Untitled
Abstract: No abstract text available
Text: WE256K32-XG2TXE HI-RELIABILITY PRODUCT 256Kx32 EEPROM MODULE PRELIMINARY* FEATURES • Access Times of 150, 200, 250, 300ns ■ Packaging: • 68 lead, Hermetic CQFP G2T , 22.4mm (0.880") square, 4.57mm (0.180") high (Package 509). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 1)
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Original
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WE256K32-XG2TXE
256Kx32
300ns
256Kx32.
WE256K32-XG2TXE
256K32
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PDF
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acs150
Abstract: No abstract text available
Text: WE128K32-XG2TXE HI-RELIABILITY PRODUCT 128Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Times of 150, 200, 250, 300ns ■ Packaging: • 68 lead, Hermetic CQFP G2T , 22.4mm (0.880") square, 4.57mm (0.180") high (Package 509). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 1)
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Original
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WE128K32-XG2TXE
128Kx32
300ns
128Kx32;
256Kx16
512Kx8
WE128K32-XG2TXE
128K32
acs150
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PDF
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WS128K32-XG2TXE
Abstract: No abstract text available
Text: White Electronic Designs WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES Access Times of 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509)
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Original
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WS128K32-XG2TXE
128Kx32
128Kx32;
256Kx16
512Kx8
MIL-STD-883
128Kx32
WS128K32-XG2TXE
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PDF
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WF4M32-XXX5
Abstract: No abstract text available
Text: White Electronic Designs WF4M32-XXX5 PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package 502), 3.5mm (0.140") height.
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Original
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WF4M32-XXX5
4Mx32
150ns
990CQFJ
64KBytes
4Mx32
2x4Mx16
WF4M32-XXX5
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PDF
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WS128K32-XG2TXE
Abstract: No abstract text available
Text: White Electronic Designs WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES Access Times of 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509) Built in Decoupling Caps and Multiple Ground Pins
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Original
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WS128K32-XG2TXE
128Kx32
128Kx32;
256Kx16
512Kx8
MIL-STD-883
128Kx32
WS128K32-XG2TXE
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PDF
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WF4M32-XXX5
Abstract: No abstract text available
Text: WF4M32-XXX5 White Electronic Designs PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package
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Original
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WF4M32-XXX5
4Mx32
150ns
990CQFJ
64KBytes
4Mx32
2x4Mx16
WF4M32-XXX5
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PDF
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O28 Package
Abstract: No abstract text available
Text: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed
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Original
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WS128K32-15XX
128Kx32
66-pin,
128Kx32;
256Kx16
512Kx8
WS128K32-XG2X
WS128K32-XHX
128Kx32
O28 Package
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PDF
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Untitled
Abstract: No abstract text available
Text: WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation Access Times of 35, 45, 55ns Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"),
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Original
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WS128K32-XG2TXE
128Kx32
128Kx32;
256Kx16
512Kx8
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PDF
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WF2M32-XXX5
Abstract: No abstract text available
Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square
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Original
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WF2M32-XXX5
2Mx32
150ns
64KBytes
2Mx32
64KByte
01HXX*
120ns
WF2M32-XXX5
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PDF
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WS128K32-XG2TXE
Abstract: No abstract text available
Text: WS128K32-XG2TXE HI-RELIABILITY PRODUCT 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLERANT FEATURES • 5 Volt Power Supply ■ Access Times of 35, 45, 55ns ■ Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509) ■ Organized as 128Kx32; User Configurable as 256Kx16
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Original
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WS128K32-XG2TXE
128Kx32
128Kx32;
256Kx16
512Kx8
WS128K32-XG2TXE
128Kx32
256Kx16
|
PDF
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Untitled
Abstract: No abstract text available
Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square
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Original
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WF2M32-XXX5
2Mx32
150ns
64KBytes
WF2M32U-XG2UX
64KByte
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PDF
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smd A018
Abstract: top mark smd A12 CQFP top mark smd A9 smd A018 3 pin A13 smd Mark A12 SMD smd a7 transistor smd transistor a4 smd transistor A8
Text: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25, 35, 45, 55nS ■ Packaging • 66 pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611 • 68 lead, 40mm Hermetic Low Capacitance CQFP, 5.1mm
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Original
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WS512K32-XXX
512Kx32
512Kx32,
1Mx16
09HMX
10HMX
05HNX
06HNX
07HNX
08HNX
smd A018
top mark smd A12
CQFP
top mark smd A9
smd A018 3 pin
A13 smd
Mark A12 SMD
smd a7 transistor
smd transistor a4
smd transistor A8
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PDF
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WEDF1M32B-XG2TX5
Abstract: WEDF1M32B-XHX5 WEDF1M32B-XXX5 1m 0880
Text: WEDF1M32B-XXX5 HI-RELIABILITY PRODUCT 1Mx32 5V FLASH MODULE ADVANCED* FEATURES • ■ ■ ■ ■ ■ ■ Access Times of 70, 90, 120ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 • 68 lead, 22mm Low Profile CQFP, 4.6mm (0.180"),
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Original
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WEDF1M32B-XXX5
1Mx32
120ns
16KByte
32KByte
64KByte
1Mx32,
2Mx16
WEDF1M32B-XG2TX5
WEDF1M32B-XHX5
WEDF1M32B-XXX5
1m 0880
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PDF
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04HMX
Abstract: No abstract text available
Text: WE128K32-XXX White Electronic Designs 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES Access Times of 120*, 125, 140, 150, 200, 250, 300ns Packaging: • 66-pin, PGA Type, 27.3mm 1.075" square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm
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Original
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128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
WE128K32-XXX
01H5X
02H5X
03H5X
04HMX
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PDF
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|
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WE32K32-XXX
Abstract: No abstract text available
Text: White Electronic Designs WE32K32-XXX 32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES Access Times of 80*, 90, 120, 150ns Data Retention at 25°C, 10 Years MIL-STD-883 Compliant Devices Available Write Endurance, 10,000 Cycles Packaging: • 68 lead, Hermetic CQFP G2U , 122.4mm
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Original
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WE32K32-XXX
32Kx32
150ns
MIL-STD-883
32Kx32;
64Kx16
128Kx8
66-pin,
01HXX
WE32K32-XXX
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PDF
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Untitled
Abstract: No abstract text available
Text: WED8LM32513C HI-RELIABILITY PRODUCT 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 15*, 17, 20, 25, 35, 45, 55ns ■ Low Power CMOS ■ Packaging ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation • 68 lead, 23.88mm Low Profile CQFP, 3.56mm 0.140"
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Original
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WED8LM32513C
512Kx32
512Kx32,
1Mx16
512Kx32
|
PDF
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WSF512K32-XXX
Abstract: No abstract text available
Text: White Electronic Designs WSF512K32-XXX 512KX32 SRAM / FLASH MODULE FEATURES Access Times of 25ns SRAM and 70, 90ns (FLASH) Packaging • 66 pin, PGA Type, 1.385" square HIP, Hermetic Ceramic HIP (Package 402) FLASH MEMORY FEATURES • 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880")
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Original
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WSF512K32-XXX
512KX32
64KBytes
512K32
WSF512K32-XXX
|
PDF
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WF1M32B-XXX3
Abstract: No abstract text available
Text: a WF1M32B-XXX3 WHITE /MICROELECTRONICS 1Mx323.3V FLASH M O DULE PRELIMINARY* FEATURES • Access Times of 100,120, 150ns ■ F&ckaging • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401 • 68 lead, Low Profile CQFP(G2T), 4.6mm (0.180 inch)
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OCR Scan
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WF1M32B-XXX3
1Mx323
WF1M32B-XG2TX3
WF1M32B-XHX3
150ns
66-pin,
WF1M32B-XXX3
|
PDF
|
Untitled
Abstract: No abstract text available
Text: a WE128K32-XG2TXE WHITE /MICROELECTRONICS 128Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Tim es of 150, 200, 250, 300ns ■ Autom atic Page W rite Operation ■ Packaging: ■ Page W rite Cycle Time: 10ms M ax • 68 lead, Herm etic CQFP G2T , 22.4mm (0.880 inch) square,
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OCR Scan
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WE128K32-XG2TXE
128Kx32
300ns
128Kx32;
256Kx16
512Kx8
128K32
|
PDF
|
Untitled
Abstract: No abstract text available
Text: a WE128K32-XG2TXE WHITE /MICROELECTRONICS 128Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Tim es of 150, 200, 250, 300ns ■ Autom atic Page W rite Operation ■ Packaging: ■ Page W rite Cycle Time: 10ms M ax • 68 lead, Herm etic CQFP G2T , 22.4mm (0.880 inch) square,
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OCR Scan
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WE128K32-XG2TXE
128Kx32
300ns
WE128K32-XG2TXE
128Kx32;
256Kx16
512Kx8
128K32
|
PDF
|
Untitled
Abstract: No abstract text available
Text: a WE256K32-XG2TXE WHITE /MICROELECTRONICS 256Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Tim es of 150, 200, 250, 300ns ■ Page W rite Cycle Time: 10ms M ax ■ Packaging: ■ Data Polling for End of W rite Detection • 68 lead, Herm etic CQFP G2T , 22.4mm (0.880 inch) square,
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OCR Scan
|
WE256K32-XG2TXE
256Kx32
300ns
WE256K32-XG2TXE
256Kx32.
256K32
|
PDF
|
Untitled
Abstract: No abstract text available
Text: a WE256K32-XG2TXE WHITE /MICROELECTRONICS 256Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Tim es of 150, 200, 250, 300ns ■ Page W rite Cycle Time: 10ms M ax ■ Packaging: ■ Data Polling for End of W rite Detection • 68 lead, Herm etic CQFP G2T , 22.4mm (0.880 inch) square,
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OCR Scan
|
WE256K32-XG2TXE
256Kx32
300ns
WE256K32-XG2TXE
256Kx32.
256K32
|
PDF
|
Untitled
Abstract: No abstract text available
Text: a WSF128K32V-XG2TX WHITE /MICROELECTRONICS 128Kx32 SRAM/FLASH 3.3V MODULE ADVANCED* FEATURES FLASH M EM ORY FEATURES • Access Times of 25ns SRAM and 120ns (FLASH) ■ 10,000 Erase/Program Cycles ■ Access Times of 25ns (SRAM ) and 90ns (FLASH) ■ • 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880 inch) square
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OCR Scan
|
WSF128K32V-XG2TX
128Kx32
120ns
120ns
|
PDF
|
Untitled
Abstract: No abstract text available
Text: ç M/HITE /MICROELECTRONICS a 1Mx32 3.3V FLASH MODULE WF1M32B-XXX3 PRELIMINARY* FEATURES • A cce ss Times of 1 0 0 ,1 2 0 ,150ns ■ Packaging ■ • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401 • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180 inch)
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OCR Scan
|
1Mx32
WF1M32B-XXX3
150ns
16KByte,
32KByte,
64kbytes
32B-XG
|
PDF
|
