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    30A04 Search Results

    30A04 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MSP430A048IPMR Texas Instruments 16-Bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, Comparator, 96 segment LCD 64-LQFP -40 to 85 Visit Texas Instruments
    MSP430A045IPWR Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 4kB Flash, 256B RAM, 10 bit ADC 20-TSSOP -40 to 85 Visit Texas Instruments Buy
    MSP430A048IPM Texas Instruments 16-Bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, Comparator, 96 segment LCD 64-LQFP -40 to 85 Visit Texas Instruments Buy
    MSP430A047IPZR Texas Instruments 16-Bit Ultra-Low-Power Microcontroller, 32kB Flash, 1024B RAM, 12-Bit ADC, USART, 160 Segment LCD 100-LQFP -40 to 85 Visit Texas Instruments
    MSP430A046IPZR Texas Instruments 16-Bit Ultra-Low-Power MCU, 60kB Flash, 2048B RAM, 12-Bit ADC, 2 USARTs HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85 Visit Texas Instruments
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    30A04 Price and Stock

    TDK Epcos B65813N0630A048

    FERRITE CORE RM 630NH N48 2PCS
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    DigiKey B65813N0630A048 Box 2,487 1
    • 1 $5.8
    • 10 $4.937
    • 100 $3.6492
    • 1000 $2.98137
    • 10000 $2.98137
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    Newark B65813N0630A048 Bulk 335 1
    • 1 $6.03
    • 10 $5.14
    • 100 $3.4
    • 1000 $3.24
    • 10000 $3.24
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    Kyocera AVX Components UCQS30A045-TE24L2

    DIODE ARR SCHOTT 45V 30A TO263LP
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    DigiKey UCQS30A045-TE24L2 Cut Tape 1,900 1
    • 1 $2.5
    • 10 $1.706
    • 100 $2.5
    • 1000 $0.94161
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    UCQS30A045-TE24L2 Digi-Reel 1,900 1
    • 1 $2.5
    • 10 $1.706
    • 100 $2.5
    • 1000 $0.94161
    • 10000 $0.94161
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    Newark UCQS30A045-TE24L2 Cut Tape 1,990 1
    • 1 $3.27
    • 10 $3.12
    • 100 $2.32
    • 1000 $2.02
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    TTI UCQS30A045-TE24L2 Reel 2,000 2,000
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    Qualcomm BC6130A04-IQQB-R

    IC RF TXRX+MCU BLE 48QFN
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    DigiKey BC6130A04-IQQB-R Digi-Reel 1,694 1
    • 1 $2.57
    • 10 $1.945
    • 100 $1.5227
    • 1000 $1.24894
    • 10000 $1.24894
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    BC6130A04-IQQB-R Cut Tape 1,694 1
    • 1 $2.57
    • 10 $1.945
    • 100 $1.5227
    • 1000 $1.24894
    • 10000 $1.24894
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    TDK Epcos B59008C0130A040

    SENSOR PTC 250OHM RADIAL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey B59008C0130A040 Bulk 973 1
    • 1 $1.51
    • 10 $1.51
    • 100 $0.9274
    • 1000 $0.72692
    • 10000 $0.61675
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    TDK Epcos B65701T0630A048

    FERRITE CORE P 630NH N48 2PCS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey B65701T0630A048 Tray 247 1
    • 1 $10.5
    • 10 $7.032
    • 100 $5.69875
    • 1000 $5.69875
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    Find more 30A04 price and stock on Findchips.com

    30A04 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    vdr 275

    Abstract: No abstract text available
    Text: 512Kx16/256Kx32, 20 - 45ns, PGA 30A044-03 F 8 Megabit High Speed CMOS SRAM DPS256X32CV3/DPS256X32BV3 DESCRIPTION: The DPS256X32CV3/DPS256X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted


    Original     		PDF 512Kx16/256Kx32, 30A044-03 DPS256X32CV3/DPS256X32BV3 DPS256X32CV3/DPS256X32BV3 DPS256X32BV3 DPS256X32CV3 500mV vdr 275

    Untitled

    Abstract: No abstract text available
    Text: SBD T y p e : FCH30 FCH30A0 30A04 A04 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A04


    Original     		PDF FCH30 FCH30A0 30A04 O-220AB FCH30A04

    30A04

    Abstract: FCH30A0
    Text: SBD T y p e : FCH30 FCH30A0 30A04 A04 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A04


    Original     		PDF FCH30 FCH30A0 30A04 O-220AB FCH30A04

    FCH30A04

    Abstract: No abstract text available
    Text: SBD T y p e : FCH30 FCH30A0 30A04 A04 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A04


    Original     		PDF FCH30A04 O-220AB FCH30A04

    FCH30A04

    Abstract: No abstract text available
    Text: SBD T y p e : FCH30 FCH30A0 30A04 A04 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A04


    Original     		PDF FCH30A04 O-220AB FCH30A04

    30021

    Abstract: L48C L41C IC L44C DATASHEET L30C l31c L43C ORSO42G5 ORSO82G5 ORT42G5
    Text: ORCA ORSO42G5 and ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs August 2005 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and


    Original     		PDF ORSO42G5 ORSO82G5 ORSO82G5 ORSO42G5-1BMN484I ORSO82G5-2FN680I 30021 L48C L41C IC L44C DATASHEET L30C l31c L43C ORT42G5

    DPS128X32BV3

    Abstract: DPS128X32CV3
    Text: 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC


    Original     		PDF DPS128X32CV3/DPS128X32BV3 DPS128X32CV3/DPS128X32BV3 500mV DPS128X32CV3 30A044-24 DPS128X32BV3

    AL437

    Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C
    Text: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two


    Original     		PDF 8b/10b OIF-SPI4-02 ORSPI4-1FE1036IES ORSPI4-F1156IES ORSPI4-2FE1036CES ORSPI4-1FE1036CES ORSPI4-2F1156CES ORSPI4-1F1156CES AL437 L97c L235C L103T L41C L140C L94C l165c L239C L43C

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS EEPROM DPE512S8N DESCRIPTION: The DPE512S8N is a 512K X 8 high-density, low-power EEPROM module comprised of four ceramic 128K X 8 monolithic EEPROM's, an advanced high-speed CMOS decoder and decoupling capacitors surface mounted on a co-fired ceramic substrate


    OCR Scan     		PDF DPE512S8N DPE512S8N 600-mil-wide, 32-pin 300ns 30A046-00

    Untitled

    Abstract: No abstract text available
    Text: DPS128X32AV3 HIG H SPEED 128K X 32 CMOS SRAM VERSA-STACK ADVANCED INFORMATION DESCRIPTION: The DPS128X32AV3 "VERSA-STACK" m odule is a re vo lu tio n a ry new high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers SLCC m ounted on a co-fired


    OCR Scan     		PDF DPS128X32AV3 DPS128X32AV3 30A044-21

    Untitled

    Abstract: No abstract text available
    Text: ^ f= ¡| j¡ñ ¡P > 'v.:. U DPS256X32AV3 ^ l v l Dense-Pac Microsystems, In c ^ y _ H IG H SPEED 256K X 32 C M O S SR A M VERSA-STACK w ADVANCED INFORMATION DESCRIPTION: The D PS2 5 6 X3 2 A V 3 "V E R SA -ST A C K " module is a revolutionary new high speed memory subsystem


    OCR Scan     		PDF DPS256X32AV3 30A044-01 I/014

    Untitled

    Abstract: No abstract text available
    Text: D P V 128X 16A H IG H S PEED 1 2 8 K X 16 U V E P R O M P G A M O D U L E PRELIM IN ARY D ESCRIPTIO N: The DPV128X16A is a 40-pin Pin Grid Array PG A consisting of two 128K X 8 U V EP R O M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV128X16A 40-pin 250ns V128X16 120ns 150ns 170ns 200ns -t-85

    Untitled

    Abstract: No abstract text available
    Text: DPS128X24V3 Dense-Pac Microsystems, Inc. CERAMIC 128K X 24 C M O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: T he D P S 1 2 8 X 2 4 V 3 " V E R S A - S T A C K " m odule is a r e v o lu t io n a r y n e w m e m o r y s u b s y s t e m u s in g Dense-Pac M icrosyste m s' ceram ic Stackable Leadless


    OCR Scan     		PDF DPS128X24V3 30A044-30

    Untitled

    Abstract: No abstract text available
    Text: Dense-Pac Microsystems, Inc. ^ D P S 1 2 8 X 1 6 A 3 CERAM IC 128K X ¡ 6 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS128X16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a


    OCR Scan     		PDF DPS128X16A3 DPS128X16A3

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS256C32BV3 DESCRIPTION: The DPS256C32BV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic


    OCR Scan     		PDF DPS256C32BV3 DPS256C32BV3 128Kx 30A044-08

    A2631

    Abstract: No abstract text available
    Text: DENSE-PAC M ie R O S ì S 16 Megabit High Speed CM OS SRAM D PS512X32C V3 i li M S D E S C R IP T IO N : The DP5512X32CV3 "VERSA-STACK" module is a revolutionarynew high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ


    OCR Scan     		PDF PS512X32C DP5512X32CV3 DPS512X32CV3 500mV 30A044-13 30A044-1 A2631

    DPS128C32BV3

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: T he D P S 128C 32B V 3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic


    OCR Scan     		PDF DPS128C32BV3 DPS128C32BV3 500mV 00012flb 30A044-28

    cdr 03a

    Abstract: PESTO MCC 90-15 Dense-Pac Microsystems T-46-23-74 836 mgc
    Text: DENSE-PAC MICROSYSTEMS 2ÖE J> • 275=1415 ODGG7ÖO 2 « D P C DPS1MS8A3 Dense-Pac M k ro iy siem s jn c ^ 1024 |<X 8 BUFFERED/DECODED C M O S SRAM M O D ULE PRELIM IN A RY_ 7^V4-23-W D ESCRIPTIO N: The DPS1MS8A3 "DENSE-STACK" module is a revolutionary new memory


    OCR Scan     		PDF 1024K 500mV 30A04001 cdr 03a PESTO MCC 90-15 Dense-Pac Microsystems T-46-23-74 836 mgc

    DPS128X32CV3

    Abstract: 2CV3
    Text: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X3 2CV3/D PS 128X3 2 BV3 D E SC R IPT IO N : The DPS!28X32CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ


    OCR Scan     		PDF 128X3 DPS128X32CV3/DPS128X32BV3 DPS128X32CV3/DPS128X32BV3 500mV 30A044-24 DPS128X32CV3 2CV3

    OL80m

    Abstract: DPS128X32BV3 DPS128X32CV3
    Text: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 M I C R O S Y S T E M S D ESCRIPTIO N : The D PS128X32CV 3/D PS128X32EV3 "V ER S A - S T A C K " m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC


    OCR Scan     		PDF DPS128X32CV3/DPS128X32BV3 DPS128X32CV3/DPS128X32EV3 DPS128X32CV3/DPS128X32BV3 DPS128X32CV3 California92841-1428 30A044-24 275T415 OL80m DPS128X32BV3

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The D PS256X32V 3 "V E R S A -ST A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO mounted on a co-fired ceramic substrate. It offers 8


    OCR Scan     		PDF DPS256X32V3 PS256X32V DPS256X32V3 100ns 120ns 150ns 30A044-00

    Untitled

    Abstract: No abstract text available
    Text: Dense-Pac Microsystems, Inc. ¿-D PS1 28X24AV3 HIG H SPEED 128K X 24 CMOS SRAM VERSA-STACK O ADVANCED INFORMATION DESCRIPTION: The DPST28X24AV3 "VERSA-STACK" m odule is a re vo lu tio n a ry n e w high speed m em o ry subsystem using Dense-Pac M icrosystem s' ceram ic Stackable


    OCR Scan     		PDF 28X24AV3 DPST28X24AV3 A0-A16 30A044-31

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 4 Megabit CMOS SRAM MICROSYSTEMS DPS256X32V3 DESCRIPTION: The DPS256X32V3 "VERSA-STACK" m odule is a r e v o lu tio n a r y n e w m e m o ry subsystem u sin g Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic


    OCR Scan     		PDF DPS256X32V3 DPS256X32V3

    DPS128X16A

    Abstract: No abstract text available
    Text: CERAMIC 128KX 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS128X16A3 "DENSE-STACK" module is a re vo lu tio n ary n ew m e m o ry subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC m ounted on a co-fired ceram ic substrate. The module packs


    OCR Scan     		PDF 128KX DPS128X16A3 30A045-20 DPS128X16A