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    170X220 Search Results

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    170X220 Price and Stock

    Dichtomatik 170X220X15TC (ALTERNATE: 75006639)

    Oil Seal, 170mm ID, 220mm OD, 15mm Width | Dichtomatik 170X220X15TC
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS 170X220X15TC (ALTERNATE: 75006639) Bulk 3 Weeks 30
    • 1 -
    • 10 -
    • 100 $43.66
    • 1000 $41.23
    • 10000 $41.23
    		Get Quote

    Dichtomatik 170X220X15SC (ALTERNATE: 75006638)

    Oil Seal, 170mm ID, 220mm OD, 15mm Width | Dichtomatik 170X220X15SC
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS 170X220X15SC (ALTERNATE: 75006638) Bulk 3 Weeks 30
    • 1 -
    • 10 -
    • 100 $40.51
    • 1000 $38.26
    • 10000 $38.26
    		Get Quote

    170X220 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  SO 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:


    Original     		PDF 063W/cm 170x220

    DS0813

    Abstract: DSPG TOYOGIKEN TIBOX MIP 320 f DS1217
    Text: EN K I G TOYO N E K I G O Y O T N E K I G O Y TO N E K I G TOYO 1项 12 IP 液体防护级别 1项 PROTECTION AGAINIST SOLID SECOND NUMBE PROTECTION AGAINIST LIQUIDS 外部冲击防护级别 测试 TEST IP 测试 (TEST) IK 测试 (TEST) 固体防护级别


    Original     		PDF MIP-65 MIP-65PT MP-65 MIP-86 MIP-86PT MP-86 MIP-325 MIP-43 MIP-44 MIP-54 DS0813 DSPG TOYOGIKEN TIBOX MIP 320 f DS1217

    SO-28-2

    Abstract: SO28
    Text: Thermal Data  SO28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:


    Original     		PDF 063W/cm 170x220 SO-28-2 SO28

    BATWING

    Abstract: SO24
    Text: Thermal Data  SO24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:


    Original     		PDF 063W/cm 170x220 BATWING SO24

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  SO 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:


    Original     		PDF 063W/cm 170x220

    thermal PCB D2PAK

    Abstract: AR348 HTGB ERS -112 assembly motorola transistor dpak marking
    Text: AR348/D HIGHER POWER LEVELS IN SURFACE MOUNT DESIGNS Prepared By Dave Hollander Motorola Semiconductor Products Sector Phoenix, Arizona "Reprinted by permission from the September issue of Surface Mount Technology; Copyright 1990, P.O. Box 159f 17730 W. Peterson Road, Libertyville, IL 60048 U.S.A."


    OCR Scan     		PDF AR348/D OT-23 2PHX26222G-1 thermal PCB D2PAK AR348 HTGB ERS -112 assembly motorola transistor dpak marking