Untitled
Abstract: No abstract text available
Text: 1152 Megabit CMOS DRAM DPD32MS36PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD32MS36PKW5 is the 32 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks
|
Original
|
PDF
|
DPD32MS36PKW5
DPD32MS36PKW5
72-pin
30A155-10
|
simm 72 dram
Abstract: SIMM 80 jedec transistor C 2240 TT 2240
Text: 1024 Megabit CMOS DRAM DPD32MS32PW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD32MS32PW5 is the 32 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks
|
Original
|
PDF
|
DPD32MS32PW5
DPD32MS32PW5
72-pin
70rosystems,
30A146-01
simm 72 dram
SIMM 80 jedec
transistor C 2240
TT 2240
|
Untitled
Abstract: No abstract text available
Text: 1024 Megabit CMOS DRAM DPD32MS32PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD32MS32PKW5 is the 32 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks
|
Original
|
PDF
|
DPD32MS32PKW5
DPD32MS32PKW5
72-pin
30A159-10
|
Untitled
Abstract: No abstract text available
Text: 1152 Megabit CMOS DRAM DPD32MS36PW5 PRELIMINARY DESCRIPTION: The DPD32MS36PW5 is the 32 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks
|
Original
|
PDF
|
DPD32MS36PW5
DPD32MS36PW5
72-pin
30A152-01
|
MA3280
Abstract: ua3680
Text: 1280 Megabit CMOS DRAM DPD32MS40PKW5 PRELIMINARY DESCRIPTION: The DPD32MS40PKW5 is the 32 Meg x 40 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks,
|
Original
|
PDF
|
DPD32MS40PKW5
DPD32MS40PKW5
72-pin
30A153-01
MA3280
ua3680
|
Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1024 Megabit CMOS DRAM MICROSYSTEMS DPD32MS32PW5 PRELIMINARY PIN-OUT DIAGRAM D ESC R IPT IO N : The DPD32MS32PW5 is the 32 Meg x 32 Dynamic RAM module in the family of Sup er SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks
|
OCR Scan
|
PDF
|
DPD32MS32PW5
DPD32MS32PW5
72-pin
|
e351
Abstract: DPD32
Text: DENSE-PAC 1280 Megabit CMOS DRAM MICROSYSTEMS DPD32MS40PW 5 _ PRELIMINARY_ D E S C R IP T IO N : The D P D 32M S40 PW 5 is the 32 M eg x 40 Dynamic RAM module in the family of Super SIM M modules that utilize the new and innovative space saving TSO P
|
OCR Scan
|
PDF
|
DPD32MS40PW
100ns
30A153-01
DPD32MS40PW5
3QA153-01
e351
DPD32
|
Untitled
Abstract: No abstract text available
Text: DENSE-PAC o vi i c R 1024 Megabit CMOS DRAM DPD32MS32RW s y s r i: m s DESCRIPTION: The DPD32MS32RW is the 32 Meg x 32 Dynamic RAM module in the family of modules that utilize the space saving TSOP technology. The module is constructed of sixteen 16M x 4 dynamic RAM surface mounted on an industry standard 72-pin
|
OCR Scan
|
PDF
|
DPD32MS32RW
DPD32MS32RW
72-pin
100ns
30A171-00
|
Untitled
Abstract: No abstract text available
Text: DENSE-PAC o vi i c R 1152 Megabit CMOS DRAM DPD32MS36RW s y s r i: m s DESCRIPTION: The DPD32MS36RW is the 32 Meg x 36 Dynamic RAM module in the family of JEDEC Standard modules that utilize the space saving TSOP technology. The module is constructed of sixteen 16Mx4 dynamic RAMs and eight 16 Meg x 1 Dynamic RAM's
|
OCR Scan
|
PDF
|
DPD32MS36RW
DPD32MS36RW
16Mx4
72-pin
100ns
30A170-00
|
Ka-52
Abstract: D32M
Text: DENSE-PAC 1152 Megabit CMOS DRAM MICROSYSTEMS DPD32MS36PW5 P R ELIM IN A R Y D E S C R IP T IO N : The DPD32M S36PW 5 is the 32 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks
|
OCR Scan
|
PDF
|
DPD32MS36PW5
DPD32M
S36PW
72-pin
dec3QA152-01
100ns
30A152-01
Ka-52
D32M
|
Untitled
Abstract: No abstract text available
Text: 128 Megabit CMOS DRAM D E N S E -P A C m i e R e s y s t e m s : DPD32MX4PY5 PRELIM INARY DESCRIPTION: The DPD32MX4PY5 is the 32 M e g x4 Dynamic RAM module that utilizes the new and innovative space saving TSOP stacking technology. The module is constructed of eight 16
|
OCR Scan
|
PDF
|
DPD32MX4PY5
DPD32MX4PY5
30A149-08
|
1s311
Abstract: No abstract text available
Text: DENSE-PAC 1280 Megabit CMOS DRAM DPD32MX40PKW5 M ICRO SYSTEM S PRELIMINARY D ESC RIPT IO N : The DPD32M X40PKW 5 is the 32 Meg x 40 ECC Dynamic RAM module in the family of SuperSIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twenty-four dynamic RAM stacks
|
OCR Scan
|
PDF
|
DPD32MX40PKW5
DPD32M
X40PKW
72-pin
X40PKW5
3QA153-11
1s311
|
RA3045
Abstract: DQ2451
Text: DENSE-PAC MICROSYSTEMS 1024 Megabit CMOS DRAM DPD32MS32PKW5 PRELIMINARY D ESCRIPTIO N : The DPD32MS32PKW5 is the 32 Meg x 32 Dynamic RAM module in the family of Su p er SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks
|
OCR Scan
|
PDF
|
DPD32MS32PKW5
DPD32MS32PKW5
72-pin
30A159-10
100ns
72-PtN
3QA159-10
RA3045
DQ2451
|
Untitled
Abstract: No abstract text available
Text: DENSE-PAC o vi i c R 1280 Megabit CMOS DRAM DPD32MS40RW s y s r i: m s PIN-OUT DIAGRAM DESCRIPTION: The DPD32MS40RW is the 32 Meg x 40 ECC Dynamic RAM modules that utilize the space saving TSOP stacking technology. The module is constructed of twenty 16M x 4 dynamic RAM's surface mounted on an industry standard 72-pin SIMM
|
OCR Scan
|
PDF
|
DPD32MS40RW
DPD32MS40RW
72-pin
32IVI
30A176-00
|
|
11kO
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 1152 Megabit CMOS DRAM DPD32MS36PKW5 PRELIMINARY D E S C R IP T IO N : PIN-OUT DIAGRAM The DPD32M536PKW5 is the 32 Meg x 36 Dynamic RAM module in the family of S u p e rS IM M modules that utilize the new and innovative space saving TSOP
|
OCR Scan
|
PDF
|
DPD32MS36PKW5
DPD32M536PKW5
72-pin
DPD32MS36PKW5
30A155-10
100ns
11kO
|
Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 1024 Megabit CMOS DRAM DPD32M X32PKW 5 PRELIMINARY D ESCRIPTIO N : The DPD32MX32PKW5 is the 32 Meg x 32 Dynamic RAM module in the family of Su p er SIM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks
|
OCR Scan
|
PDF
|
DPD32M
X32PKW
DPD32MX32PKW5
72-pin
DPD32MX32PKW5
3QA1S900
30A159-00
|
Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1152 Megabit CMOS DRAM DPD32MX36PKW5 MICROSYSTEMS PRELIMINARY DESCRIPTION: The DPD32MX36PKW5 is the 32 Meg x 36 Dynamic RAM module in the family of SuperSlM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twenty-four dynamic RAM stacks
|
OCR Scan
|
PDF
|
DPD32MX36PKW5
DPD32MX36PKW5
72-pin
100ns
30A155-00
|
Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1280 Megabit CMOS DRAM MICROSYSTEMS DPD32MS40PKW5 PRELIMINARY D ESCRIPTIO N : The DPD32MS40PKW5 is the 32 Meg x 40 Dynamic RAM module in the family of S u p e r S IM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks,
|
OCR Scan
|
PDF
|
DPD32MS40PKW5
DPD32MS40PKW5
72-pin
100ns
3QA153-01
30A153
|
A273D
Abstract: 16J3 512X32 48pin
Text: R E F E R E N C E D R A O RG AN IZA TIO N PART NUMBER SIZE M P R O D 512 M egabit 6 4 0 Megabit 1024 Megabit 1152 Megabit 1152 Megabit S I Î A M P SPEED ns PACKAGE 16M x4 60, 70, 80 26-Pin TStack 19 16M x32 70, 80, 100 72-Pin S IM M 29 DPD16M X32PKW 5 16M x32
|
OCR Scan
|
PDF
|
26-Pin
72-Pin
A273D
16J3
512X32
48pin
|
256KX8 SIMM
Abstract: 512kx8 dram simm dram zip 256kx16 1mx8 DPS 119 61 sram 256kx8
Text: TABLE OF CONTENTS GENERAL PRODUCT INFORMATION Reference by S iz e . 4 Dense-Pac Microsystems Modules and M onolithics. 5
|
OCR Scan
|
PDF
|
250ns,
1Mx8/512Kx16/256Kx32,
150-250ns,
DPZ128X32VT/DPZ128X32VTP
Z256S32IW
512Kx8/256Kx16/128Kx32,
120-250ns,
256KX8 SIMM
512kx8 dram simm
dram zip 256kx16
1mx8
DPS 119
61 sram 256kx8
|