SOT747 Search Results

SOT747 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT747-1		NXP Semiconductors	Plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm		Original	PDF
SOT747-1		NXP Semiconductors	Footprint for reflow soldering SOT747-1		Original	PDF

SOT747 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
b0245a Abstract: b0607 PH3055T FT3055 SOLITRON B0501A MJE280H MJE2801K MJE3055K Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 2N5877 SOT7732 SOT7732 SOT7732 SOT7742 SOT7742 SOT7742 SOT7762 ~g:gg~~ 35 40 SOT7012 SOT7475 2N2811 OTL8012 SOT3226 SOT3226 SOT3226 SOT85307 SD+;5~01 45 50 55 60 65 70 SOT85507 SOT85607 SOT85607	Original	PDF	B0207 BOW21A B0501A OT7618 FT3055 SSP66A 2N6098 2N6099 b0245a b0607 PH3055T SOLITRON MJE280H MJE2801K MJE3055K
MO-195 Abstract: sot747 Text: PDF: 2002 Jan 15 Philips Semiconductors Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm D SOT747-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E D C B A	Original	PDF	TFBGA72: OT747-1 FBGA72: MO-195 MO-195 sot747
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT747-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	TFBGA72 OT747-1 OT747-1
Untitled Abstract: No abstract text available Text: Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm D SOT747-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11	Original	PDF	TFBGA72: OT747-1 MO-195