JSTD-020
Abstract: DM035 26438
Text: RELIABILITY MONITOR DS1232L JAN '01 MONITOR REVISION DATE CD LOT NUMBER PINS PACKAGE 0051 DK038265AAC 8 C2-L SOIC PROCESS Single Poly, Single Metal 0.8 µm Standard Process DEVICE DS1232 WIDTH ASSEMBLY SITE 150x1.4 ATP Anam, PI JOB NO DESCRIPT Cf: 60% Ea: 0.7
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DS1232L
DK038265AAC
DS1232
J-STD-020
85C/85%
14x20x
DS80CH11
DS80CH11
DN034351AA
JSTD-020
DM035
26438
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dallas date code ds1230
Abstract: No abstract text available
Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00
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DH046190AAI
DS1620
DS1869
DH833210AAB
DS5002
DN028766AAD
DN030363AAA
J-STD-020
DS1302
dallas date code ds1230
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2-5779
Abstract: No abstract text available
Text: RELIABILITY MONITOR DS1230AB-200 JUL '00 Monitor DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 B1-A 0019 720 117143 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 25775 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 2 2 25776 PHYSICAL DIMENSIONS MIL-STD-883-2016
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DS1230AB-200
DS1230
MIL-STD-883-2003
MIL-STD-883-2016
60C/90%
DS3816
DS3801
-C501
2-5779
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