8x8 64 footprint
Abstract: thermal PCB D2PAK ipl60r199cp IPL60R199 IPL60R299CP IPL60R385CP DB2010-0003 infineon smd Infineon Standard Power Products ipl60r
Text: Product Brief CoolMOS in ThinPAK 8x8 The new leadless SMD package for CoolMOS™ Infineon Technologies introduces the ThinPAK™ 8x8, a new leadless SMD package for HV MOSFETs. The new package has a very small footprint of only 64 mm² vs. 150 mm² for the D2PAK and a very low profile with only 1 mm
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B152-H9469-X-X-7600
DB2010-0003
8x8 64 footprint
thermal PCB D2PAK
ipl60r199cp
IPL60R199
IPL60R299CP
IPL60R385CP
DB2010-0003
infineon smd
Infineon Standard Power Products
ipl60r
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Untitled
Abstract: No abstract text available
Text: PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid FEATURES • Strong Metal Cam Activates Normally-closed Contacts, Preventing Dependency on Plastic for Contact Force • Handle mounted on Right- or Left-hand Side • Any Footprint Accepted on Standard 13x13 to 21x21 Grid
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21x21
13x13
MILG-45204
B54597
QQ-N-290
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Untitled
Abstract: No abstract text available
Text: STL24NM60N N-channel 600 V, 0.200 Ω typ., 16 A MDmesh II Power MOSFET in a PowerFLAT 8x8 HV package Datasheet − production data Features 6 6 6 Order code %RWWRPYLHZ VDS @ TJmax RDS on max STL24NM60N 650 V * ID 16 A (1) < 0.215 Ω 1. The value is rated according to Rthj-case
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STL24NM60N
DocID18363
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Untitled
Abstract: No abstract text available
Text: PA51CC-BD Data Sheet 64 pin uBGA socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of an Atmel T89C51CC01 in the 64 pin uBGA package using the 40 pin DIP footprint specified by Atmel. This adapter is made up of 3 sub-assemblies. They assemble via
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PA51CC-BD
socket/40
T89C51CC01
CA-BGA64
51CCBD
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QFN 64 8x8 footprint
Abstract: 8x8 64 footprint
Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: 30 SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA
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COOLRUNNER-II examples
Abstract: 245RL CPLD XC2C64 from Xilinx CoolRunner-II family CP132 equivalent 8x8 keyboard and microcontroller interfacing EPM240Z M100 XC2C128 XC2C256 XC2C64
Text: White Paper Reduce Total System Cost in Portable Applications Using Zero-Power CPLDs Introduction Traditionally, portable system designers have used ASICs and ASSPs to implement memory interfaces, I/O expansion, power-on sequencing, discrete logic functions, display, and other functions in portable systems. Cost
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STL24NM60N
Abstract: No abstract text available
Text: STL24NM60N N-channel 600 V, 0.200 Ω, 16 A PowerFLAT 8x8 HV MDmesh™ II Power MOSFET Features Type VDSS @ TJmax RDS on max ID STL24NM60N 650 V < 0.215 Ω 16 A (1) 3 3 3 "OTTOM VIEW ' $ 1. The value is rated according to Rthj-case • 100% avalanche tested
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STL24NM60N
STL24NM60N
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DS00167
Abstract: DS00104 ds39500 detector brownout Microchip Product Line DS00148 DS00711 DS00092 Embedded Control Handbook DS00092 1024X16 PIC18CXXX
Text: PIC18F010/020 Microcontroller Family The PIC18F010/020 Microcontroller Products pack all the advantages of the PIC18C architecture and the flexibility of FLASH program memory in an 8-pin package. The PIC18F010/020 products feature a 16-bit instruction set, small
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PIC18F010/020
PIC18C
16-bit
DS41151A
DS41151A*
DS00167
DS00104
ds39500
detector brownout
Microchip Product Line DS00148
DS00711
DS00092
Embedded Control Handbook DS00092
1024X16
PIC18CXXX
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24nm60n
Abstract: PowerFLAT 24nm6 STL24NM60N
Text: STL24NM60N N-channel 600 V, 0.200 Ω, 16 A PowerFLAT 8x8 HV MDmesh™ II Power MOSFET Preliminary data Features Type VDSS @ TJmax RDS(on) max ID STL24NM60N 650 V < 0.215 Ω 16 A (1) 3 3 3 "OTTOM VIEW ' $ 1. The value is rated according to Rthj-case
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STL24NM60N
24nm60n
PowerFLAT
24nm6
STL24NM60N
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Untitled
Abstract: No abstract text available
Text: 325 MHz, 8 x 8 Buffered Video Crosspoint Switches AD8108/AD8109 FUNCTIONAL BLOCK DIAGRAM EATURES APPLICATIONS Routing of high speed signals including Composite video NTSC, PAL, S, SECAM Component video (YUV, RGB) Compressed video (MPEG, Wavelet) 3-level digital video (HDB3)
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AD8108/AD8109
AD8108:
AD8109:
AD8110/AD8111
AD8116
AD8108
AD8109
AD8108)
AD8109)
80-Lead
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12N65
Abstract: STL12N65M5 12N65M5 8534A
Text: STL12N65M5 N-channel 650 V, 0.390 Ω, 8.5 A PowerFLAT 8x8 HV ultra low gate charge MDmesh™ V Power MOSFET Preliminary data Features Type VDSS @ TJmax RDS(on) max ID STL12N65M5 710 V < 0.430 Ω 8.5 A (1) 3 3 3 "OTTOM VIEW ' $ 1. The value is rated according to Rthj-case
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STL12N65M5
12N65
STL12N65M5
12N65M5
8534A
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4DSYSTEMS
Abstract: 8x12 font 8x8 font oled full colour microoled
Text: µOLED-96-G1 USERS MANUAL Embedded Intelligent OLED Display Module tiny serial display module with integrated micro-SD card support Revision 1.0 4D Systems PROPRIETORY INFORMATION The information contained in this document is the property of 4D Systems Pty. Ltd., and may
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OLED-96-G1
au/downloads/micro-OLED/uOLED-96-G1
4DSYSTEMS
8x12 font
8x8 font
oled full colour
microoled
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12x16 font
Abstract: PMD235 uLCD-320-PMD2 8x8 64 footprint microVGA MicroOLED 8x12 font
Text: µLCD 320 PMD2 µSD USERS MANUAL Serial Command Platform Revision 1.1 4D Systems PROPRIETORY INFORMATION The information contained in this document is the property of 4D Systems Pty. Ltd., and may be the subject of patents pending or granted, and must not be copied or disclosed with out
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AGL125-QNG132
Abstract: FLASHPRO4 A2F500M3G A2F500M3G-FGG484 oled display 96x16 A2F500 A3PE jtag connector VQ100 emmc socket BGA A3P1000 144
Text: Product Catalog May 2010 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low power FPGAs and mixed signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart
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WG82574it
Abstract: QFN 64 8x8 footprint WG82578DM JL82576EB QFN 64 9x9 footprint intel 82574L JL82599ES WG82583 JL82599EB WG82577LM
Text: http://intel.com/go/ethernet Driver Support Microsoft Windows 7* Microsoft Windows Vista* 32 & 64 bit Microsoft Windows XP* (32 & 64 bit) Microsoft Windows CE* Microsoft Windows NT* Microsoft Windows 2000 Server* Microsoft Windows Server 2003* (32 & 64 bit)
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RC82573E
RC82573V
RC82573L
RC82545GM
FW82546GB
GD82541PI
GD82541ER
WG82567LM
ICH10
2567V
WG82574it
QFN 64 8x8 footprint
WG82578DM
JL82576EB
QFN 64 9x9 footprint
intel 82574L
JL82599ES
WG82583
JL82599EB
WG82577LM
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1000-pin bga 0,8 mm
Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
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Unit2607
REJ01K0003-0300
1000-pin bga 0,8 mm
HQFP1414-64
HLQFP 176 Package
BGA and QFP Package mounting
HLQFP1414-100
MO-235 FOOTPRINT
QFN 64 8x8 footprint
footprint WSON
LFPAK footprint Renesas
"General Catalog"
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TQ144
Abstract: XC5204 matrix 8x8 PQ100 PQ160 XC5200 XC5210 VersaBLOCK PC84 VQ100
Text: XC5200 FPGA Family Grows T he XC5200 FPGA family has been expanded to include the 2,500-gate XC5202 and the 4,000-gate XC5204. The XC5200 family now includes flexible, high-density FPGA devices ranging from 2,500 to 18,000 gates. For lower-density designs that do not
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XC5200
500-gate
XC5202
000-gate
XC5204.
XC5204
TQ144
matrix 8x8
PQ100
PQ160
XC5210
VersaBLOCK
PC84
VQ100
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S29GL064N application notes
Abstract: TSOP56 FOOTPRINT S29GL064N Numonyx M29W640GS hardware protection of S29GL064N Numonyx software and application Spansion Flash M29W640GT SPANSION 16
Text: Migrating to Spansion S29GL-N from Numonyx M29W 32-64 Mb Application Note 1. Introduction This Application Note details how to migrate designs from Numonyx™ 32 Mbit M29W320E and 64 Mbit M29W640G Flash Memory devices to Spansion® 32 Mbit S29GL032N and 64 Mbit S29GL064N MirrorBit®
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S29GL-N
M29W320E
M29W640G
S29GL032N
S29GL064N
S29GL064N application notes
TSOP56 FOOTPRINT
Numonyx
M29W640GS
hardware protection of S29GL064N
Numonyx software and application
Spansion Flash
M29W640GT
SPANSION 16
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M2GL005
Abstract: A2F060
Text: Power Matters. CO LUT4 C OVFL LO UB ADD_S FPGA and SoC Product +/- Catalog ] A[17:0 D EN RO IN YP EN _SR CLK RST EN X ] C[43:0 SL D SN[43 D ] B[17:0 17 SHIFT >> 17 ASC SEL_C SECURITY RELIABILITY LOW POWER :0] SN-1[43 I N T E G R AT I O N FPGAs SoC FPGAs
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MS2-002-14
M2GL005
A2F060
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emmc pcb layout
Abstract: oled display 96x16 fpga JTAG Programmer Schematics FLASHPRO4 A3PE1500-PQ208 ACTEL flashpro A2F200M3F-FGG484 96x16 oled A2F500 VQ100
Text: Product Catalog March 2010 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low-power FPGAs and mixed-signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart
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WG82579LM
Abstract: WG82574IT NHI350AM2 WG82579V JL82599EN NHI350AM WG82579 JLX540AT2 WG82583V 82599EN
Text: www.intel.com/go/ethernet Driver Support Microsoft Windows 7* Microsoft Windows Vista* 32 & 64 bit Microsoft Windows XP* (32 & 64 bit) Microsoft Windows CE* Microsoft Windows NT* Microsoft Windows 2000 Server* Microsoft Windows Server 2003* (32 & 64 bit)
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82546GB
RC82545GM
FW82546GB
82541PI
82541ER
15x15
196-pin
GD82541PI
GD82541ER
WG82579LM
WG82574IT
NHI350AM2
WG82579V
JL82599EN
NHI350AM
WG82579
JLX540AT2
WG82583V
82599EN
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Untitled
Abstract: No abstract text available
Text: L.C.C. Production Sockets YAMAICHI IC61 Series • SPECIFICATIONS • JEDEC standard LCC socket • High density requires less board space • SMT through hole short & through hole long type available ■ CHARACTERISTICS Insulator Resistance Breakdown Voltage
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000MO
10mA/20mV
UL94V-0
11x11
12x12
17x17
24x16
30x20
40x40
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Untitled
Abstract: No abstract text available
Text: YAÏ1AICHI ELECTRONICS INC bôE » L.C.C. Production Sockets • tìe145S3h ÜDQnS70 Sb? ■ YAMAICHI IC61 Series I SPECIFICATIONS JEDEC standard LCC socket High density requires less board space SMT through hole shoit & through hole long type available Terminal TVpe
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145S3h
DQnS70
30mmi2
10mA/20mV
UL94V-0
40x40
11x11
GG0GS71
IC61-0324-006
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fbga 12 x 12 thermal resistance
Abstract: FBGA160-P-1212
Text: 1C PACKAGES Pin-inserting Type i Surface-mount Type 1C Pack. TCP Tape Carrier Package CSP (Chip Size Package) Stacked Package COB (Chip On Board) Nowadays, the prominence of higher performance, smaller and lighter electronic equipment is increasing. Accordingly, the role played by the
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developme5x24
fbga 12 x 12 thermal resistance
FBGA160-P-1212
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