HM514101B
Abstract: HB56B49 HM514101BS 30-pin 9-bit ram module
Text: HB56B49 Series Maintenance only 4,194,304-word x 9-bit High Density Dynamic RAM Module The HB56B49 is a 4M × 9 dynamic RAM module, mounted nine 4-Mbit DRAM HM514101BS sealed in SOJ package. An outline of the HB56B49 is 30-pin single in-line package having
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HB56B49
304-word
HM514101BS)
30-pin
HB56B49AR,
HB56B49ATR)
HB56B49BR)
HB56B49
HM514101B
HM514101BS
30-pin 9-bit ram module
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HB56A169
Abstract: No abstract text available
Text: HB56A169 Series 16,777,216-word x 9-bit High Density Dynamic RAM Module The HB56A169 is a 16 M × 9 dynamic RAM module, mounted 9 pieces of 16-Mbit DRAM HM5116100AS sealed in SOJ package. An outline of the HB56A169 is 30-pin single in-line package. Therefore, the HB56A169 makes high
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HB56A169
216-word
16-Mbit
HM5116100AS)
30-pin
HB56A169AR-6A
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HB56C49
Abstract: No abstract text available
Text: HB56C49 Series Maintenance only 4,194,304-word x 9-bit High Density Dynamic RAM Module The HB56C49 is a 4 M × 9 dynamic RAM module, mounted nine 4-Mbit DRAM HM514102BS sealed in SOJ package. An outline of the HB56C49 is 30-pin single in-line package having Lead types (HB56C49AR,
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HB56C49
304-word
HM514102BS)
30-pin
HB56C49AR,
HB56C49ATR)
HB56C49BR)
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IC BD 540 LYS
Abstract: 32T0 BD 540 LYS m-56a Hitachi DSA0088 HB56A169 D-83622 C42S
Text: HB56A169BR-6B/7B/8B Preliminary 16,777,216-Word x 9-Bit High Density Dynamic RAM Module Rev. 0 Jul. 17, 1995 The HB56A169 is a 16M x 9 dynamic RAM module, mounted 9 pieces of 16-Mbit DRAM HM5116100BS sealed in SOJ package. An outline of the HB56A169 is 30-pin single inline package. Therefore, the HB56A169 makes
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HB56A169BR-6B/7B/8B
216-Word
HB56A169
16-Mbit
HM5116100BS)
30-pin
HB56A169BR-6B
IC BD 540 LYS
32T0
BD 540 LYS
m-56a
Hitachi DSA0088
D-83622
C42S
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HB56A49BR-7B
Abstract: HB56A49
Text: HB56A49 Series 4,194,304-word x 9-bit High Density Dynamic RAM Module The HB56A49 is a 4M × 9 dynamic RAM module, mounted nine 4-Mbit DRAM HM514100BS /BLS/CS/CLS sealed in SOJ package. An outline of the HB56A49 is 30-pin single in-line package having lead types (HB56A49AR/ATR), socket
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HB56A49
304-word
HM514100BS
30-pin
HB56A49AR/ATR)
HB56A49BR)
HB56A49
HB56A49BR-7B
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YL-69
Abstract: No abstract text available
Text: NEC Electronics Inc. MC-421000A9 1,048,576 X 9-Bit Dynamic CMOS RAM Module Description Pin Configurations The M C-421000A9 is a fas t-p a g e 1,048,576-word by 9-bit dynam ic RAM m odule designed to o perate from a single + 5-volt pow er supply. 30-Pin Leaded SIMM MC-421000A9A/AA/AB
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MC-421000A9
C-421000A9
576-word
30-Pin
MC-421000A9A/AA/AB)
/JPD421000)
/L/PD424400)
YL-69
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MC-421000A9B
Abstract: 30-pin nec
Text: NEC Electronics Inc. MC-421000A9 1,048,576 X 9-Bit Dynamic CMOS RAM Module Description Pin Configurations The M C-421000A9 is a fast-p ag e 1,048,576-word by 9-bit dynam ic RAM m odule designed to o perate from a single + 5-volt pow er supply. 30-Pin Leaded SIMM MC-421000A9A/AA/AB
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MC-421000A9
576-word
C-421000A9
/PD421000)
UPD424400)
/JPD421000)
30-Pin
MC-421000A9A/AA/AB)
MC-421000A9
MC-421000A9B
30-pin nec
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256k 30-pin SIMM
Abstract: 30-pin simm memory
Text: MEC NEC Electronics Inc. MC-42256AB9 262,144 x 9-Bit Dynamic CMOS RAM Module Description Pin Configurations The MC-42256AB9 is a 262,144-word by 9-bit DRAM module designed to operate from a single +5-volt power supply. The module is a 30-pin socket-mountable
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MC-42256AB9
144-word
30-pin
/JPD424256LA
/JPD42256L
/JPD42256
144-woW
256k 30-pin SIMM
30-pin simm memory
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Untitled
Abstract: No abstract text available
Text: HB56 A49 A/AT/B-8/10/12 9-Bit DRAM I PIN OUT 4,194,304-Word x 9 Bit High Density Dynamic RAM Module • DESCRIPTION T he H B 56A 49 is a 4M x 9 dynam ic RAM m odule, mounted nine 4M bit DR AM HM 514100JP sealed in SOJ package. An outline of the H B 56A 49 is 30-pin single in-line package having Lead types
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/AT/B-8/10/12
304-Word
514100JP)
30-pin
HB56A49A,
HB56A49AT)
56A49B)
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30-pin simm memory "16m x 8"
Abstract: No abstract text available
Text: STI916100 30-PIN SIMMS 1 6 MX 9 DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • The Simple Technology STI916100 is a 16M bit x 9 Dynamic RAM high density memory module. The Simple Technology STI916100 consist of nine CMOS 16M x 1 DRAMs in 24-pin SOJ package mounted on a 30-pin glass epoxy substrate. A
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STI916100
30-PIN
STI916100
24-pin
STI916100-xxT)
STI916100-xxG)
30-pin simm memory "16m x 8"
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HM511000
Abstract: No abstract text available
Text: HB56A19L S eries-1,048,576-Word x 9-Bit High Density Dynamic RAM Module • DESCRIPTION ■ PIN OUT The HB56A19 is a 1M x 9 dynamic RAM module, mount ed nine 1 Mbit DRAM HM511000ALJP sealed in SOJ pack age. An outline of the HB56A19 is 30-pin single in-line pack
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HB56A19L
576-Word
HB56A19
HM511000ALJP)
30-pin
HB56A19A,
HB56A19AT)
HB56A19B,
HB56A19GB)
HM511000
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MT1257
Abstract: SIMM 30-pin 30 pin simm 30-pin simm memory 30-pin SIMM RAM "30 pin simm" simm 30-pin 9-bit 30 pin simm memory MT82 ia4a5
Text: IICRON vis/ 'TO257M MT9257M TECHNOLOGY, INC. 2805 East Columbia Road Boise, Idaho 83706 TEL. 208 386-3900 TWX 910-970-5973 256K x 8 BIT DYNAMIC RAM 256K x 9 BIT DYNAMIC RAM / n f\ . We're building our reputation on innovation, FEATURES •Industry standard pin out in a 30-pin single-in-line memory module (SIMM)
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/ITB257M
MT9257M
30-pin
135mW
1350mW
MT1257
SIMM 30-pin
30 pin simm
30-pin simm memory
30-pin SIMM RAM
"30 pin simm"
simm 30-pin 9-bit
30 pin simm memory
MT82
ia4a5
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MT1257
Abstract: T9257 block and pin diagram of 8257
Text: ìk '/ITB257M MT9257M IICRON v ry TECHNOLOGY, INC. 2805 East Columbia Road Boise, Idaho 83706 TEL. 208 386-3900 TW X 910-970-5973 256K x 8 BIT DYNAMIC RAM 256K x 9 BIT DYNAMIC RAM ¿MLITT AltUtIO Wte’re building our reputation on innovation. FEATURES •Industry standard pin out in a 30-pin single-in-line mem ory module (S IM M )
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/ITB257M
MT9257M
30-pin
135mW
1350m
T8257/M
T9257
MT1257RJ
MT1257
block and pin diagram of 8257
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Untitled
Abstract: No abstract text available
Text: 30-PIN SIMMS STI91000 1M X 9 DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • The Simple Technology STI91000 is a 1M bit x 9 Dynamic RAM high density memory module. The Simple Technology STI91000 consist of nine CMOS 1M x 1 DRAMs in 20-pin SOJ package
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STI91000
STI91000-60
STI91000-70
STI91000-80
110ns
130ns
150ns
30-PIN
STI91000
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we221
Abstract: No abstract text available
Text: H B 5 6 C 1 9 A /A T /B - 8 A /1 0 A /1 2 A 1,048,576-Word x 9-Bit High Density Dynamic RAM Module Pin No. • DESCRIPTION The HB56C19 is a 1M x 9 static column mode dynamic RAM module, mounted nine 1-Mbit DRAM HM511002JP sealed in SOJ package. An outline of the HB56C19 is 30-pin single in-line package
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576-Word
HB56C19
HM511002JP)
30-pin
HB56C19AT)
HB56C19B)
HM511002A
we221
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Untitled
Abstract: No abstract text available
Text: HB561409 Series-262,144-word x 9-bit Dynamic Random Access Memory Module The HB561409 is a 256k x 9 dynamic RAM module, mounted 9 pieces of 256k-bit DRAM HM51256CP sealed in PLCC package. An outline of the HB561409 is 30-pin single in-line package having two types; Lead type (HB561409A) and Socket
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HB561409
Series----------262
144-word
256k-bit
HM51256CP)
30-pin
HB561409A)
HB561409B)
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HB561409B-10
Abstract: 30-pin simm memory 180NS hm51256 256k 30-pin SIMM 30-pin simm memory dynamic simm 30-pin 9-bit 30-pin SIMM RAM SIMM 30-pin HB561409A
Text: HB561409 Series 262,144-word x 9-bit Dynamic Random Access Memory Module The HB561409 is a 256k x 9 dynamic RAM module, mounted 9 pieces of 256k-bit DRAM HM51256CP sealed in PLCC package. An outline of the HB561409 is 30-pin single in-line package having two types; Lead type (HB561409A) and Socket
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HB561409
144-word
256k-bit
HM51256CP)
HB561409
30-pin
HB561409A)
HB561409B)
HB561409B-10
30-pin simm memory
180NS
hm51256
256k 30-pin SIMM
30-pin simm memory dynamic
simm 30-pin 9-bit
30-pin SIMM RAM
SIMM 30-pin
HB561409A
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EADS-80
Abstract: No abstract text available
Text: TM4100EAD9 4194304 BY 9-BIT DYNAMIC RAM MODULE SMMS419C - NOVEMBER 1991 - REVISED JUNE 1995 Organization . . . 4194304 x 9 SINGLE IN-LINE MODULE Single 5-V Power Supply ±10% Tolerance (TOP VIEW) 30-Pin Single In-Line Memory Module (SIMM) for Use With Sockets
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TM4100EAD9
SMMS419C
30-Pin
4100EAD9-60
4100EAD9-70
4100EAD9-80
EADS-80
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HB56A19B
Abstract: HB56A19B8A HB56A19B10A HB56A19B-7H 511000a HB56A19AT10A HB56A19B-8A HB56A19
Text: HB56A19 Series 1,048,576-Word x 9-Bit High Density Dynamic RAM Module • DESCRIPTION The HB56A19 is a 1M x 9 dynamic RAM module, mounted nine 1-Mbit DRAM H M 511000JP sealed in SOJ package. An outline of the HB56A19 is 30-pin single in-line package having Lead types (HB56A19A, HB56A19AT), Socket type
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HB56A19
576-Word
511000JP)
30-pin
HB56A19A,
HB56A19AT)
HB56A19B)
HB56A19B
HB56A19B8A
HB56A19B10A
HB56A19B-7H
511000a
HB56A19AT10A
HB56A19B-8A
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30-pin SIMM RAM
Abstract: No abstract text available
Text: STI94000 30-PIN SIMMS 4M X 9 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • The Simple Technology STI94000 is a 4M bit x 9 Dynamic RAM high density memory module. The Simple Technology STI94000 consist of nine CMOS 4 M x 1 DRAMs in 20-pin SOJ package
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STI94000
30-PIN
110ns
130ns
150ns
STI94000
20-pin
30-pin SIMM RAM
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Untitled
Abstract: No abstract text available
Text: HB56A19A/AT/B-6H/7H/8A/10A/12A 1,048,576-Word x 9-Bit High Density Dynamic RAM Module P in N o . • DESCRIPTION The HB56A19 is a 1M x 9 dynamic RAM module, mounted nine 1-Mbit DRAM HM511000JP sealed in SOJ package. An outline of the HB56A19 is 30-pin single in-line package having Lead types
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HB56A19A/AT/B-6H/7H/8A/10A/12A
576-Word
HB56A19
HM511000JP)
30-pin
HB56A19A,
HB56A19AT)
HB56A19B)
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GM71C4100BI
Abstract: GMM794000 GM71C4100 iqm7
Text: @ LG Semicon. Co. LTD. Description Features The GMM794000BS is a 4M x 9 bits Dynamic RAM Module which is assembled 9 pieces of 4M bit DRAM GM71C4100BJ, 4Mxl in 20/26 pin small out-line J-form on a 30 pin single in-line package. The GMM794000BS is a socket type memory
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GMM794000BS
GM71C4100BJ,
GMM794000BS-60
GMM794000BS-70
GMM794000BS-
00D7b04
0007b05
0007b0L>
GM71C4100BI
GMM794000
GM71C4100
iqm7
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Untitled
Abstract: No abstract text available
Text: KMM594000A DRAM MODULES 4 M X 9 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KMM594000A is a 4M bit X 9 Dynamic RAM high density memory module. The Samsung KMM594000A consist of nine KM41C4000AJ DRAMs in 20-pin SOJ package mounted on a 30-pin glass-epoxy
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KMM594000A
130ns
150ns
180ns
KMM594000A
30-pin
KM41C4000AJ
20-pin
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Samsung Capacitor sms
Abstract: km41c4000aj KM41C4000A
Text: D3AM MODULES KMM59400QA 4 M X 9 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KMM594000A is a 4M bit X 9 Dynamic RAM high density memory module. The Samsung KMM594000A consist of nine KM41C4000AJ DRAMs in 20-pin SOJ package mounted on a 30-pin glass-epoxy
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KMM59400QA
KMM594000A
KM41C4000AJ
20-pin
30-pin
KMM594000A-
Samsung Capacitor sms
KM41C4000A
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