MO-195
Abstract: sot747
Text: PDF: 2002 Jan 15 Philips Semiconductors Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm D SOT747-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E D C B A
|
Original
|
PDF
|
TFBGA72:
OT747-1
FBGA72:
MO-195
MO-195
sot747
|
Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT761-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
PDF
|
TFBGA72
OT761-1
OT761-1
|
Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT747-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
PDF
|
TFBGA72
OT747-1
OT747-1
|
Untitled
Abstract: No abstract text available
Text: Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm D SOT747-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11
|
Original
|
PDF
|
TFBGA72:
OT747-1
MO-195
|
Untitled
Abstract: No abstract text available
Text: Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 6 x 6 x 0.8 mm D SOT761-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C K J H e G F e2 E 1/2 e D C B A ball A1 index area 1 2 3
|
Original
|
PDF
|
TFBGA72:
OT761-1
MO-195
|
MO-195
Abstract: sot761
Text: PDF: 2002 Apr 11 Philips Semiconductors Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 6 x 6 x 0.8 mm D SOT761-1 A B ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C K J H e G F e2
|
Original
|
PDF
|
TFBGA72:
OT761-1
MO-195
MO-195
sot761
|
SC28L198
Abstract: SCC2691AC1A28 LCD 09151 CSOT109 PCA9552 PCK2002 PCF8591 APPLICATION pecl clock so8 PCA9550 PCA9553
Text: Interface Products Interface Products 67 I2C Logic Family Overview • Analog/Digital Converters It is frequency required to record analog information, such as temperature, pressure, battery level, signal strength, etc. The analog voltage information from the diode, pressure sensor,
|
Original
|
PDF
|
|
dh14
Abstract: CBTV4020EE JESD22-A114 JESD22-A115 JESD78 F DH13
Text: INTEGRATED CIRCUITS CBTV4020 20-bit DDR SDRAM 2:1 mux Product data Philips Semiconductors 2002 Sep 27 Philips Semiconductors Product data 20-bit DDR SDRAM 2:1mux CBTV4020 FEATURES DESCRIPTION • SEL signal is SSTL_2 compatible • Optimized for use in Double Data Rate DDR SDRAM
|
Original
|
PDF
|
CBTV4020
20-bit
dh14
CBTV4020EE
JESD22-A114
JESD22-A115
JESD78
F DH13
|
dh14
Abstract: Transistors Diodes smd dh18 Transistors smd dh10 JESD22-A114 JESD22-A115 JESD78
Text: CBTV4020 20-bit DDR SDRAM 2 : 1 MUX Rev. 03 — 4 April 2008 Product data sheet 1. General description This 20-bit bus switch is designed for 2.3 V to 2.7 V VDD operation and SSTL_2 select input levels. Each host port pin is multiplexed to one of two DIMM port pins. When the SEL pin is HIGH
|
Original
|
PDF
|
CBTV4020
20-bit
CBTV4020
dh14
Transistors Diodes smd dh18
Transistors smd dh10
JESD22-A114
JESD22-A115
JESD78
|
DDR2 SSTL class
Abstract: SSTL_18 DDR1-400 DDR2 SDRAM with SSTL_18 interface TVSOP-48 SSTL-18 PCK2059 SSTV16857 DDR200 hp SSTU32866
Text: Memory interfaces Support logic for memory modules and other memory subsystems Portfolio overview PC100 to PC133 • AVC, ALVC, AVCM, and ALVCH series registered drivers • PCK2509 and PCK2510 series PLL clock buffers DDR200 to DDR266 • SSTV and SSTL series registered drivers
|
Original
|
PDF
|
PC100
PC133
PCK2509
PCK2510
DDR200
DDR266
DDR333
DDR400
PCKVF857
DDR2-400
DDR2 SSTL class
SSTL_18
DDR1-400
DDR2 SDRAM with SSTL_18 interface
TVSOP-48
SSTL-18
PCK2059
SSTV16857
hp SSTU32866
|
74hc273
Abstract: 74hct273 74HCT390 3Gxxx hef4750 hef4066 toshiba datecode 74HC4520 dual sot363 marking code dp 74f3037
Text: Logic Logic 93 5 Volt Logic Product Spectrum FEATURES AND FUNCTIONS FUNCTIONAL MATRIX • ALVT • • HEF4000 • • • • • • • • • • • HC/HCT • • • • • • • • • • • FAST • • • • • • • • • • • ABT
|
Original
|
PDF
|
HEF4000
MB2245
16-Bit
MB2543
MB2652
74hc273
74hct273
74HCT390
3Gxxx
hef4750
hef4066
toshiba datecode
74HC4520
dual sot363 marking code dp
74f3037
|
IC ax 2008 USB FM PLAYER
Abstract: STi7110 IC ax 2008 used for mp3 player le88221 PI7C9X440SL PI7C9X111SL bl3458 pi3eqx6701 PI3EQX5701 PAS5201
Text: Table of Contents PAGE 2 3 About Pericom Applications 13 Products - Signal Integrity 14 17 18 19 PCI Express ReDriver SAS/SATA/XAUI ReDriver Digital Video Signal Integrity DisplayPort, HDMI, DVI USB3 ReDriver 21 Products - Connectivity 23 25 27 33 35 45
|
Original
|
PDF
|
|
smd code marking 56 sot23-6
Abstract: marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5
Text: PACKAGING Package Information Packaging & Ordering Packaging Solutions for Modern Electronic Design In addition to standard legacy packaging, Pericom leads the industry in smaller, more advanced packaging profiles and footprints for today’s designers. Our offerings include very small packages,
|
Original
|
PDF
|
PI3USB412
PI74STX1GU04A
PI3USBA03
PI74STX2G04
PI3USBA201
PI74STX2G14
PI5A121
PI74STX2G4245
PI5A122
smd code marking 56 sot23-6
marking code 604 SOT23-6
PD-1503
smd zG sot 23
smd marking sot23 W16
ic SMD MARKING CODE ad 5.9
ic ap 2068
PD2029
SMD MARKING ed sot23-5
MARKING CODE SMD IC sot23-5
|
t06 sot23
Abstract: TQFN-56 TQFN-64 ZL42 SC70-5 w08 SOT23-5 w08 TQFN56 TQFN-72 LQFP64 reel size ZG12
Text: Plastic IC Package Information Tape & Reel Tape and Reel packing system protects Pericom’s products from mechanical and electrical damage and is designed for automatic pick-and-place equipment. Pericom’s tape and reel specifications are in compliance with Electronics Industries Association standards for embossed carrier taping of sur face mount components for Automatic Handling EIA-481, current
|
Original
|
PDF
|
EIA-481,
13-inch
t06 sot23
TQFN-56
TQFN-64
ZL42
SC70-5 w08
SOT23-5 w08
TQFN56
TQFN-72
LQFP64 reel size
ZG12
|
|
|
Untitled
Abstract: No abstract text available
Text: T-FBGA720-3535-0.80B5 Unit : mm T-FBGA720-3535-0.80B5 Unit o o o o o oooooo <t>o ooooo ® 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 9 1 oooooooooooooooooooo oooooooooooooooooooo® o o o o o o o o o o o oo o oo o oo o oooooooooooooooooooo® oooooooooooooooooooo
|
OCR Scan
|
PDF
|
|