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    Mil-Std-883 Wire Bond Pull Method 2011

    Abstract: No abstract text available
    Text: AUSTIN SEMICONDUCTOR INC büE D • TG02117 0000375 ifl? H A U S T 1 MT58C1616 DIE 16K X 16 SYNCHRONOUS SRAM | u iic = n o N - ■ ' P M W . ' ì - ' S MILITARY SRAM DIE 16Kx 16 SRAM WITH CLOCKED, REGISTERED INPUTS FEATURES •


    OCR Scan     		PDF TG02117 MT58C1616 Mil-Std-883 Wire Bond Pull Method 2011

    Untitled

    Abstract: No abstract text available
    Text: A S p AUSTIN SEMICONDUCTOR, INC. ^ m e g H s DRAM PRELIMINARY 1 D R A M M E G x 1 6 D R A M 3.3V, EDO PAGE MODE, OPTIONAL EXTENDED REFRESH AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • M IL-STD 883 44/50-Pin SOJ/LCC/Gull Wing 450mil • SM D Planned


    OCR Scan     		PDF 44/50-Pin 450mil 024-cycle 180mW CASTELLAT10NS

    Untitled

    Abstract: No abstract text available
    Text: ASiJ AUSTIN SEMICONDUCTOR, INC. SRAM 64K x 4 SRAM AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • SMD 5962-88545, SMD 5962-88681 • MIL-STD-883 FEATURES • • • • • • • • Ultra high speed: 12, 15ns Highspeed: 20, 25,35 and 45ns


    OCR Scan     		PDF MIL-STD-883 MT5C2564 24-Pin OSO00026 TGGE117 DS000026