Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS EEPROM DPE512S8N DESCRIPTION: The DPE512S8N is a 512K X 8 high-density, low-power EEPROM module comprised of four ceramic 128K X 8 monolithic EEPROM's, an advanced high-speed CMOS decoder and decoupling capacitors surface mounted on a co-fired ceramic substrate
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DPE512S8N
DPE512S8N
600-mil-wide,
32-pin
300ns
30A046-00
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DPS128X32CV3
Abstract: 2CV3
Text: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X3 2CV3/D PS 128X3 2 BV3 D E SC R IPT IO N : The DPS!28X32CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ
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128X3
DPS128X32CV3/DPS128X32BV3
DPS128X32CV3/DPS128X32BV3
500mV
30A044-24
DPS128X32CV3
2CV3
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The D PS256X32V 3 "V E R S A -ST A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO mounted on a co-fired ceramic substrate. It offers 8
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DPS256X32V3
PS256X32V
DPS256X32V3
100ns
120ns
150ns
30A044-00
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 4 Megabit CMOS SRAM DPS128X32V3 M I C R O S Y S T E M S DESCRIPTION: The DPS128X32V3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic
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DPS128X32V3
DPS128X32V3
275T41S
0G012TB
3CW044-20
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M10I
Abstract: No abstract text available
Text: DENSE-PAC 16 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X32CV3 DESCRIPTION: The DPS512X32CV3 "VERSA-STACK" module is a revolutionary new high speed m em ory subsystem using D ense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic substrate. It offers 16 Megabits of
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DPS512X32CV3
DPS512X32CV3
500mV
M10I
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS EEPROM DPE5 1 2 S8 N DESCRIPTION: The D PE512S8N is a 512K X 8 high-density, low-power EEPR O M module comprised of four ceramic 128K X 8 monolithic EEPROM 's, an advanced high-speed CM O S decoder and decoupling capacitors
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OCR Scan
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PDF
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DPE512S8N
600-mil-wide,
32-pin
300ns
3QA04
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS SRAM DPS128X32V3 DESCRIPTION: The DPS128X32V3 "VERSA-STACK" module is a r e v o lu tio n a r y ne w m e m o ry subsystem u sin g Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic
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DPS128X32V3
DPS128X32V3
3QA044-20
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Applied microsystems el 1600
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 4 Megabit C M O S SRAM DPS128X32V3 DESCRIPTION: The DPS128X32V3 'VERSA -STAC K" module is a re v o lu tio n a ry new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic
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DPS128X32V3
DPS128X32V3
DPS128Xhe
30AM4-20
Applied microsystems el 1600
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 16 Megabit CMOS SRAM MICROSYSTEMS DPS512X32V3 D E SC R IPT IO N : The DPS512X32V3 "VERSA -STA C K" module is a re v o lu tio n a r y n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic
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DPS512X32V3
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS 128X32CV3/DPS12 8X32BV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC
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DPS128X32CV3/DPS128X32BV3
128X32CV3/DPS12
8X32BV3
DPS128X32CV3/DPS128X32BV3
500mV
128X32C
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30A044
Abstract: No abstract text available
Text: 16 Megabit High Speed C M O S SRAM D E N S E - P A C MICROSYSTEMS DPS512X32BV3 DESCRIPTION: The DPS512X32BV3 'V ERSA -ST A C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic
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DPS512X32BV3
P5512X32BV3
500mV
3QA044-12
30A044
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS256X32CV3/DPS256X32BV3 DESCRIPTION: The DPS256X32CV3/DPS2 56X32BV3 "VERSA -STA CK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted
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DPS256X32CV3/DPS256X32BV3
DPS256X32CV3/DPS2
56X32BV3
DPS256X32CV3/DPS256X32BV3
DPS256X32BV3
DPS256X32CV3
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 4 Megabit High Speed C M O S SRAM MICROSYSTEMS DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DP5128X32CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ
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OCR Scan
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DPS128X32CV3/DPS128X32BV3
DP5128X32CV3/DPS128X32BV3
DPS128X32CV3/DPS128X32BV3
30A044-24
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS256X32CV3./DPS256X32BV3 DESCRIPTIO N: The D P S 2 5 6 X 3 2 C V 3 / D P S 2 5 6 X 3 2 B V 3 "V E R S A -S T A C K " m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystem s' ceramic Stackable Leadless Chip Carriers S L C O mounted on
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DPS256X32CV3/DPS256X32BV3
DPS256X32CV3/DPS256X32BV3
DPS256X32BV3
DPS256X32CV3
500mV
30A044-03
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