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    286MM2 Price and Stock

    3M 10MM-22.86MM-25-8815

    THERM PAD 22.86MMX10MM 1=25/PK
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    DigiKey 10MM-22.86MM-25-8815 Bulk 1
    • 1 $27.43
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    3M 8.13MM-22.86MM-25-8810

    THERM PAD 22.86MMX8.13MM 1=25/PK
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    DigiKey 8.13MM-22.86MM-25-8810 Bulk 1
    • 1 $21.88
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    3M 17.78MM-22.86MM-25-8815

    THERM PAD 22.86MMX17.78MM 1=25PK
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    DigiKey 17.78MM-22.86MM-25-8815 Bulk 1
    • 1 $31.87
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    3M 17.78MM-22.86MM-25-8810

    THERM PAD 22.86MMX17.78MM 1=25PK
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    DigiKey 17.78MM-22.86MM-25-8810 Bulk 1
    • 1 $26.58
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    3M 10MM-22.86MM-25-5590H-05

    THERM PAD 22.86MMX10MM 1=25/PK
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    DigiKey 10MM-22.86MM-25-5590H-05 Bulk 1
    • 1 $24.83
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    286MM2 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: 2M x 64 Flash Multi-Chip Package Optimum Density and Performance in One Package W72M64V-XBX Features Designed to complement PowerPC high performance memory controllers see page 2 for typical application block diagram Performance Features • Simultaneous Read/Write operations


    Original     		PDF W72M64V-XBX 16MByte 128Mb) 2Mx64 150ns x64/x72 W72M64V-XBX MIF2033

    W3E2M64S-XSBX

    Abstract: No abstract text available
    Text: 32M x 64 DDR SDRAM Optimum Density and Performance in One Package W3E32M64S-XSBX* The W3E2M64S-XSBX is a member if WEDC’s high density/high preformance family of Double Data Rate DDR SDRAM’s designed to support high performance processors. Product Features


    Original     		PDF W3E32M64S-XSBX* W3E2M64S-XSBX 125mm2 500mm2 286mm2 W3E32M6GS-XSBX MIF2045

    TSOP 66 Package

    Abstract: W3E32M64S-XSBX
    Text: 32M x 64 DDR SDRAM Optimum Density and Performance in One Package W3E32M64S-XSBX* The W3E32M64S-XSBX is a member of WEDC’s high density/high performance family of Double Data Rate DDR SDRAM’s designed to support high performance processors. Product Features


    Original     		PDF W3E32M64S-XSBX* W3E32M64S-XSBX MIF2045 TSOP 66 Package

    Untitled

    Abstract: No abstract text available
    Text: 8M x 32 32MB Flash Optimum Density and Performance in One Package W78M32V-XBX* Features The W78M32V-XBX is member of WEDC’s high density/high performance family of Flash MCPs. Designed to complement high performance processors and memory controllers. (See page 2 for typical block diagram).


    Original     		PDF W78M32V-XBX* W78M32V-XBX 32MByte 256Mb) 120ns x64/x72 W78M32V-XBX W82M32V-XBX MIF20

    Untitled

    Abstract: No abstract text available
    Text: 8M x 64 64MB Flash Optimum Density and Performance in One Package W78M64V-XSBX* Features The W78M64V-XSBX is member of WEDC’s high density/high performance family of Flash MCPs. Designed to complement high performance processors and memory controllers. (See page 2 for typical block diagram).


    Original     		PDF W78M64V-XSBX* W78M64V-XSBX 64MByte 512Mb) 120ns Bank50% 414mm2 286mm2 W82M64V-XSBX MIF2044

    Sn63pB37 tds

    Abstract: W3E32M64S-XSBX TSOP66
    Text: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES „ DDR SDRAM rate = 200, 250, 266, 333* „ Package: BENEFITS „ • 208 Plastic Ball Grid Array PBGA , 13 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible) „ Differential clock inputs (CK and CK#)


    Original     		PDF W3E32M64S-XSBX 32Mx64 Sn63pB37 tds W3E32M64S-XSBX TSOP66

    Untitled

    Abstract: No abstract text available
    Text: TECHNICAL ARTICLE | Join | Tweet Connect Maximizing Performance and Integration in Applications Requiring Isolated SPI by Mark Cantrell and Bikiran Goswami, Analog Devices, Inc. Real-World SPI Implementation SPI is a very useful and flexible standard, but its flexibility stems from its


    Original     		PDF TA13071-0-3/15

    Untitled

    Abstract: No abstract text available
    Text: W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS  DDR SDRAM rate = 200, 250, 266, 333*  73% Space Savings vs. FPBGA  Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm  Reduced part count  2.5V ±0.2V core power supply


    Original     		PDF W3E32M64S-XSBX 32Mx64

    Untitled

    Abstract: No abstract text available
    Text: W3E32M64S-XB3X 256 – 32Mx64 DDR SDRAM FEATURES BENEFITS  DDR SDRAM rate = 200, 250, 266, 333*  73% Space Savings vs. FPBGA  Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm  Reduced part count


    Original     		PDF W3E32M64S-XB3X 32Mx64 cycle55Â

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W332M64V-XSBX ADVANCED* 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125MHz Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm The 256MByte (2Gb) SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing


    Original     		PDF W332M64V-XSBX 32Mx64 125MHz 256MByte 728-bit W332M64V-ESSB

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS „ DDR SDRAM rate = 200, 250, 266, 333* „ „ Package: „ • 208 Plastic Ball Grid Array PBGA , 13 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible) „ Differential clock inputs (CK and CK#)


    Original     		PDF W3E32M64S-XSBX 32Mx64 PCN04019 333Mbs

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W332M64V-XSBX PRELIMINARY* 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125MHz Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm The 256MByte (2Gb) SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing


    Original     		PDF W332M64V-XSBX 32Mx64 125MHz 256MByte 728-bit

    Untitled

    Abstract: No abstract text available
    Text: W332M64V-XSBX 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION  High Frequency = 100, 125, 133MHz The 256MByte 2Gb SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing 536,870,912 bits. Each chip is internally configured as a quad-bank DRAM with


    Original     		PDF W332M64V-XSBX 32Mx64 133MHz W332M64V-XSBX 256MByte 133MHz

    VCCQ15

    Abstract: No abstract text available
    Text: W3E32M64S-XSBX 32Mx64 DDR SDRAM Advanced* FEATURES BENEFITS „ DDR SDRAM rate = 200, 250, 266 „ Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible) „ Differential clock inputs (CK and CK)


    Original     		PDF W3E32M64S-XSBX 32Mx64 200MHz 250MHz 266MHz VCCQ15

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M64S-XSBX PRELIMINARY* 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% SPACE SAVINGS vs. TSOP Package: • 43% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count


    Original     		PDF W3E32M64S-XSBX 32Mx64 333Mbs/166MHz PCN04019

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% Space Savings vs. FPBGA Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count 2.5V ±0.2V core power supply


    Original     		PDF W3E32M64S-XSBX 32Mx64 PCN04019 333Mbs

    W332M64V-XSBX

    Abstract: No abstract text available
    Text: White Electronic Designs W332M64V-XSBX 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125, 133MHz Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm The 256MByte (2Gb) SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing


    Original     		PDF W332M64V-XSBX 32Mx64 133MHz 256MByte 728-bit 133MHz W332M64V-XSBX

    TSOP RECEIVER

    Abstract: W3E32M64S-XSBX Theta JC of FBGA
    Text: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS „ DDR SDRAM rate = 200, 250, 266, 333* „ „ Package: „ • 208 Plastic Ball Grid Array PBGA , 13 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible) „ Differential clock inputs (CK and CK#)


    Original     		PDF W3E32M64S-XSBX 32Mx64 TSOP RECEIVER W3E32M64S-XSBX Theta JC of FBGA

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES „ DDR SDRAM rate = 200, 250, 266, 333*, 400* „ Package: BENEFITS „ • 208 Plastic Ball Grid Array PBGA , 13 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible) „


    Original     		PDF 32Mx64 333Mbs 400Mbs

    Untitled

    Abstract: No abstract text available
    Text: 32M x 64 DDR SDRAM Optimum Density and Performance in One Package W3E32M64S-XSBX* The W3E32M64S-XSBX is a member if WEDC’s high density/high preformance family of Double Data Rate DDR SDRAM’s designed to support high performance processors. Product Features


    Original     		PDF W3E32M64S-XSBX* W3E32M64S-XSBX MIF2045