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    4751-3355-02

    Abstract: No abstract text available
    Text: OSP*OSSP Blind Mate Connectors Table of Contents OSP and OSSP Technology and Applications OSP Interface Mating Dimensions Specifications Semi-Rigid Cable Type .085 and .141 Diameter - Direct Solder Attachment .085 and .141 Diameter - OSCC Solderless Compression Crimp Attachment


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    6061-TB

    Abstract: No abstract text available
    Text: MI DRG NÛ. PRELIMINARY .25 2X> [6.3 5]' £ 1 -3dB [9.4] ^ -10 [2.54] THRU (4X [67.3 1] TITLE .19 TYP. [4.7] OUTLINE, COUPLER, 90°, 470 - 860 MHz, 200W dB FILE SPECIFICATIONS MATERIAL A L ALLOY, 6061-TB FINISH CHEM FILM, CLEA R PER MIL-C-5541, T Y P 2 REV. F, C L A S S 3


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    JCC-1006-1SM JCC-10Ã 6061-TB MIL-C-5541. 25ENCY' D4/2D/10 6061-TB PDF

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    Abstract: No abstract text available
    Text: OSP‘ OSSP Blind Mate Connectors Table of Contents O S P and O S S P Technology and Applications O S P Interface Mating Dimensions Specifications Semi-Rigid Cable Type .085 and .141 Diameter - Direct Solder Attachment .085 and .141 Diameter - O S C C Solderless


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    Abstract: No abstract text available
    Text: OSPOSSP Pansl Mount C onirctori_ Rigid and Float Mount Daalgn Quid# When mounting several OSP or 08SP blind mete oonnectore on e plate or panel, euoh a t In a module-tomotherboard or reok and panel applloatlon, the deelgn muat take Into aocount the Interface mating foroee to


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    08Pfe 6061TB 6061TB PDF