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    TE Connectivity 44A0311-10-9-US

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    Interstate Connecting Components 44A0311-10-9-US 125
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    RS Pro 2450928 (25530357) (ALTERNATE: LWIA0311-100RS)

    5/16" Grade 8 Split Lock Washer Steel Alloy Zinc Yellow Plated | RS PRO 2450928 (25530357)
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    RS 2450928 (25530357) (ALTERNATE: LWIA0311-100RS) Package 10 Weeks 1
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    TE Connectivity 44A0311-10-9F863

    TE Connectivity
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    TE Connectivity 44A0311-10-2-US

    TE Connectivity
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    A031110 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    VN0104

    Abstract: No abstract text available
    Text: Supertex inc. VN0104 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0104 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF VN0104 VN0104 A031110

    HV57708

    Abstract: No abstract text available
    Text: Supertex inc. HV57708 Die Specification Pad Layout 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 0,0 23 42 22 43 21 44 20 45 19 46 18 47 17 48 16 49 15 50 14 51 13 52 12 53 11 54 10 55 9 56 8 57 7 58 6 59 5 60 4 61 3 62 2 63 1 64 65 80 79 78 77 76 75


    Original     		PDF HV57708 HV57708 A031110

    81 221

    Abstract: HV583 HVOUT116
    Text: Supertex inc. HV583 Die Specification Pad Layout 70 71 0,0 74 75 72 73 69 • • • • • • • • • • • • • • • • • • • • • • • • • 5 4 3 2 1 78 79 76 77 80 • • • • • • • • • • • • • •


    Original     		PDF HV583 HV583 123ingly A031110 81 221 HVOUT116

    VN0109

    Abstract: No abstract text available
    Text: Supertex inc. VN0109 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0109 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF VN0109 VN0109 A031110

    HV514

    Abstract: Bl 370
    Text: Supertex inc. HV514 Die Specification Pad Layout 5 6 7 8 9 10 11 12 13 4 14 3 2 16 0,0 17 1 25 24 23 22 21 20 19 18 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 134 91 19 - 28 None 1 (mils) HV514 1 (mils) 2 Back


    Original     		PDF HV514 HV514 A031110 Bl 370

    TN0110

    Abstract: No abstract text available
    Text: Supertex inc. TN0110 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) TN0110 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF TN0110 TN0110 A031110

    TN0104

    Abstract: No abstract text available
    Text: Supertex inc. TN0104 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) TN0104 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF TN0104 TN0104 A031110

    HV9808

    Abstract: No abstract text available
    Text: Supertex inc. HV9808 Die Specification Pad Layout 11 12 13 14 15 16 17 18 19 20 21 22 10 23 9 24 8 25 7 26 6 27 5 28 4 29 3 30 2 31 1 0,0 41 40 39 38 37 36 35 34 32 33 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal


    Original     		PDF HV9808 HV9808 A031110

    VN0606

    Abstract: No abstract text available
    Text: Supertex inc. VN0606 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0606 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF VN0606 VN0606 A031110

    HV57009

    Abstract: No abstract text available
    Text: Supertex inc. HV57009 Die Specification Pad Layout 0,0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 37 39 40 41 42 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 43 56 55 54


    Original     		PDF HV57009 HV57009 A031110

    Untitled

    Abstract: No abstract text available
    Text: Supertex inc. DN1509 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) DN1509 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF DN1509 DN1509 A031110

    LP0701

    Abstract: No abstract text available
    Text: Supertex inc. LP0701 Die Specification Pad Layout 1 2 3 0,0 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness (mils) Back Side Metal 50 70 11 ± 1.5 None (mils) LP0701 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si


    Original     		PDF LP0701 LP0701 A031110

    TN0106

    Abstract: No abstract text available
    Text: Supertex inc. TN0106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) TN0106 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF TN0106 TN0106 A031110

    HV4622

    Abstract: No abstract text available
    Text: Supertex inc. HV4622 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 1 0,0 45 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material VSS Al/Cu/Si 36 Die Specifications Die Dimensions


    Original     		PDF HV4622 HV4622 A031110

    HV5622

    Abstract: No abstract text available
    Text: Supertex inc. HV5622 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 1 0,0 45 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material GND Al/Cu/Si 36 Die Specifications Die Dimensions


    Original     		PDF HV5622 HV5622 A031110

    VP0109

    Abstract: No abstract text available
    Text: Supertex inc. VP0109 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VP0109 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF VP0109 VP0109 A031110

    HV5530

    Abstract: No abstract text available
    Text: Supertex inc. HV5530 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 1 0,0 45 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material GND Al/Cu/Si 36 Die Specifications Die Dimensions


    Original     		PDF HV5530 HV5530 A031110

    LND150

    Abstract: No abstract text available
    Text: Supertex inc. LND150 Die Specification Pad Layout 2 3 1 0,0 Backside: Source Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 11 ± 1.5 None 1 (mils) LND150 1 (mils) Back Side Bonding Pad Material Source Voltage


    Original     		PDF LND150 LND150 A031110

    VP0106

    Abstract: No abstract text available
    Text: Supertex inc. VP0106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VP0106 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF VP0106 VP0106 A031110

    IT 153

    Abstract: HV5122
    Text: Supertex inc. HV5122 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 1 0,0 45 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material GND Al/Cu/Si 36 Die Specifications Die Dimensions


    Original     		PDF HV5122 HV5122 A031110 IT 153

    VN0550

    Abstract: No abstract text available
    Text: Supertex inc. VN0550 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0550 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF VN0550 VN0550 A031110

    HV7620

    Abstract: No abstract text available
    Text: Supertex inc. HV7620 Die Specification Pad Layout 22 23 25 24 21 26 20 27 19 28 18 29 17 30 16 31 15 32 14 33 13 34 12 35 11 36 10 37 9 38 8 39 7 40 6 41 5 42 4 3 2 43 44 45 1 46 0,0 64/63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 Die Specifications


    Original     		PDF HV7620 HV7620 A031110

    vn0106

    Abstract: No abstract text available
    Text: Supertex inc. VN0106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0106 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description


    Original     		PDF VN0106 VN0106 A031110

    HV57908

    Abstract: No abstract text available
    Text: Supertex inc. HV57908 Die Specification Pad Layout 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 0,0 23 42 22 43 21 44 20 45 19 46 18 47 17 48 16 49 15 50 14 51 13 52 12 53 11 54 10 55 9 56 8 57 7 58 6 59 5 60 4 61 3 62 2 63 1 64 65 80 79 78 77 76 75


    Original     		PDF HV57908 HV57908 A031110