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    MS-013 Package

    Abstract: 2QSP24 MO-137 MS-013 cfb20q
    Text: For technical assistance use the Microelectronics Products number on the back cover. Features • ■ ■ ■ Applications 8 T-filters with common ground Stable thin-film-on-silicon technology Ultra-miniature packages to JEDEC standards For package dimensions see page XX


    Original     		PDF O-236. MS-012. 2NBS14, 2NBS16 2NBS08 MS-013 Package 2QSP24 MO-137 MS-013 cfb20q

    MS-013 Package

    Abstract: CTA20Q 2QSP24 MO-137 MS-013 2TSP24
    Text: For technical assistance use the Microelectronics Products number on the back cover. Features • ■ ■ ■ Applications 18 RC terminators tied to a common node Stable thin-film-on-silicon technology Ultra-miniature packages to JEDEC standards For package dimensions see page XX


    Original     		PDF O-236. MS-012. 2NBS14, 2NBS16 2NBS08 MS-013 Package CTA20Q 2QSP24 MO-137 MS-013 2TSP24

    Untitled

    Abstract: No abstract text available
    Text: MiniNet THIN-FILM-ON-SILICON TSSOP RESISTOR NETWORKS, 20, 24 AND 28 PIN • Miniaturized circuitry and packaging for space reduction ■ Silicon-based for increased functionality in a single package ■ Custom circuit capabilities upon request ■ Passivated Tantalum Nitride


    OCR Scan     		PDF 10K/20K 25K/50K TSP20J' MO-153.