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    dallas date code ds1230

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00


    Original
    PDF DH046190AAI DS1620 DS1869 DH833210AAB DS5002 DN028766AAD DN030363AAA J-STD-020 DS1302 dallas date code ds1230

    JSTD-020

    Abstract: DM035 26438
    Text: RELIABILITY MONITOR DS1232L JAN '01 MONITOR REVISION DATE CD LOT NUMBER PINS PACKAGE 0051 DK038265AAC 8 C2-L SOIC PROCESS Single Poly, Single Metal 0.8 µm Standard Process DEVICE DS1232 WIDTH ASSEMBLY SITE 150x1.4 ATP Anam, PI JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original
    PDF DS1232L DK038265AAC DS1232 J-STD-020 85C/85% 14x20x DS80CH11 DS80CH11 DN034351AA JSTD-020 DM035 26438

    TI date code

    Abstract: 271-14
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS21352 A4 DN033071AAA LQFP STRESS: HIGH VOLTAGE LIFE MAR '01 26769 0103


    Original
    PDF DS21352 DN033071AAA DS2108 DN041061AAE TI date code 271-14