Untitled
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
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net eN8
Abstract: TDN01 crpa 8B10B P802 TLK3118 XGXS quad video processor
Text: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)
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TLK3118
SLLS628C
21x21mm,
400-Ball,
10-Gbps
3ae-2002
net eN8
TDN01
crpa
8B10B
P802
TLK3118
XGXS
quad video processor
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K297
Abstract: net eN8 TDN01
Text: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)
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TLK3118
SLLS628C
10-Gbps
3ae-2002
K297
net eN8
TDN01
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8B10B
Abstract: P802 TLK3118 RXD17
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
8B10B
P802
TLK3118
RXD17
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prbs parity checker and generator
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628
10-Gbps
3ae-2002
prbs parity checker and generator
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TDN01
Abstract: TDP01/TDN01 net eN8 acq2 RDN01 130nm CMOS
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628B
10-Gbps
3ae-2002
TDN01
TDP01/TDN01
net eN8
acq2
RDN01
130nm CMOS
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Untitled
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
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TDP01/TDN01
Abstract: TDN21 XAUI 8B10B P802 TLK3118 c20d10
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
TDP01/TDN01
TDN21
XAUI
8B10B
P802
TLK3118
c20d10
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Untitled
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628B
10-Gbps
3ae-2002
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SERDES 10G
Abstract: TDN01
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628B
10-Gbps
3ae-2002
SERDES 10G
TDN01
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8B10B
Abstract: P802 TLK3118
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
8B10B
P802
TLK3118
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Untitled
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628A
10-Gbps
3ae-2002
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HBM W10
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628
10-Gbps
3ae-2002
HBM W10
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Untitled
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)
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TLK3118
SLLS628C
21x21mm,
400-Ball,
10-Gbps
3ae-2002
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net eN8
Abstract: 8B10B P802 TLK3118 10gb TX drive K283
Text: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)
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TLK3118
SLLS628C
21x21mm,
400-Ball,
10-Gbps
3ae-2002
net eN8
8B10B
P802
TLK3118
10gb TX drive
K283
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250 mhz IBM PowerPC Processor
Abstract: EMPPC740 interface 740 IBM PowerPC 740 reference manual emppc750 IBM PowerPC 250 EMPPC750L
Text: PowerPC 740TM and PowerPC 750TM Embedded Microprocessor Datasheet IBM CMOS 0.20 µm Copper Technology EMPPC740L and EMPPC750L Version 1.51 7/15/99 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the
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740TM
750TM
EMPPC740L
EMPPC750L
250 mhz IBM PowerPC Processor
EMPPC740
interface 740 IBM
PowerPC 740 reference manual
emppc750
IBM PowerPC 250
EMPPC750L
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PPC750L
Abstract: IBM PPC750L PPC740L PowerPC 740 reference manual 500C interface 740 IBM
Text: PowerPC 740 and PowerPC 750 Microprocessor Datasheet CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2 Version 1.1 10/9/2001 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the
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PPC740L
PPC750L,
PPC750L
IBM PPC750L
PowerPC 740 reference manual
500C
interface 740 IBM
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PowerPC603r
Abstract: 21x21mm
Text: Tuesday, July 24, 2001 603r Reliability Data 603r Reliability & Qualification Data This is the reliability & qualification data for the PowerPC 603r microprocessor. The FIT and MTBF graphs for this device are located at the bottom of this page. Stress Results
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/-200mA,
C/100
21x21mm
C/125
21x25mm
PowerPC603r
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intel DMA controller Unit
Abstract: 82545EM 1000BASE-X 82546EB Gigabit Ethernet MAC phy
Text: NP2104_Kenai64_PB.qxd 1/8/03 2:05 PM Page 1 Intel 82545EM Gigabit Ethernet Controller High-Performance Gigabit Connectivity for Servers and Workstations Product Brief The Intelligent Way to Connect • Footprint compatibility with Intel’s latest Gigabit connections allows for flexible designs
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NP2104
Kenai64
82545EM
82545EM
21x21mm
0103/OC/TS/PDF
intel DMA controller Unit
1000BASE-X
82546EB
Gigabit Ethernet MAC phy
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SiI7172
Abstract: sil5744 SII9233 SII9125 SiI9233A SII9013 SIL5723 SiI7189 SiI9022A sil9002
Text: DTV Products Enabling the secure delivery and presentation of high-quality HD content everywhere. PORT PROCESSORS Target Applications Input/Output Input Resolution HDCP TMDS EDID CEC Package Size Starter Kit SiI9181A Front panel of DTVs, A/V receivers,
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SiI9181A
480i/p,
1080i/p
225MHz
56-pin
CP9181AHDMI
SiI9185A
SiI7172
sil5744
SII9233
SII9125
SiI9233A
SII9013
SIL5723
SiI7189
SiI9022A
sil9002
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130nm CMOS
Abstract: P802 TLK3118 MDIO clause 45 MDIO clause 45 specification
Text: TLK3118 REDUNDANT XAUI TRANSCEIVER SLLS609 − JANUARY 2004 D D D D D D D D D TLK3118 TDP/N[3:0]0 TCLK RDP/N[3:0]0 4 4 TD 31.0 TC(3.0) RCLK RD(31.0) TDP/N[3:0]1 RC(3.0) RDP/N[3:0]1 4 4 description The TLK3118 is a flexible, redundant XAUI serial transceiver that is compliant to 10-Gbps Ethernet XAUI
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TLK3118
SLLS609
TLK3118
10-Gbps
130nm CMOS
P802
MDIO clause 45
MDIO clause 45 specification
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F81801U
Abstract: F81801U-I HDMI to VGA Cable pin diagram F81801 VT202 VT2021 HDMI to VGA Cable diagram 1-ch LVDS to vga ICS9UM709B H.264 codec
Text: Pico-ITX Series Board Placement DC-in LPC/SMBus/GPIO pin connector NEW VIA Eden X2 processor VIA EPIA-P900 Pico-ITX Eden™ X2 Board with Full HD Video Support, SATA, GigaLAN, USB, and VGA/HDMI /LVDS Front panel/PS2 pin connector VGA/USB pin connector
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EPIA-P900
VX900H
P830-A
21x21mm
400-800Mhz
ICS9UM709B
1066MHz
VX900H
VT6130
VT2021
F81801U
F81801U-I
HDMI to VGA Cable pin diagram
F81801
VT202
HDMI to VGA Cable diagram
1-ch LVDS to vga
ICS9UM709B
H.264 codec
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IBM25PPC750FX
Abstract: IBM25PPC750FXGB 750fx DH16 IBM 750L layout diagram of microprocessor RISCwatch 5K34 PowerPC 750FX
Text: IBM PowerPC® 750FX RISC Microprocessor Datasheet Support for 750FX Design Revision Level DD 2.X Version: 2.0 Preliminary June 9, 2003 ® Copyright and Disclaimer Copyright International Business Machines Corporation 2003 All Rights Reserved Printed in the United States of America June 2003
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750FX
IBM25PPC750FX
IBM25PPC750FXGB
DH16
IBM 750L
layout diagram of microprocessor
RISCwatch
5K34
PowerPC 750FX
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IBM25PPC750Fl
Abstract: 750FL
Text: IBM PowerPC® 750FL RISC Microprocessor Datasheet Support for 750FL Design Revision Level DD 2.X Version: SA14-2768-01 Preliminary May 10, 2005 ® Copyright and Disclaimer Copyright International Business Machines Corporation 2005 All Rights Reserved
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750FL
SA14-2768-01
SA14-2768-01
SA14-2768-00
IBM25PPC750Fl
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