84 FBGA THERMAL Search Results

84 FBGA THERMAL Result Highlights (5)

Part	Manufacturer	Description
TCTH011AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type
TCTH022AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function
TCTH021AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type
TCTH012BE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function
TCTH012AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function

84 FBGA THERMAL Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
M378T5663FB3 Abstract: No abstract text available Text: Rev. 1.0, Jul. 2010 M378T2863FBS M378T5663FB3 M391T2863FB3 M391T5663FB3 240pin Unbuffered DIMM based on 1Gb F-die 60 & 84 FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND	Original	M378T2863FBS M378T5663FB3 M391T2863FB3 M391T5663FB3 240pin K4T1G084QF M378T5663FB3/M391T5663FB3 128Mbx8 128Mx72	PDF
K4N1G164QF Abstract: K4N1G164QF-BC20 Text: Rev. 1.1, Sep. 2010 K4N1G164QF 1Gb F-die gDDR2 SDRAM 84 FBGA with Lead-Free & Halogen-Free RoHS Compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed	Original	K4N1G164QF 6-10per) 11-50per) K4N1G164QF K4N1G164QF-BC20	PDF
K4N1G164QE Abstract: k4n1g164qe-hc20 Text: Rev. 1.33, Apr.2010 K4N1G164QE 1Gb E-die gDDR2 SDRAM 84 FBGA with Lead-Free & Halogen-Free RoHS Compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed	Original	K4N1G164QE 6-10per) 11-50per) K4N1G164QE k4n1g164qe-hc20	PDF
C6426 Abstract: asus U6052 C6599 R5538 k 355k c10501 SW251 M38857 isl6227caz Text: 5 4 3 2 1 CLOCK GEN. ICS954310 W7J: YONAH/CALISTOGA-PM/G72M BLOCK DIAGRAM PAGE 6 FAN + Thermal ADT7473 DDR2 VRAM*4 D PAGE 5 Yonah POWER ON SEQUENCE 478 uFCPGA 84 FBGA ON BOARD 512MB DDR2 PAGE 20,21 PAGE 2,3,4 HOST BUS 133/166MHz LVDS PAGE 23 nVIDIA G72M CRT	Original	YONAH/CALISTOGA-PM/G72M ICS954310 ADT7473 133/166MHz 512MB 945PM 533/667MHz 100MHz RTL8111B 802WLAN C6426 asus U6052 C6599 R5538 k 355k c10501 SW251 M38857 isl6227caz	PDF
ICS954310 Abstract: U6042 CR6338 U6020 G547B2 R5538 C6138 ICS954310BGLFT R6660 U6041 Text: 5 4 3 2 1 CLOCK GEN. ICS954310 T76J: YONAH/CALISTOGA-PM/G72M BLOCK DIAGRAM PAGE 6 FAN + Thermal ADT7473 DDR2 VRAM*4 84 FBGA D PAGE 5 Yonah 478 uFCPGA ON BOARD 512MB DDR2 PAGE 20,21 PAGE 2,3,4 HOST BUS 133/166MHz LVDS PAGE 23 nVIDIA G72M CRT PAGE 24 PCIE 533 BGA	Original	YONAH/CALISTOGA-PM/G72M ICS954310 ADT7473 133/166MHz 512MB 945PM 533/667MHz 100MHz RTL8111B M38857 ICS954310 U6042 CR6338 U6020 G547B2 R5538 C6138 ICS954310BGLFT R6660 U6041	PDF
ITE8511 Abstract: asus ITE 8511 U6042 L5792 C6550 U6052 R8700 L1042B C6352 Text: 5 4 3 2 1 T76S: MEROM/965-PM/ICH8-M/NB8M-SE BLOCK DIAGRAM CLOCK GEN. ICS9LPR363CGLF-T GDDR2 VRAM*4 16X16 D Merom PAGE 21 D 478B uFCPGA FAN + Thermal sensor 84 FBGA PAGE 51 PAGE 36 PAGE 3,4,5 FSB 800 MHz LVDS nVIDIA NB8M-SE PAGE 34 CRT PAGE 35 533 BGA POWER	Original	MEROM/965-PM/ICH8-M/NB8M-SE 16X16) ICS9LPR363CGLF-T 965PM 667MHz RTL8111B ALC660D PMN45EN FDW2501 MAX8632 ITE8511 asus ITE 8511 U6042 L5792 C6550 U6052 R8700 L1042B C6352	PDF
ITE 8511 Abstract: ITE8511 C6290 U606-3 C-6533 C6384 asus u6042 B C6113 U6048 Text: 5 4 3 2 1 T76S: MEROM/965-PM/ICH8-M/NB8M-SE BLOCK DIAGRAM CLOCK GEN. ICS9LPR363CGLF-T GDDR2 VRAM*4 16X16 D Merom PAGE 21 D 478B uFCPGA FAN + Thermal sensor 84 FBGA PAGE 51 PAGE 3,4,5 PAGE 36 FSB 800 MHz LVDS nVIDIA NB8M-SE PAGE 34 CRT PAGE 35 533 BGA POWER	Original	MEROM/965-PM/ICH8-M/NB8M-SE 16X16) ICS9LPR363CGLF-T 965PM 667MHz RTL8111B ALC660D PMN45EN FDW2501 MAX8632 ITE 8511 ITE8511 C6290 U606-3 C-6533 C6384 asus u6042 B C6113 U6048	PDF
bd248 Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)	Original		PDF
ep600i Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)	Original		PDF
240 pin rqfp drawing Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)	Original	7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance	PDF
208 pin rqfp drawing Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.	Original		PDF
EP4CE15 Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead	Original	DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22	PDF
EP4CE6 package Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80 Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead	Original	DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80	PDF
PQFP 176 Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760 Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●	Original	144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760	PDF

ddr2 laptop pin Abstract: DDR3 Infineon microDIMM 214 DDR3 miniDIMM JEDEC DDR2 DIMM 240 pinout DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR333 Text: Product Information 2004 MEMORY DRAM Modules Including DDR2 Modules w w w. i n f i n e o n . c o m / m e m o r y Never stop thinking. Introduction One-Stop-Shopping for DRAM Modules J U N E 2 0 0 4 . As a leading memory products supplier, we offer an extensive range of leading-edge DRAM modules.	Original	B166-H8412-X-X-7600 ddr2 laptop pin DDR3 Infineon microDIMM 214 DDR3 miniDIMM JEDEC DDR2 DIMM 240 pinout DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR333	PDF
IS43DR16320B Abstract: IS43DR16320B-37CBLI IS43DR86400B37CBLI IS43DR16320 IS43DR16320B-3DBLI IS46DR86400B3DBLA2 46DR86400B 400B 800E IS46DR16320B-3DBLA2 Text: IS43/46DR86400B, IS43/46DR16320B PRELIMINARY INFORMATION MARCH 2010 512Mb x8, x16 DDR2 SDRAM FEATURES • • • • • • • • • • • • • • • Clock frequency up to 400MHz Posted CAS Programmable CAS Latency: 3, 4, 5 and 6	Original	IS43/46DR86400B, IS43/46DR16320B 512Mb 400MHz cycles/64 84ball IS46DR16320B3DBLA2 IS43DR16320B IS43DR16320B-37CBLI IS43DR86400B37CBLI IS43DR16320 IS43DR16320B-3DBLI IS46DR86400B3DBLA2 46DR86400B 400B 800E IS46DR16320B-3DBLA2	PDF
Untitled Abstract: No abstract text available Text: IS43/46DR86400B, IS43/46DR16320B AUGUST 2010 512Mb x8, x16 DDR2 SDRAM FEATURES • • • • • • • • • • • • • • • Clock frequency up to 400MHz Posted CAS Programmable CAS Latency: 3, 4, 5 and 6 Programmable Additive Latency: 0, 1, 2, 3, 4 and 5	Original	IS43/46DR86400B, IS43/46DR16320B 512Mb 400MHz cycles/64 60ball 84ball	PDF
Untitled Abstract: No abstract text available Text: IS43/46DR86400B, IS43/46DR16320B JUNE 2010 512Mb x8, x16 DDR2 SDRAM FEATURES • • • • • • • • • • • • • • • Clock frequency up to 400MHz Posted CAS Programmable CAS Latency: 3, 4, 5 and 6 Programmable Additive Latency: 0, 1, 2, 3, 4 and 5	Original	IS43/46DR86400B, IS43/46DR16320B 512Mb 400MHz cycles/64 60ball 84ball	PDF
SAMSUNG 834 Abstract: No abstract text available Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm	Original	STD131 SAMSUNG 834	PDF
SAMSUNG 834 Abstract: pcb design 0,5 mm pitch STD130 Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm	Original	STD130 SAMSUNG 834 pcb design 0,5 mm pitch STD130	PDF
pcb design 0,5 mm pitch Abstract: SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm	Original	STDL130 pcb design 0,5 mm pitch SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance	PDF
MS-026 Abstract: MT55L128L18P1 MT55L128L18P1T-10 MT55L64L32P1 MT55L64L36P1 MT55L128 Text: 2Mb: 128K x 18, 64K x 32/36 3.3V I/O, PIPELINED ZBT SRAM 2Mb ZBT SRAM MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 3.3V VDD, 3.3V I/O FEATURES • • • • • • • • • • • • • • • • • • • High frequency and 100 percent bus utilization	Original	MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 June/21/00 x32/36 165-Pin May/23/00 MT55L128L18P1 MS-026 MT55L128L18P1T-10 MT55L64L32P1 MT55L64L36P1 MT55L128	PDF
Untitled Abstract: No abstract text available Text: 2Mb: 128K x 18, 64K x 32/36 3.3V I/O, PIPELINED ZBT SRAM 2Mb ZBT SRAM MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 3.3V VDD, 3.3V I/O FEATURES • • • • • • • • • • • • • • • • • • • High frequency and 100 percent bus utilization	Original	June/21/00 x32/36 165-Pin May/23/00 MT55L128L18P1	PDF
Untitled Abstract: No abstract text available Text: 2Mb: 128K x 18, 64K x 32/36 3.3V I/O, PIPELINED ZBT SRAM 2Mb ZBT SRAM MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 3.3V VDD, 3.3V I/O FEATURES • • • • • • • • • • • • • • • • • • • High frequency and 100 percent bus utilization	Original	MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 June/21/00 x32/36 165-Pin May/23/00 MT55L128L18P1	PDF

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84 FBGA THERMAL Search Results

84 FBGA THERMAL Result Highlights (5)

84 FBGA THERMAL Datasheets Context Search

M378T5663FB3

K4N1G164QF

K4N1G164QE

C6426

ICS954310

ITE8511

ITE 8511

bd248

ep600i

240 pin rqfp drawing

208 pin rqfp drawing

EP4CE15

EP4CE6 package

PQFP 176

ddr2 laptop pin

IS43DR16320B

Untitled

Untitled

SAMSUNG 834

SAMSUNG 834

pcb design 0,5 mm pitch

MS-026

Untitled

Untitled