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    225FA Search Results

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    225FA Price and Stock

    Panduit Corp S100X225FAI

    LABEL SELF LAMINATNG 1X2.25" WHT
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    DigiKey S100X225FAI Bulk 3,000 1,000
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    • 1000 $0.12726
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    Panduit Corp S100X225FAL

    LABEL SELF LAMINATNG 1X2.25" WHT
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    DigiKey S100X225FAL Bulk 1,000 1,000
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    Bourns Inc PTV09A-4225F-A503

    POT 50K OHM 1/20W CARBON LOG
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    DigiKey PTV09A-4225F-A503 Tray 841 1
    • 1 $1.13
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    Mouser Electronics PTV09A-4225F-A503 1,113
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    Newark PTV09A-4225F-A503 Bulk 246 1
    • 1 $0.738
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    RS PTV09A-4225F-A503 Bulk 16 Weeks 1,000
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    Master Electronics PTV09A-4225F-A503 700
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    ams OSRAM Group SFH-225-FA

    SENSOR PHOTODIODE 900NM RADIAL
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    Matrix Orbital LK202-25-FA

    LCD MODULE 40 DIG 20 X 2
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    DigiKey LK202-25-FA Bulk 1
    • 1 $54.95
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    • 100 $48.5625
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    Master Electronics LK202-25-FA 35
    • 1 $75.96
    • 10 $66.38
    • 100 $50.5
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    225FA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


    Original
    PDF

    Untitled

    Abstract: No abstract text available
    Text: Hi-Flow 225F-AC Reinforced,Phase Change Thermal Interface Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 225F-AC PROPERTY Color • Thermal impedance: 0.10°C-in 2/W @25 psi • Can be manually or automatically applied to the surfaces of room-temperature


    Original
    PDF 225F-AC D3418

    TRANSISTOR REPLACEMENT GUIDE d882

    Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
    Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,


    Original
    PDF

    ASTM D374

    Abstract: D374 ASTM D5470
    Text: Hi-Flow 225F-AC Reinforced, Phase Change Thermal Interface Material Features and Benefits • Thermal impedance: 0.10°C-in2/W @25 psi • Can be manually or automatically applied to the surfaces of room-temperature heat sinks • Foil reinforced, adhesive-coated


    Original
    PDF 225F-AC 225FAC ASTM D374 D374 ASTM D5470

    Untitled

    Abstract: No abstract text available
    Text: SIEMENS Silicon PIN Photodiode Daylight Filter Dimensions in inches mm ; (35 5) .020 (.5) 1.317(33.5) .100 (254) j J_ , Cathode 1 .206(5.1) .181 (4.6) f-r .031 (.8) .016 (.4) ,.071 (1.8) rt)47(1.2) ,283 (7.2) .259(6.6) .043(1.1) .028(0.7) FEATURES • Especially suitable for application* of


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    PDF 225FA SFH225FA