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    60NS2 Search Results

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    3M Interconnect DP460NS-200ML

    EPXY ADHESIVE NS 200 ML DUO-PAK
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DP460NS-200ML Bulk 8 1
    • 1 $171.46
    • 10 $171.46
    • 100 $111.44233
    • 1000 $111.44233
    • 10000 $111.44233
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    Amec Thermasol WG-60NS20020030

    THERMAL PAD 200MMX200MM PINK
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey WG-60NS20020030 4 1
    • 1 $198.52
    • 10 $183.24
    • 100 $132.35
    • 1000 $132.35
    • 10000 $132.35
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    Amec Thermasol WG-60NS20020020

    THERMAL PAD 200MMX200MM PINK
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey WG-60NS20020020 4 1
    • 1 $136.76
    • 10 $126.24
    • 100 $91.17
    • 1000 $91.17
    • 10000 $91.17
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    Amec Thermasol WG-60NS20020015

    THERMAL PAD 200MMX200MM PINK
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey WG-60NS20020015 3 1
    • 1 $107
    • 10 $98.77
    • 100 $71.33
    • 1000 $71.33
    • 10000 $71.33
    Buy Now

    Amec Thermasol WG-60NS20020010

    THERMAL PAD 200MMX200MM PINK
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey WG-60NS20020010 2
    • 1 -
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    60NS2 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    72261LA

    Abstract: 72271LA IDT72261LA IDT72271LA 72261LA15
    Text: CMOS SUPERSYNC FIFO 16,384 x 9 32,768 x 9 PRELIMINARY IDT72261LA IDT72271LA Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: IDT72261LA 16,384 x 9 IDT72271LA 32,768 x 9 • Pin-compatible with the IDT72281/72291 SuperSync FIFOs


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    IDT72261LA IDT72271LA IDT72281/72291 72261LA 72271LA IDT72261LA IDT72271LA 72261LA15 PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY‡ 256Mb MULTIBANK BURST FLASH 32Mb/64Mb BURST CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18T MT28C256564W18T Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package • Includes two 128Mb Flash devices


    Original
    256Mb 32Mb/64Mb 128Mb 09005aef80c7d5a5 MT28C256564W18T PDF

    88-ball

    Abstract: No abstract text available
    Text: PRELIMINARY‡ 256Mb MULTIBANK BURST FLASH 32Mb/64Mb BURST CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18T MT28C256564W18T Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package • Includes two 128Mb Flash devices


    Original
    256Mb 32Mb/64Mb 128Mb 09005aef80c7d5a5 MT28C256564W18T 88-ball PDF

    marking code micron label

    Abstract: No abstract text available
    Text: 128Mb MULTIBANK ASYNC/PAGE OR BURST FLASH 16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM FLASH AND CellularRAM COMBO MEMORY MT28C128516W18/W30D ADVANCE‡‡ MT28C128532W18/W30D MT28C128564W18/W30D Low Voltage, Wireless Temperature Features Figure 1: 77-Ball FBGA


    Original
    128Mb 16Mb/32Mb/64Mb 09005aef80b10a55 MT28C128564W18D marking code micron label PDF

    MT28C256

    Abstract: No abstract text available
    Text: PRELIMINARY‡ 256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18D MT28C256564W18D Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package


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    256Mb 32Mb/64Mb 128Mb 09005aef80f1c46d MT28C256564W18D MT28C256 PDF

    q001

    Abstract: M29W256GH
    Text: 256Mb: 3V Embedded Parallel NOR Flash Features Parallel NOR Flash Embedded Memory M29W256GH, M29W256GL Features • VPP/WP# pin protection – Protects first or last block regardless of block protection settings • Software protection – Volatile protection


    Original
    256Mb: M29W256GH, M29W256GL 60ns1, 32-word 64-byte) 256-word 128-Kbytes 64-Kwords 09005aef84bd3b68 q001 M29W256GH PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY‡ 256Mb MULTIBANK BURST FLASH 32Mb/64Mb BURST CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18T MT28C256564W18T Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package • Includes two 128Mb Flash devices


    Original
    256Mb 32Mb/64Mb MT28C256532W18T MT28C256564W18T 88-Ball 128Mb 09005aef80c7d5a5 MT28C256564W18T PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY‡ 256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18D MT28C256564W18D Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package


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    256Mb 32Mb/64Mb MT28C256532W18D MT28C256564W18D 88-Ball 128Mb 70ARY 09005aef80f1c46d PDF

    on 4673 equivalent

    Abstract: 72V271LA IDT72V261LA IDT72V271LA
    Text: 3.3 VOLT CMOS SUPERSYNC FIFO 16,384 x 9 32,768 x 9 PRELIMINARY IDT72V261LA IDT72V271LA Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: IDT72V261LA 16,384 x 9 IDT72V271LA 32,768 x 9 • Pin-compatible with the IDT72V281/72V291 and


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    IDT72V261LA IDT72V271LA IDT72V281/72V291 IDT72V2101/72V2111SuperSync IDT72261/72271 on 4673 equivalent 72V271LA IDT72V261LA IDT72V271LA PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY‡ 256Mb MULTIBANK BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18S MT28C256564W18S Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package • Includes two 128Mb Flash devices


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    256Mb 32Mb/64Mb 128Mb 09005aef80bcd58d MT28C256564W18S PDF

    marking code micron label

    Abstract: INTEL flash part MARKING
    Text: PRELIMINARY‡ 128Mb MULTIBANK BURST FLASH 16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM FLASH AND CellularRAM COMBO MEMORY MT28C128516W18/W30D PREVIEW‡‡ MT28C128532W18/W30D MT28C128564W18/W30D Low Voltage, Wireless Temperature Features Figure 1: 77-Ball FBGA


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    128Mb 16Mb/32Mb/64Mb 09005aef80b10a55 MT28C128564W18D marking code micron label INTEL flash part MARKING PDF

    INFINEON "part marking"

    Abstract: marking code micron label
    Text: PRELIMINARY‡ 128Mb MULTIBANK BURST FLASH 32Mb/64Mb BURST CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C128532W18/W30E MT28C128564W18/W30E Low Voltage, Wireless Temperature Features Figure 1: 77-Ball FBGA Stacked die Combo package • Includes two 64Mb Flash devices


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    128Mb 32Mb/64Mb 09005aef80b10a55 MT28C128564W18E INFINEON "part marking" marking code micron label PDF

    IDT72255

    Abstract: IDT72265
    Text: CMOS SUPERSYNC FIFO 8,192 x 18, 16,384 x 18 IDT72255 IDT72265 Integrated Device Technology, Inc. FEATURES: • • • • • • • • • • • • • • • • 8,192 x 18-bit storage capacity IDT72255 16,384 x 18-bit storage capacity (IDT72265)


    Original
    IDT72255 IDT72265 18-bit IDT72255) IDT72265) Word15mA IDT72255 IDT72265 PDF

    Untitled

    Abstract: No abstract text available
    Text: 256Mb: 3V Embedded Parallel NOR Flash Features Parallel NOR Flash Embedded Memory M29W256GH, M29W256GL Features • VPP/WP# pin protection – Protects first or last block regardless of block -protection settings • Software protection – Volatile protection


    Original
    256Mb: M29W256GH, M29W256GL 128-word 256-byte) 64-bit JESD47H-compliant 09005aef84bd3b68 256mb PDF

    W18 SMD MARKING CODE

    Abstract: w18 SMD INFINEON PART MARKING W18 64 smd marking code micron label 60ns2
    Text: PRELIMINARY‡ 128Mb MULTIBANK ASYNC/PAGE OR BURST FLASH 16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM FLASH AND CellularRAM COMBO MEMORY MT28C128516W18/W30D PREVIEW‡‡ MT28C128532W18/W30D MT28C128564W18/W30D Low Voltage, Wireless Temperature Features Figure 1: 77-Ball FBGA


    Original
    128Mb 16Mb/32Mb/64Mb 09005aef80b10a55 MT28C128564W18D W18 SMD MARKING CODE w18 SMD INFINEON PART MARKING W18 64 smd marking code micron label 60ns2 PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY‡ 256Mb MULTIBANK BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C256532W18D MT28C256564W18D Low Voltage, Wireless Temperature Features Figure 1: 88-Ball FBGA Stacked die Combo package • Includes two 128Mb Flash devices


    Original
    256Mb 32Mb/64Mb 128Mb 09005aef80bcd58d MT28C256564W18D PDF

    Untitled

    Abstract: No abstract text available
    Text: 3.3 VOLT CMOS SUPERSYNC FIFO 16,384x9, 32,768x9 IDT72V261 IDT72V271 In teg ra ted D e v ic e T e c h n o lo g y , l i e . FEATURES: • 3.3 Volt operation saves 60 percent of power compared to the functionally compatible 5 Volt IDT72261/72271 family 16,384 x 9-bit storage capacity IDT72V261


    OCR Scan
    384x9, 768x9 IDT72V261 IDT72V271 IDT72261/72271 IDT72V261) IDT72V271) PDF

    Untitled

    Abstract: No abstract text available
    Text: CMOS SUPERSYNC FIFO 8,192 x 18 16,384 x 18 PRELIMINARY IDT72255LA IDT72265LA Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: IDT72255LA 8 ,1 9 2 x 1 8 IDT72265LA 1 6 ,3 8 4 x 1 8 • Pin-compatible with the IDT72275/72285 SuperSync FI FOs


    OCR Scan
    IDT72255LA IDT72265LA IDT72275/72285 492-M IDT77105 25Mb/s 64-PIN PDF

    Untitled

    Abstract: No abstract text available
    Text: CMOS SUPERSYNC FIFO 16,384x9, 32,768x9 IDT72261 IDT72271 Integrated Device Technology, Inc. DESCRIPTION: FEATURES: • • • • • • • • • • • • • • • • 16,384 x 9-bit storage capacity IDT72261 32,768 x 9-bit storage capacity (IDT72271)


    OCR Scan
    384x9, 768x9 IDT72261 IDT72271 IDT72261 IDT72271 i-M74 S10-U9-2070 PSC-4036 IDT77105 PDF

    Untitled

    Abstract: No abstract text available
    Text: 3.3 VOLT CMOS SUPERSYNC FIFO 16,384x9 32,768 x 9 PRELIMINARY IDT72V261 LA IDT72V271 LA Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: IDT72V261 LA 1 6 ,3 8 4 x 9 IDT72V271 LA 3 2 ,7 6 8 x 9 • P in -c o m p a tib le w ith the ID T 7 2 V 2 8 1 /7 2 V 2 9 1 and


    OCR Scan
    384x9 IDT72V261 IDT72V271 IDT72V2101/72V2111 IDT72261/72271 492-M IDT77105 25Mb/s PDF

    Untitled

    Abstract: No abstract text available
    Text: 3.3 VOLT CMOS SUPERSYNC FIFO 16,384x9, 32,768x9 IDT72V261 IDT72V271 Ivtegiated D evice Technology, l i e . FEATURES: • 3.3 Volt operation saves 60 percent of power compared to the functionally compatible 5 Volt IDT72261/72271 family 16,384 x 9-bit storage capacity IDT72V261


    OCR Scan
    384x9, 768x9 IDT72V261 IDT72V271 IDT72261/72271 IDT72V261) IDT72V271) 60ns2 PDF

    a5aa

    Abstract: No abstract text available
    Text: 3.3 VOLT CMOS SUPERSYNC FIFO 16,384x9, 32,768x9 FEATURES: • 3.3 Volt operation saves 60 percent of power compared to the functionally compatible 5 Volt IDT72261/72271 family IDT72V261 IDT72V271 for exceptionally low power consumption. These FIFOs are


    OCR Scan
    384x9, 768x9 IDT72V261 IDT72V271 IDT72261/72271 IDT72V261) IDT72V271) 60ns2 a5aa PDF

    Untitled

    Abstract: No abstract text available
    Text: CMOS SUPERSYNC FIFO 8 ,1 9 2 x 1 8 ,1 6 ,3 8 4 x 1 8 FEATURES: • • • • • • • • • • • • • • • • 8,192 x 18-bit storage capacity IDT72255 16,384 x 18-bit storage capacity (IDT72265) 10ns read/write cycle time (8ns access time)


    OCR Scan
    18-bit IDT72255) IDT72265) PDF

    Untitled

    Abstract: No abstract text available
    Text: CMOS SUPERSYNC FIFO 16,384x9 32,768 x 9 PRELIMINARY IDT72261 LA IDT72271 LA Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: IDT72261 LA 1 6 ,3 8 4 x 9 IDT72271 LA 3 2 ,7 6 8 x 9 • Pin-compatible with the IDT72281/72291 SuperSync FIFOs


    OCR Scan
    384x9 IDT72261 IDT72271 IDT72281/72291 492-M IDT77105 25Mb/s 64-PIN PDF