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    512MB NAND MICRON Search Results

    512MB NAND MICRON Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TC4011BP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, 2-Input/NAND, DIP14 Visit Toshiba Electronic Devices & Storage Corporation
    TC4093BP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, 2-Input/NAND, DIP14 Visit Toshiba Electronic Devices & Storage Corporation
    TC74HC00AP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, Quad 2-Input/NAND, DIP14 Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G00NX Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), 2-Input/NAND, XSON6, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC7SH00FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), 2-Input/NAND, SOT-353 (USV), -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation

    512MB NAND MICRON Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    SpecTek flash

    Abstract: No abstract text available
    Text: 512Mb through 8Gb x8/x16 Multiplex NAND Flash Memory NAND Flash Memory Features Figure 1: 48-PIN TSOP Type 1 • Organization: • Page size: x8: 2,112 bytes 2,048 + 64 bytes x16: 1,056 words (1,024 + 32 words) • Block size: 64 pages (128K + 4K bytes)


    Original     		512Mb x8/x16 48-PIN 09005aef81d3348f 09005aef81d3345f SpecTek flash PDF

    SpecTek flash

    Abstract: Micron 512MB nand FLASH SpecTek nand spectek nand flash M2 8gb pinout SpecTek nand 8 M29A 48-PIN 04/SpecTek flash flash chip 8gb
    Text: 512Mb through 8Gb x8/x16 Multiplex NAND Flash Memory NAND Flash Memory Features Figure 1: 48-PIN TSOP Type 1 • FNN Organization: • Page size: x8: 2,112 bytes 2,048 + 64 bytes x16: 1,056 words (1,024 + 32 words) • Block size: 64 pages (128K + 4K bytes)


    Original     		512Mb x8/x16 48-PIN 09005aef81d3348f 09005aef81d3345f SpecTek flash Micron 512MB nand FLASH SpecTek nand spectek nand flash M2 8gb pinout SpecTek nand 8 M29A 04/SpecTek flash flash chip 8gb PDF

    Untitled

    Abstract: No abstract text available
    Text: 512Mb through 8Gb x8/x16 Multiplex NAND Flash Memory NAND Flash Memory Features Figure 1: 48-PIN TSOP Type 1 • FNN Organization: • Page size: x8: 2,112 bytes 2,048 + 64 bytes x16: 1,056 words (1,024 + 32 words) • Block size: 64 pages (128K + 4K bytes)


    Original     		512Mb x8/x16 48-PIN See9/05 09005aef81d3348f 09005aef81d3345f PDF

    Untitled

    Abstract: No abstract text available
    Text: 512Mb through 8Gb x8/x16 Multiplex NAND Flash Memory NAND Flash Memory Features Figure 1: 48-PIN TSOP Type 1 • FNN Organization: • Page size: x8: 2,112 bytes 2,048 + 64 bytes x16: 1,056 words (1,024 + 32 words) • Block size: 64 pages (128K + 4K bytes)


    Original     		512Mb x8/x16 48-PIN 09005aef81d3348f 09005aef81d3345f PDF

    130ball mcp

    Abstract: MCP NAND MT29C1 MCP LPDDR 1Gb 512Mb MCP 1Gb 512Mb 130 MT29C
    Text: Specifications Data Sheets Pa11 Status Code: Production ~ Data sheet: 130-ball 8 x NAND Density: 1Gb Wi<nh: x8 LPDDR Density: 512Mb LPSOR Density: 9mm NAND • LPDDR MCP J49K ~ Rev. Date: 0112011, File Size: 3.87 MB Seconda1y Wi<nh: x32 RoHS: Yes vonage: 1. 7V-1.9V


    Original     		512Mb 130-ball MT29C1 G12MAAOYAMO-S 130ball mcp MCP NAND MCP LPDDR 1Gb 512Mb MCP 1Gb 512Mb 130 MT29C PDF

    MICRON mcp

    Abstract: MT29C1 micron 137-ball
    Text: Specifications Data Sheets Pa11 Status Code: Production ~ Data sheet: 137b 10.5 x NAND Density: 1Gb Wi<nh: x8 LPDDR Density: LPSOR Density: 512Mb 13.0mm MCP NAND • LPSDR JEDEC J49J ~ Rev. Date: 0512011, File Size: 3.26 MB Seconda1y Wi<nh: x32 RoHS: Yes vonage: 1. 7V-1.9V


    Original     		512Mb 137-ball MT29C1 G12MAACAFAK0-6 MICRON mcp micron 137-ball PDF

    Micron 512MB NOR FLASH

    Abstract: calypso freescale M-Systems diskonchip MICRON NAND MLC Micron MLC ER4525 error correction code qualcomm controller omap 710 QUALCOMM Reference manual AD10
    Text: DiskOnChip G3 Low Power LP 64MB (512Mb) Flash Disk with 1.8V Core and I/O Preliminary Data Sheet, September 2004 „ Highlights M-Systems’ DiskOnChip G3 LP is the industry’s first, on-board Multi-Level Cell (MLC) NAND flash disk that is optimized with


    Original     		512Mb) 91-DT-0904-20 Micron 512MB NOR FLASH calypso freescale M-Systems diskonchip MICRON NAND MLC Micron MLC ER4525 error correction code qualcomm controller omap 710 QUALCOMM Reference manual AD10 PDF

    Micron 512MB nand FLASH

    Abstract: 64gb NAND chip micron nand flash chip 8gb Micron 1GB NAND FLASH nand flash 32gb x16 1g nand DDR mcp MCP NAND DDR MICRON mcp micron nand flash chip 16gb MT29C
    Text: MCP/PoP Part Numbering System Micron's part numbering system is available at www.micron.com/numbering Multichip Packages MT 29C 1G 12M A B A A Micron Technology IT ES Production Status AG = 16Gb BG = 32Gb CG = 64Gb DG = 128Gb LPDRAM Density 56M = 256Mb 24M = 1Gb


    Original     		128Gb 256Mb 512Mb 152Mb 640Mb 128Mb Micron 512MB nand FLASH 64gb NAND chip micron nand flash chip 8gb Micron 1GB NAND FLASH nand flash 32gb x16 1g nand DDR mcp MCP NAND DDR MICRON mcp micron nand flash chip 16gb MT29C PDF

    MT29C1G24MADLAJA-6

    Abstract: Micron 512MB nand FLASH MT29C2G24MAKLAJA-6 Micron 512MB nand FLASH mcp Flash MCp nand DRAM 137-ball JW190 137-Ball MCP NAND sDR mt29c 1g nand DDR mcp
    Text: Preliminary‡ Micron Confidential and Proprietary 137-Ball NAND Flash with LP-DRAM MCP Features NAND Flash with LP-DRAM 137-Ball Multiple-Chip Package MCP MT29CxGxxMAxxxJA Current Production Part Numbers: Table 1 on page 2 Features Figure 1: • All-Micron NAND Flash and LP-DRAM


    Original     		137-Ball MT29CxGxxMAxxxJA 09005aef82ff4431 09005aef82ff448c 137ball MT29C1G24MADLAJA-6 Micron 512MB nand FLASH MT29C2G24MAKLAJA-6 Micron 512MB nand FLASH mcp Flash MCp nand DRAM 137-ball JW190 MCP NAND sDR mt29c 1g nand DDR mcp PDF

    LPDDR2 PoP

    Abstract: LPDDR2 micron lpddr2 lpddr2 datasheet 216-ball LPDDR lpddr2 nand mcp Micron 512MB nand FLASH 136-Ball 168-ball LPDDR Micron NAND
    Text: A Perfect Match for Matchless Performance Micron Multichip Packages Form Factor, Speed, Power. Choose All That Apply. Form factor, speed, power—your mobile customers want all three. With Micron’s MCPs, you can respond to customers’ everincreasing demands without compromising leading-edge performance. Mix and match devices, configurations, and package


    Original     		PDF

    16GB Nand flash dual channel

    Abstract: hynix nand flash samsung 8Gb nand flash Hynix 64Gb Nand flash micron DDR3 SODIMM address mapping edge connector nand flash HYNIX MLC dms-59 WD3RE04GX818 hynix nand flash 2gb wd2ue01Gx818
    Text: ourl ocat i ons FLASH EMBEDDED PRODUCTS DRAM MODULES Wi nt ecI ndust r i esBr anches USA LosAngel es,CA Nor cr oss,Geor gi a Pi scat away,New Jer sey Eur ope Br aunschwei g,Ger many Asi a Tai pei ,Tai wan Kowl oon,HongKong Shenzhen,Chi na Wi nt ecI ndust r


    Original     		PDF

    MT29C2G24MAKLAJG-75 IT

    Abstract: MT29C2G24MAKLAjg JW256
    Text: Preliminary‡ 168-Ball NAND Flash and LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29CxGxxMAxxxxx Features Figure 1: PoP Block Diagram Micron NAND Flash and LPDRAM components


    Original     		168-Ball MT29CxGxxMAxxxxx 09005aef83070ff3 168ball MT29C2G24MAKLAJG-75 IT MT29C2G24MAKLAjg JW256 PDF

    MT29C1G12

    Abstract: mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1
    Text: Preliminary‡ 152-Ball NAND Flash and LP-DRAM PoP TI OMAP MCP Features NAND Flash and LP-DRAM 152-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package


    Original     		152-Ball 409ng 09005aef8326e5ac 09005aef8326e59a 152ball_ MT29C1G12 mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1 PDF

    phison

    Abstract: Phison Electronics LGA-52 hynix nand flash 1.8v 4Gb uP8051 spi hynix nand flash 2gb LGA52 hynix nand 512M 8GB MODULE MLC phison nand flash
    Text: 2F, RiteKom Bldg No.669, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu, Taiwan 310, R.O.C. Tel： 886-3-5833899-3001 or 1001 or 1005 Fax： 886-3-5833666 Email：Sales@phison.com Phison Electronics Corporation version 1.1 All rights are strictly reserved. Any portion of this paper shall not be reproduced, copied, or


    Original     		S-05007 phison Phison Electronics LGA-52 hynix nand flash 1.8v 4Gb uP8051 spi hynix nand flash 2gb LGA52 hynix nand 512M 8GB MODULE MLC phison nand flash PDF

    MT29F2G16AB

    Abstract: MT29C2G24MAKLAJG-6 MT29C4G48 JW256 MT29C2G48MAKLCJI-6 mt29f4g16ab MT29F4G16A MT29F2G16ABDHC mt29c MT29F2G16ABDHC-ET
    Text: Preliminary‡ 168-Ball NAND Flash and LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29CxGxxMAxxxxx Features Figure 1: PoP Block Diagram Micron NAND Flash and LPDRAM components


    Original     		168-Ball MT29CxGxxMAxxxxx 09005aef83070ff3 168ball MT29F2G16AB MT29C2G24MAKLAJG-6 MT29C4G48 JW256 MT29C2G48MAKLCJI-6 mt29f4g16ab MT29F4G16A MT29F2G16ABDHC mt29c MT29F2G16ABDHC-ET PDF

    MT29F1G08aba

    Abstract: MT29F1G16ABA mt29f1g08 MT47H64M16 MT48LC32M16A2 MT49H32M18FM mt47h128m8 MT9V022 note Vfbga 10x19 MT48LC4M32B2
    Text: Extended Operating Temperature Products Micron’s Extensive Line of Extended Operating Temperature Products Ultimate Performance Under Extreme Conditions Modern life is dependent on electronics that operate in exceptionally harsh environments. Cellular base stations and automotive electronics are just


    Original     		52-ball MT29F1G08aba MT29F1G16ABA mt29f1g08 MT47H64M16 MT48LC32M16A2 MT49H32M18FM mt47h128m8 MT9V022 note Vfbga 10x19 MT48LC4M32B2 PDF

    PHISON

    Abstract: PS2153 PS2151
    Text: 2F, RiteKom Bldg No.669, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu, Taiwan 310, R.O.C. Tel: 886-3-5833899-3001 or 1001 or 1005 Fax: 886-3-5833666 Email : sales@phison.com kspua@phison.com Phison Electronics Corporation USB 2.0 Flash Controller Specification


    Original     		PS2153 S-05004 PHISON PS2153 PS2151 PDF

    MT29F2G16ABA

    Abstract: SEAM-40 SMD23 MICRON POWER RESISTOR H33 SEAF-40-05 PISMO2-00006 MT29F2G16AAA MICRON 1.8V 2GB NAND MT29F1G16 PISMO2-P6960
    Text: Advance‡ PISMO2-00006: Micron Mobile SDR SDRAM + NAND Module Introduction Micron PISMO Module Data Sheet PISMO2-00006: Mobile SDR SDRAM + NAND Flash Introduction The PISMO Platform Independent Storage MOdule specification provides a standard external interface to ease memory performance evaluation. This document describes


    Original     		PISMO2-00006: PISMO2-P6960 24AA64-I/ST 09005aef82c0b66c/Source: 09005aef82c0b648 MT29F2G16ABA SEAM-40 SMD23 MICRON POWER RESISTOR H33 SEAF-40-05 PISMO2-00006 MT29F2G16AAA MICRON 1.8V 2GB NAND MT29F1G16 PISMO2-P6960 PDF

    smartphone MOTHERBOARD CIRCUIT diagram

    Abstract: AP-DOC-070 Micron 512MB nand FLASH mcp J9 G3 MARKING G3 MICRON mcp QUALCOMM Reference manual A0-A21 DM270 Flash MCp nand DRAM 107-ball
    Text: DiskOnChip-Based MCP Including DiskOnChip G3 and PSRAM Data Sheet, July 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


    Original     		02-DT-0704-00 smartphone MOTHERBOARD CIRCUIT diagram AP-DOC-070 Micron 512MB nand FLASH mcp J9 G3 MARKING G3 MICRON mcp QUALCOMM Reference manual A0-A21 DM270 Flash MCp nand DRAM 107-ball PDF

    DM270

    Abstract: 2Gb NAND FLASH Toshiba QUALCOMM Reference manual Diskonchip toshiba 107ball marking G3 smartphone MOTHERBOARD CIRCUIT diagram Micron 512MB nand FLASH mcp M-Systems diskonchip mcp toshiba MLC nand flash
    Text: DiskOnChip-Based MCP Including DiskOnChip G3 and PSRAM Data Sheet, July 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


    Original     		02-DT-0704-00 DM270 2Gb NAND FLASH Toshiba QUALCOMM Reference manual Diskonchip toshiba 107ball marking G3 smartphone MOTHERBOARD CIRCUIT diagram Micron 512MB nand FLASH mcp M-Systems diskonchip mcp toshiba MLC nand flash PDF

    MT29F1G08ABCHC

    Abstract: mt29c MT29F4G16A mt29f1g08 MT29F1G08ABCHC-ET MT29C1G12 MT29F2G16ABDHC MT29F4G16AB MT29F1G16ABCHC-ET micron lpddr
    Text: Preliminary‡ 152-Ball NAND Flash and Mobile LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP ) MT29C Family Current production part numbers: See Table 1 on page 3 Features Figure 1:


    Original     		152-Ball MT29C 152-Ball 09005aef8326e5ac 09005aef8326e59a 152ball_ MT29F1G08ABCHC MT29F4G16A mt29f1g08 MT29F1G08ABCHC-ET MT29C1G12 MT29F2G16ABDHC MT29F4G16AB MT29F1G16ABCHC-ET micron lpddr PDF

    Micron 512MB NOR FLASH

    Abstract: Micron 256MB NOR FLASH Micron 512MB nand FLASH DIMM 100-pin MT18LSDT3272G-13E
    Text: Micron Technology - SDRAM Modules Part List Modules  About | Products | Investors | Sales | Jobs | News | Search | Support      DRAM | Modules | NOR Flash | NAND Flash | PSRAM | CMOS Image Sensors    Home > Products > Modules > SDRAM


    Original     		MT18LSDT3272G-13E 256MB 168-pin MT18LSDT3272G-13E 256MB, 512MB, Micron 512MB NOR FLASH Micron 256MB NOR FLASH Micron 512MB nand FLASH DIMM 100-pin PDF

    MCP 256M nand toshiba

    Abstract: Diskonchip QUALCOMM Reference manual TRUEFFS TSOP 48 thermal resistance type1 MARKING G3 MCP 256M nand micron MICRON mcp transistor marking A9M MS06-D9SD8-B3
    Text: DiskOnChip -Based MCP Including DiskOnChip G3 and Mobile RAM Data Sheet, September 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


    Original     		91-DT-0504-00 MCP 256M nand toshiba Diskonchip QUALCOMM Reference manual TRUEFFS TSOP 48 thermal resistance type1 MARKING G3 MCP 256M nand micron MICRON mcp transistor marking A9M MS06-D9SD8-B3 PDF

    ELPIDA 512MB NOR FLASH

    Abstract: nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100
    Text: DiskOnChip-Based MCP Including DiskOnChip G3 and Mobile RAM Data Sheet, August 2004 • Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


    Original     		97-DT-0304-00 ELPIDA 512MB NOR FLASH nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100 PDF