B/E /GS8322Z36(B/E)/GS8322Z72(C) 119, 165 & 209 BGA Commercial Temp Industrial Temp 36Mb Pipelined and Flow Through Synchronous NBT SRAM Features 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Because it is a synchronous device, address, data inputs, and


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    GS8322Z18 /GS8322Z36 /GS8322Z72 119ble 8322Z18 PDF

    GS832218

    Abstract: GS832218B-200 GS832218B-225 GS832218B-250 GS832272
    Text: Preliminary GS832218 B/E /GS832236(B/E)/GS832272(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs Features 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Flow Through/Pipeline Reads


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    GS832218 /GS832236 /GS832272 209-Pin GS832218B-200 GS832218B-225 GS832218B-250 GS832272 PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88218/36CB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp Features • • • • • • • • • • • • • • • 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs


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    GS88218/36CB/D-333/300/250/200/150 165-Bump 88218C 119-BGA 165-BGA PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C1484V33 CY7C1485V33 72-Mbit 2M x 36/4M x 18 Pipelined DCD Sync SRAM Functional Description[1] Features • Supports bus operation up to 250 MHz • Available speed grades are 250, 200 and 167 MHz • Registered inputs and outputs for pipelined operation


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    CY7C1484V33 CY7C1485V33 72-Mbit 36/4M 250-MHz CY7C1484V33, CY7C1485V33 PDF

    j123

    Abstract: No abstract text available
    Text: ORCA ORSPI4 Evaluation Board User’s Guide July 2004 ebug06_01 ORCA ORSPI4 Evaluation Board User’s Guide Lattice Semiconductor Introduction This user’s guide describes the Lattice evaluation board for the ORSPI4 device, a stand-alone evaluation PCB that


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    ebug06 E5379A 16-bit 165-BGA 1-800-LATTICE j123 PDF

    AN1064

    Abstract: CY7C1484V33 CY7C1485V33
    Text: CY7C1484V33 CY7C1485V33 72-Mbit 2M x 36/4M x 18 Pipelined DCD Sync SRAM Functional Description[1] Features • • • • • • • • • • • • • • • • Supports bus operation up to 250 MHz Available speed grades are 250, 200, and 167 MHz


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    CY7C1484V33 CY7C1485V33 72-Mbit 36/4M CY7C1484V33/CY7C1485V33 AN1064 CY7C1484V33 CY7C1485V33 PDF

    AN1064

    Abstract: CY7C1484V25 CY7C1485V25
    Text: CY7C1484V25 CY7C1485V25 72-Mbit 2M x 36/4M x 18 Pipelined DCD Sync SRAM Functional Description[1] Features • • • • • • • • • • • • • • • • Supports bus operation up to 250 MHz Available speed grades are 250, 200, and 167 MHz


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    CY7C1484V25 CY7C1485V25 72-Mbit 36/4M 250-MHz AN1064 CY7C1484V25 CY7C1485V25 PDF

    CY7C1444AV25

    Abstract: CY7C1445AV25
    Text: CY7C1444AV25 CY7C1445AV25 PRELIMINARY 36-Mbit 1M x 36/2M x 18 Pipelined DCD Sync SRAM Functional Description[1] Features • Supports bus operation up to 250 MHz • Available speed grades are 250, 200, and 167 MHz • Registered inputs and outputs for pipelined operation


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    CY7C1444AV25 CY7C1445AV25 36-Mbit 36/2M 250-MHz CY7C1444AV25/CY7C1445AV25 100-Pin CY7C1444AV25 CY7C1445AV25 PDF