PGA209-C-S17U-2
Abstract: No abstract text available
Text: 209S8 Metal seal 209pin PGA EIAJ Package Code PGA209-C-S17U-2.54 JEDEC Code – 44.45±0.4 Weight g 24.75 4.55MAX 3.8±0.5 40.64±0.3 2.54TYP U T 40.64±0.3 R P N M L K J H G F E D C B A φ1.0TYP 44.45±0.4 φ0.46±0.05 2.54TYP 17 16 15 14 13 12 11 10 9 8
|
Original
|
PDF
|
209S8
209pin
PGA209-C-S17U-2
55MAX
54TYP
|
t10-25 u2
Abstract: G2156 f10107
Text: Preliminary GS816273AC-300/275/250/225/200 300 MHz–200 MHz 256K x 72 1.8 V or 2.5 V VDD 18Mb S/DCD Sync Burst SRAMs 1.8 V or 2.5 V I/O 209-Pin BGA Commercial Temp Industrial Temp Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
|
Original
|
PDF
|
GS816273AC-300/275/250/225/200
209-Pin
209-bump
816273A
t10-25 u2
G2156
f10107
|
8180S18
Abstract: 8180S36 GS8180S36B-300 GS8180S36B-333 512Kx
Text: Preliminary GS8180S18/36B-333/300/250 18Mb Σ2x1B2 SDR Separate I/O SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 - 333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • SigmaRAM JEDEC standard pinout and package • Dual Single Data Rate interface
|
Original
|
PDF
|
GS8180S18/36B-333/300/250
209-Bump
209-bump,
209-Pin
GS8180S18B-333I
GS8180S18B-300I
GS8180S18B-250I
8180S18
8180S36
GS8180S36B-300
GS8180S36B-333
512Kx
|
CXK79M36C163GB
Abstract: CXK79M36C163GB-33 CXK79M36C163GB-4 CXK79M36C163GB-5
Text: SONY ΣRAM CXK79M36C163GB 18Mb 1x2Lp LVCMOS High Speed Synchronous SRAMs 512Kb x 36 33/4/5 Preliminary Description The CXK79M36C163GB is a high speed CMOS synchronous static RAM with common I/O pins. It is manufactured in compliance with the JEDEC-standard 209 pin BGA package pinout defined for SigmaRAM™ devices. It integrates input registers,
|
Original
|
PDF
|
CXK79M36C163GB
512Kb
CXK79M36C163GB
CXK79M36C163GB-33
CXK79M36C163GB-4
CXK79M36C163GB-5
|
CXK79M36C160GB
Abstract: CXK79M36C160GB-33 CXK79M36C160GB-4 CXK79M36C160GB-5 CXK79M72C160GB CXK79M72C160GB-33 CXK79M72C160GB-4 CXK79M72C160GB-5
Text: SONY ΣRAM CXK79M72C160GB / CXK79M36C160GB 18Mb 1x1Lp HSTL High Speed Synchronous SRAMs 256Kb x 72 or 512Kb x 36 33/4/5 Preliminary Description The CXK79M72C160GB (organized as 262,144 words by 72 bits) and the CXK79M36C160GB (organized as 524,288 words
|
Original
|
PDF
|
CXK79M72C160GB
CXK79M36C160GB
256Kb
512Kb
CXK79M72C160GB
CXK79M36C160GB
CXK79M36C160GB-33
CXK79M36C160GB-4
CXK79M36C160GB-5
CXK79M72C160GB-33
CXK79M72C160GB-4
CXK79M72C160GB-5
|
PCI1131
Abstract: PCI1210 PCI1221 PCI CardBus Controllers PCI4450 BGA and QFP Package PCI1420 ghk diode TI PCI PCI1220
Text: The world leader in CardBus and 1394 solutions PCIBus Solutions Family Overview PCIBus Solutions TI PCIBus mission To add value to our customers’ products by ensuring the highest level of quality, reliability, cost effectiveness, product services, and fastest time to market
|
Original
|
PDF
|
SCPB002
PCI1131
PCI1210
PCI1221
PCI CardBus Controllers
PCI4450
BGA and QFP Package
PCI1420
ghk diode
TI PCI
PCI1220
|
Untitled
Abstract: No abstract text available
Text: IS61LSSDH51236 IS61LSSDH102418 ISSI ΣQUAD 18Mb Σ2x2B2 ADVANCE INFORMATION DECEMBER 2002 DDR SEPERATE I/O SRAM FEATURES • Simultaneous Read and Write SigmaQuad Interface • SigmaRAM™ JEDEC standard pinout/package • Dual Double Data Rate interface
|
Original
|
PDF
|
IS61LSSDH51236
IS61LSSDH102418
11x15)
IS61LSSDH51236,
IS61LSSDH102418-125B
IS61LSSDH102418-150B
IS61LSSDH102418-167B
IS61LSSDH51236-125B
IS61LSSDH51236-150B
|
GS8644V18
Abstract: GS8644V18B GS8644V18B-250 GS8644V72
Text: Product Preview GS8644V18 B/E /GS8644V36(B/E)/GS8644V72(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs Features 250 MHz–133MHz 1.8 V VDD 1.8 V I/O Data Output Register. Holding FT high places the RAM in
|
Original
|
PDF
|
GS8644V18
/GS8644V36
/GS8644V72
209-Pin
133MHz
8644Vxx
GS8644V18B
GS8644V18B-250
GS8644V72
|
GS8644Z
Abstract: GS8644ZV18 GS8644ZV18B GS8644ZV72
Text: Product Preview GS8644ZV18 B/E /GS8644ZV36(B/E)/GS8644ZV72(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 72Mb Pipelined and Flow Through Synchronous NBT SRAM Features 250 MHz–133MHz 1.8 V VDD 1.8 V I/O Because it is a synchronous device, address, data inputs, and
|
Original
|
PDF
|
GS8644ZV18
/GS8644ZV36
/GS8644ZV72
209-Pin
133MHz
8644ZVxx
GS8644Z
GS8644ZV18B
GS8644ZV72
|
GS8162V18AB-350
Abstract: No abstract text available
Text: Preliminary GS8162V18A B/D /GS8162V36A(B/D)/GS8162V72A(C) 119-, 165- & 209-Pin BGA Commercial Temp Industrial Temp 350 MHz–150 MHz 1.8 V VDD 1.8 V I/O 1M x 18, 512K x 36, 256K x 72 18Mb S/DCD Sync Burst SRAMs Features via the FT mode . Holding the FT mode pin low places the RAM in
|
Original
|
PDF
|
GS8162V18A
/GS8162V36A
/GS8162V72A
209-Pin
GS8162VxxA
GS8162V18AB-350
|
GW 9n
Abstract: 221-PIN
Text: ADVANCE ‡ 16Mb: 256K x 72 FLOW-THROUGH ZBT SRAM 16Mb ZBT SRAM MT55L256Y72F, MT55V256V72F, 3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD 2.5V I/O FEATURES • • • • • • • • • • • • • • • • 221-PIN FBGA High frequency and 100 percent bus utilization
|
Original
|
PDF
|
MT55L256Y72F,
MT55V256V72F,
221-PIN
209-pin
July/16/01
195-pin
Aug/14/00
May/00
MT55L256Y72F
GW 9n
|
Untitled
Abstract: No abstract text available
Text: GS832218/36/72 B/E/C -xxxV 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs Features 250 MHz–133 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the
|
Original
|
PDF
|
GS832218/36/72
209-Pin
x18/x36
209-bump
8322Vxx
|
Untitled
Abstract: No abstract text available
Text: Product Preview GS832218 B/E /GS832236(B/E)/GS832272(C) 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation
|
Original
|
PDF
|
GS832218
/GS832236
/GS832272
209-Pin
133MHz
x18/x36
|
Untitled
Abstract: No abstract text available
Text: Product Preview GS864418 B/E /GS864436(B/E)/GS864472(C) 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation
|
Original
|
PDF
|
GS864418
/GS864436
/GS864472
209-Pin
133MHz
x18/x36
8644xx
|
|
|
Untitled
Abstract: No abstract text available
Text: ISSI IS61LSSD102418 ΣQUAD 18Mb Σ2x2B4 ADVANCE INFORMATION JUNE 2002 DDR SEPARATE I/O SRAM FEATURES • Simulatneous Read and Write SigmaQuad Interface • JEDEC standard pinout and package • Dual Double Data Rate interface • Echo Clock outputs track data output drivers
|
Original
|
PDF
|
IS61LSSD102418
11x15)
IS61LSSD102418-250B
IS61LSSD102418-300B
IS61LSSD102418-333B
209-pin
|
HAMR5603
Abstract: M9-CSP64 UTC1117 KX15-50KLD SEAGATE ST340810A PMOSSOT23 ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL 180w subwoofer circuit diagram R101A w31 smd
Text: SERVICE MANUAL FOR E - 8188 BY: Rain Li TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Apr . 2003 LCD PC E-8188 MAINTENANCE Contents 1. Hardware Engineering Specification - 3
|
Original
|
PDF
|
E-8188
845PE
CB710
ICS950805
HAMR5603
M9-CSP64
UTC1117
KX15-50KLD
SEAGATE ST340810A
PMOSSOT23
ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL
180w subwoofer circuit diagram
R101A
w31 smd
|
GL3220
Abstract: Compal Electronics Ali 3601 compal k5w12 LA-1421 fdv301
Text: A B C D E 1 2 1 LA-1421 Schematics Document uFCBGA/uFCPGA for Celeron/ Coppermine-T and Tualatin CPU Ver1.0 2 Almador-M 830-MG + ICH3 + VCH 3 3 4 4 Title Compal Electronics, inc. SCHEMATIC, M/B LA-1421 THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
|
Original
|
PDF
|
LA-1421
830-MG)
10Ohm
GL3220
Compal Electronics
Ali 3601
compal
k5w12
fdv301
|
OZ-165
Abstract: 47uF-0603 PU1A-12 Compal Electronics MP3R LA-1331 compal ATL02
Text: A B C D E 1 1 ACL10 LA-1331 Schematics Document 2 2 REV 2.0 For 030 INTEL Mobile P4 uFCBGA/uFCPGA Northwood MCH-M(845-MP) + ICH3-M + SQ17 3 3 4 4 Title COMPAL ELECTRONICS, INC SCHEMATIC, M/B LA-1331 THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE
|
Original
|
PDF
|
ACL10
LA-1331
845-MP)
LA-1331
MAX6654MEE
NE1617
W320-04
ICS9508-05
OZ-165
47uF-0603
PU1A-12
Compal Electronics
MP3R
compal
ATL02
|
BTK20
Abstract: la1521 foxconn LA-1521 h1 m6c Compal Electronics VMD20 VMD29 foxcoon ALI C
Text: A B C D E 1 1 SHANGHAI 100 BTK20 LA-1521 Schematics Document 2 2 REV 1.0A PVT2 INTEL Mobile P4 uFCBGA/uFCPGA Northwood Celeron MCH-M 845MZ + ICH3-M + M6-C(16MB VRAM) 3 3 4 4 Title Compal Electronics, inc. THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
|
Original
|
PDF
|
BTK20
LA-1521
845MZ)
LA-1521
PC114
1000PF
PR150
SI91822DH-12-T1
PR140
la1521
foxconn
h1 m6c
Compal Electronics
VMD20
VMD29
foxcoon
ALI C
|
Foxconn L S-36
Abstract: foxconn LA1541 compal 6 pin smd power control ic 18v LA-1541 smd diode sot23 a4 Socket AM2 ce pe SMD switch Compal Electronics
Text: A B C D E 1 1 2 2 BTS88 LA-1541 REV0.3 Schematics Document Intel Pentium 4 Processor in the 478-pin Package with 845PE / ICH4 / NVIDIA SQ17 chipset 2002-10-26-A For B2-Test 3 3 4 4 Title Compal Electronics, Ltd. BTS88 Cover Sheet Size B Date: A B C D Document Number
|
Original
|
PDF
|
BTS88
LA-1541
478-pin
845PE
002-10-26-A
LA1541
BTS88
mPGA478
ICS950810
Foxconn L S-36
foxconn
LA1541
compal
6 pin smd power control ic 18v
smd diode sot23 a4
Socket AM2
ce pe SMD switch
Compal Electronics
|
Untitled
Abstract: No abstract text available
Text: Product Preview GS8324Z18A B/C /GS8324Z36A(B/C)/GS8324Z72A(C) 119- and 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb Sync NBT SRAMs Features • NBT (No Bus Turn Around) functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with
|
Original
|
PDF
|
GS8324Z18A
/GS8324Z36A
/GS8324Z72A
209-Pin
8324Z18A
|
GS8322V18B-225
Abstract: GS8322V18B-250 GS8322V72 GS8322V18 GS8322V18B-200
Text: Preliminary GS8322V18 B/E /GS8322V36(B/E)/GS8322V72(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs Features 250 MHz–133 MHz 1.8 V VDD 1.8 V I/O Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the
|
Original
|
PDF
|
GS8322V18
/GS8322V36
/GS8322V72
209-Pin
8322Vxx
GS8322V18B-225
GS8322V18B-250
GS8322V72
GS8322V18B-200
|
GS864418
Abstract: GS864418B GS864418B-250 GS864472
Text: Product Preview GS864418 B/E /GS864436(B/E)/GS864472(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs Features 250 MHz–133MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Flow Through/Pipeline Reads
|
Original
|
PDF
|
GS864418
/GS864436
/GS864472
209-Pin
133MHz
8644xx
GS864418B
GS864418B-250
GS864472
|
GS8642V18
Abstract: No abstract text available
Text: Product Preview GS8642V18 B/E /GS8642V36(B/E)/GS8642V72(C) 4M x 18, 2M x 36, 1M x 72 36Mb S/DCD Sync Burst SRAMs 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features 300 MHz–167 MHz 1.8 V VDD 1.8 V I/O Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the
|
Original
|
PDF
|
GS8642V18
/GS8642V36
/GS8642V72
209-Pin
8642Vxx
|