256Kx1 dram pinout
Abstract: No abstract text available
Text: SM536256 August 1994 Rev 2 SMART Modular Technologies SM536256 1MByte 256K x 36 CMOS DRAM Module General Description Features The SM536256 is a high performance, 1-megabyte dynamic RAM module organized as 256K words by 36 bits, in a 72-pin, leadless, single-in-line memory module
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SM536256
SM536256
72-pin,
256Kx4
256Kx1
70/80/100ns
256Kx1 dram pinout
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27c eeprom
Abstract: AS27C256 92132 eeprom dip 36 uv 4lc eeprom 4Mx1 sram FPM DRAM MT42C4256 256Kx4 ZIP FLASH MEMORY 29F
Text: STAND ARD MEMOR Y PRODUCT SELECT OR GUIDE ANDARD EMORY ELECTOR CERAMIC CONFIGURATIONS COMMITTED TO PROVIDING HIGH-QUALITY, INNOVATIVE SOLUTIONS TO THE HIGH-RELIABILITY MARKETPLACE STANDARD MEMORY PRODUCTS CERAMIC CONFIGURATIONS SRAM 16MEG MCM Configurable as
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16MEG
64Kx4)
256Kx1)
256Kx4)
512Kx32
1Mx16,
2Mx32
4Mx16,
1Mx32
2Mx16,
27c eeprom
AS27C256
92132
eeprom dip 36 uv
4lc eeprom
4Mx1 sram
FPM DRAM
MT42C4256
256Kx4 ZIP
FLASH MEMORY 29F
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AEG DD 31 n 1200
Abstract: aeg dd 55 n 1200
Text: 256KX1BASED Dense-Pac Microsystems, Inc. C M O S SR A M FAM ILY -PREUMINARYDPS25616 DPS20482 DESCRIPTION: The Dense-Pac 256KX1 Based Family modules consists of very high speed 256KX1 based static RAMs which have been configured in the organizations described
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256KX1BASED
-PREUMINARYDPS25616
DPS20482
256KX1
DPS10241
DPS2564
DPS2564
DPS10241
1024KX
AEG DD 31 n 1200
aeg dd 55 n 1200
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HY53C256
Abstract: HY53C256LS
Text: HYUNDAI HY53C256 Series 256Kx1-bit CMOS DRAM DESCRIPTION The HY53C256 is fast dynamic RAM organized 262,144 x 1-bit. The HY53C256 utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating margins to the users.
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HY53C256
256Kx1-bit
300mil
16pin
330mil
18pin
standbY556)
HY53C256LS
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Untitled
Abstract: No abstract text available
Text: ADV MICRO {MEMORY} Tb dË | 0557550 Am90CL256 005L.3ÖM is : Low-Pöwer 256Kx1 CMOS Enhanced Page Mode DRAM : OVERVIEW The 256K x 1 CMOS Low-Power fL ' DRAM versions share common functional descriptions, DC and AC characteristics with the corresponding standard CMOS non-'L1) versions. The only additions to these sections are:
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Am90CL256
256Kx1
100-pF
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30A008-00
Abstract: 256KX1 256KX16 256KX4 S2564 CFT-5 A618
Text: DENSE-PAC MICROSYSTEMS 0?E D | STSTMIS 0000135 O | 256KX1 BASED Dense-Pac Microsystems, Inc. C M O S SRAM FAM ILY -PRELIM INARYDPS25616 DPS20482 DESCRIPTION: T h e D e n se -P ac 2 56K X1 B ase d Fa m ily m od ules con sists o f v e ry high sp eed 256K X1 b a sed static R A M s w h ic h
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256KX1
DPS2564
256KX4
DPS10241
1024KX
DPS25616
256KX16,
512KX8,
1024KX4
30A008-00
256KX16
S2564
CFT-5
A618
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synchronous sram
Abstract: 4Kx1 DRAM SRAM 6T SRAM DRAM 64kx16 edi8832
Text: ^EDI_ Electronic DMlgrw Inc. ^ by Part Number _ _ _ Part No. Tvoe Density Ora EDH816H64C EDI2018QC EDI20181C EDI20182C EDI20183C EDI20184C EDI20185C EDI2040C EDI2041C EDI2042C SRAM Module Synchronous SRAM, Latched I/O, 1CLK Synchronous SRAM, Registered I/O, 1CLK
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EDH816H64C
EDI2018QC
EDI20181C
EDI20182C
EDI20183C
EDI20184C
EDI20185C
EDI2040C
EDI2041C
EDI2042C
synchronous sram
4Kx1 DRAM
SRAM 6T
SRAM
DRAM 64kx16
edi8832
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128kx8
Abstract: EDI88130 32 PIN edi84256
Text: moi Selector Guide ELECTRONIC DESIGNS INC. Density Oraanization Part No. Speed ns Max Current (mAl Packaae Paae x32 Flash 4 Megabits 4 Megabits 128KX32 4 Megabits 4 Megabits 128KX32 128Kx32 EDI7C32128C-JM EDI7M32128C-GB 120-200 120-200 250 250 68 lead JLCC
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128KX32
EDI7C32128C-JM
EDI7M32128C-GB
EDI5C32128C-JM
EDI5M32128C-GB
64KX32
128KX32
128kx8
EDI88130
32 PIN
edi84256
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64kx4 DRAM
Abstract: SRAM 6T PS-136 4Kx1 DRAM EDI8F8512LP MILITARY 4Kx1 SRAM 5962-89598 EDI8833LP 32kx8 bit low power cmos sram edi84256
Text: EDI8833C/LP/P ^E D I Electronic Designs Inc. High Speed 256K Monolithic SRAM 32Kx8 Static RAM CMOS, Monolithic u m m Features The EDI8833C/LP/P is a high speed, high perform ance, low power, 262,144bit C M O S Static R A M orga 32Kx8 bit C M O S Static
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EDI8833C/LP/P
32Kx8
EDI8833C/LP/P
144bit
32Kx8.
MIL-STD-883,
64Kx4
EDI8466CB.
256Kx1
EDI81256C/LP/P.
64kx4 DRAM
SRAM 6T
PS-136
4Kx1 DRAM
EDI8F8512LP MILITARY
4Kx1 SRAM
5962-89598
EDI8833LP
32kx8 bit low power cmos sram
edi84256
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dram zip 256kx16
Abstract: I8833C
Text: Electronic Design* Inc. Table of Contents Page Letter from the Table o f Contents . 2
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256Kx1 dRAM
Abstract: UPD424256 dram memory 256kx4
Text: TOYOCOM U S A INC 37F » _ ti i Q E!Q7a a o a o s m 3 . TOYOCOM Is Quality! •»*, % •Xa*" • . .yt.ivX: -"■ "■ ■ ■ ;. sv.% ' ■ " '' , , , , ' ' ^ i<j/ff *■ *■ ' ' /vw ■ ■ ■ ■ , *• ■'' ^ W.J^^38£*S y , ^ U :J
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TH2G1P2508A
TH3G1P2508A
097K-bit
TH2G1P25G9A/B
TH3C1P2509A/B
359Kblt
258Kx
09G-024
256Kx1 dRAM
UPD424256
dram memory 256kx4
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TMS4256FML
Abstract: tms4256 256Kx1 dRAM
Text: ADVANCE INFORMATION TM4256GP9, TM4256GV9 262.144 BY 9-BIT DYNAMIC RAM MODULES OCTOBER 1 9 8 5 - • 2 6 2 .1 4 4 X 9 Organization • Single 5-V Supply 10% Tolerance V SINGLE-IN-LINE PACKAG E f ITOP VIEW) 30-Pin Single-in-Line Package (SIP) —Pinned Module for Through-Hole
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TM4256GP9,
TM4256GV9
30-Pin
4256G
TM4256GP9)
TMS4256FML
tms4256
256Kx1 dRAM
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EDI81257CA
Abstract: A10q
Text: Part Number Guide Electronic Designs Inc. Modules Monolithics EDI 8 8 12& P 100 F B EDI 8 M 4 257 Ç 35 L 1 B P re fix -Product Group 8 = SRAM 9 = Special/Custom Substrate -M = Ceramic F = FR4 Epoxy Laminate Word W id th -1 = 1 bit wide
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EDI81257CA
A10q
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ic CV 203
Abstract: No abstract text available
Text: SIEM ENS 512K X 36-Bit Dynamic RAM Module HYM 365120S-80 Advanced Information • 524 288 words by 36-bit organization • Fast access and cycle time 80 ns access time 150 ns cycle time • Fast page mode capability with 55 ns cycle time • Single + 5 V ± 10 % supply
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36-Bit
365120S-80
L-SIM-72-1000)
256Kx
365120S-80
512Kx
36-Bit
ic CV 203
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Untitled
Abstract: No abstract text available
Text: SIEMENS 256K X 36-Bit Dynamic RAM Module HYM 362500S-80 Advanced Information • 262 144 words by 36-bit organization • Fast access and cycle time 80 ns access time 150 ns cycle time • Fast page mode capability with 55 ns cycle time • Single + 5 V ± 10 % supply
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36-Bit
362500S-80
L-SIM-72-1000)
362500S-80
256Kx
36-Bit
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1mx1 DRAM
Abstract: AA2035 UM82C380 256KB static RAM 6182s UM82152 UM82C384 AADS PA10 Unicorn Microelectronics
Text: UNICORN MICROE LE CTRON ICS E4E D • =1270700 QOQOTOH T ■ UM82C389 Austek Cache Interface I General Description The UM82C389 Cache Interface Chip is one of the UMC UM82C380 series High End AT HEAT chip set. As a DRAM controller, UM82C389 works in tandem with
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UM82C389
UM82C389
UM82C380
UM82152
UM80386
UM82C384
256Kx1
1mx1 DRAM
AA2035
256KB static RAM
6182s
AADS
PA10
Unicorn Microelectronics
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Deico Electronics
Abstract: delco SIMM 30-pin 30-pin simm memory 30-pin simm memory dynamic Delco Electronics DD0256P8 256k x 8 dram 4 pin Single-in-Line Package
Text: DEICO EL EC T RO NI C S INC nE » 2757715 ÜDa OGlS 5 DEICO ELECTRONICS, 5NC. '. 2800 Bayview Dr. Fremont, CA 94537 Telephone 415 651-7800 Telex 176427 » FAX (415) 651-6109 Vdd • Vss ■ T 256k X 8 DRAM S in g le-In -lin e M em ory M odule rM k-rs-is
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DD0256P8
30-Pin
Deico Electronics
delco
SIMM 30-pin
30-pin simm memory
30-pin simm memory dynamic
Delco Electronics
256k x 8 dram
4 pin Single-in-Line Package
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Untitled
Abstract: No abstract text available
Text: WDÌ DRAM Test Enable Function E lectronic D « «tg n i Inc. EDI411024CXXQB Functional Description The T e s t E nable Function im plem entation on E lectronic D esigns' 1M x 1 dynam ic RAM allow s te st tim e reduction by use o f a parallel test algorithm . By asserting the TE pin, the
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EDI411024CXXQB
256Kx1
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cmos dynamic ram 256kx1
Abstract: 256Kx1 dram pinout SQ721 KM4216C528
Text: DENSE-PAC /U-Dcnstos High Density Memory Device M IC R O SYSTEM S 8 Megabit CMOS VIDEO RAM DP0512X16MGY5-CM PRELIM IN ARY D ESC R IPTIO N : P IN -O U T D IA G RA M The D P0 5 1 2X16MCY5-CM is a 512Kx16 bit Dual Port Dynamic RAM module that utilize the new and
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DP0512X16MGY5-CM
DP0512X16MCY5-CM
512Kx16
256Kx16
DP051
30A209-00
cmos dynamic ram 256kx1
256Kx1 dram pinout
SQ721
KM4216C528
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TMS4256FML
Abstract: TMS4256 TMS4256-12 TMS4256-20 AZ31
Text: ADVANCE INFORMATION TM4256GP8, TM4256GV8 262,144 BY 8-BIT DYNAMIC RAM MODULES OCTOBER 1 9 8 5 - V SINGLE-IN-LINE PA C K A G Er 2 6 2 ,1 4 4 X 8 Organization TOP VIEW Single 5 -V Supply {1 0 % Tolerance) 30-Pin Single-in-Line Package (SIP) — Pinned Module for Through-Hole
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TM4256GP8,
TM4256GV8
30-Pin
TM4256GV8)
TM4256GP8)
TMS4256
TM4256G
TMS4256FML
TMS4256-12
TMS4256-20
AZ31
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HM62V8512LFP
Abstract: HM53861J M51419 16M dram dram zip 256kx16 m514280 hn27c1024hg 4M DRAM EDO M5241605 HM534253BT
Text: Memories Dynamic RAMs DRAM Access time ns 60 80 {HM5116100AS/ATS J F.P. 4k refresh -4Mx4 - {HM5116400AS/ATS ] F.P. 4k refresh 1HM51W16400AS/ATS ] F.P. 4k refresh 1HM5117400AS/ATS ] F.P. 2k refresh -3.3V operation- 16M- 70 -16Mx1 -3.3V operation— 2Mx8 -3.3V operation-
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-16Mx1
operation60
HM5116100AS/ATS
HM5116400AS/ATS
1HM51W16400AS/ATS
1HM5117400AS/ATS
HM51W17400ATS
HM5117800BJ/BTT
HM5117805BJ/BTT
HM51W17800BJ/BTT
HM62V8512LFP
HM53861J
M51419
16M dram
dram zip 256kx16
m514280
hn27c1024hg
4M DRAM EDO
M5241605
HM534253BT
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MCM511000BJ60
Abstract: CM511000 256Kx1 dRAM MCM511000 MCM511000BZ80 mcm511000bj L1219
Text: MOTOROLA SEM ICONDUCTOR TECHNICAL DATA MCM511000B MCM51L1000B 1Mx1 CMOS Dynamic RAM Page Mode The M C M 511000B is a 0.8p CMOS high-speed, dynamic random access memory. It is organized as 1,048,576 one-bit words and fabricated with CMOS silicon-gate process
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511000B
MCM511000B
300-mi!
100-mil
MCM51L1000B
MCM511000BJ60
MCM5110OOBJBO
MCM51L1000BJ60
CM511000
256Kx1 dRAM
MCM511000
MCM511000BZ80
mcm511000bj
L1219
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1mx1 DRAM DIP
Abstract: 1mx1 DRAM 1MX1
Text: D A LLA S s e m ic o n d u c t o r FEATURES • Provides 3-wire serial acoess to DRAM • Converts DRAM into nonvolatile memory using external backup supply • Addresses up to 16Mx1 of memory • Data can be read from or written to DRAM via single or multi-bit transfers
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16Mx1
28-pin
DS1262S)
DS1262
1mx1 DRAM DIP
1mx1 DRAM
1MX1
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Untitled
Abstract: No abstract text available
Text: DALLAS DS1262 Serial DRAM Nonvolatizer Chip s e m ic o n d u c to r PIN DESCRIPTION FEATURES • Provides 3-wire serial access to DRAM • Converts DRAM into nonvolatile memory using external backup supply • Addresses up to 16Mx1 of memory • Data can be read from or written to DRAM
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DS1262
16Mx1
DS1262
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