3000S30 Search Results

3000S30 Price and Stock

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The Bergquist Company GP3000S30-0.125-02-0816 THERM PAD 406.4X203.2MM BLUE
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GP3000S30-0.125-02-0816	Bulk	26		1	1 $246.38 10 $195.938 100 $168.7704 1000 $168.7704 10000 $168.7704	Buy Now
Mouser Electronics	GP3000S30-0.125-02-0816		164			1 $198.3 10 $172.14 100 $172.14 1000 $172.14 10000 $172.14	Buy Now
The Bergquist Company GP3000S30-0.100-02-0816-NA THERM PAD 406.4X203.2MM BLUE
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GP3000S30-0.100-02-0816-NA	Bulk	6		1	1 $200.12 10 $188.348 100 $200.12 1000 $200.12 10000 $200.12	Buy Now
Orbel Corporation GRVC-3000S3000-0200X COVER RF SHIELD GROOVE LOC 3 "
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GRVC-3000S3000-0200X	Box			100	1 - 10 - 100 $11.6023 1000 $11.6023 10000 $11.6023	Buy Now
The Bergquist Company GP3000S30-0.08-02-0816-NA THERM PAD 406.4X203.2MM BLUE
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GP3000S30-0.08-02-0816-NA	Bulk			6	1 - 10 $180.32 100 $180.32 1000 $180.32 10000 $180.32	Buy Now
The Bergquist Company GP3000S30-0.020-02-0816-NA THERM PAD 406.4X203.2MM BLUE
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GP3000S30-0.020-02-0816-NA	Bulk			50	1 - 10 - 100 $67.56 1000 $67.56 10000 $67.56	Buy Now

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3000S30 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
D575 Abstract: ASTM D575 D792 C351 D149 D150 D2240 D257 D374 Bergquist Company Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 3000S30 • Thermal conductivity = 3.0 W/mK • Low S-Class thermal resistance at very low pressures • Conformable low hardness	Original	PDF	3000S30 D575 ASTM D575 D792 C351 D149 D150 D2240 D257 D374 Bergquist Company
Untitled Abstract: No abstract text available Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance at very low pressures • Highly conformable,“S-Class” softness	Original	PDF	3000S30 3000S30
BERGQUIST Abstract: 3000S30 conductivity Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 3000S30 PROPERTY Color • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance at very low pressures	Original	PDF	3000S30 3000S30 BERGQUIST conductivity
Untitled Abstract: No abstract text available Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE	Original	PDF
74 hc 59581 Abstract: b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16 Text: 717 Technical portal and online community for Design Engineers - www.element-14.com Semiconductor Hardware & Thermal Management Page Page 727 725 725 732 739 732 749 736 725 724 723 723 724 721 720 722 726 752 728 751 Crystal Oscillator Sockets . . . . . . . . . . . . . . . . . .	Original	PDF	element-14 74 hc 59581 b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16