Untitled
Abstract: No abstract text available
Text: Revision 15 ProASIC3 Flash Family FPGAs with Optional Soft ARM Support Features and Benefits Advanced I/O High Capacity • 15 K to 1 M System Gates • Up to 144 Kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal 6 Copper , Flash-Based CMOS
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peak china qfn 9 x 9 tray drawing
Abstract: semi catalog AGL1000-FG484
Text: IGLOO Handbook IGLOO Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – IGLOO Datasheet IGLOO Low-Power Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
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connect usb in vcd player circuit diagram
Abstract: DIODE MARKING 534
Text: IGLOOe Handbook IGLOOe Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – IGLOOe Datasheet IGLOOe Low-Power Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
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Abstract: No abstract text available
Text: 2 – ProASIC3 DC and Switching Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for the –F speed grade are subject to change after establishing FPGA
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verilog code for 128 bit AES encryption
Abstract: 4 bit bistable latch vhdl code zoom 505 schematic 0.13-um CMOS standard cell library inverter
Text: Automotive ProASIC 3 Handbook Automotive ProASIC3 Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – Automotive ProASIC3 Datasheet Automotive ProASIC3 Flash Family FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
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Abstract: No abstract text available
Text: IGLOO nano Handbook IGLOO nano Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – IGLOO nano Datasheet IGLOO nano Low-Power Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
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IO191
Abstract: vhdl code for fifo and transmitter actel FG484 package mechanical drawing
Text: ProASIC 3L Low-Power Handbook ProASIC3L Low-Power Flash Device Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – ProASICL Low-Power Datasheet
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proasic3e
Abstract: No abstract text available
Text: Clock Conditioning Circuits in Low-Power Flash Devices and Mixed-Signal FPGAs Introduction This document outlines the following device information: Clock Conditioning Circuits CCC features, PLL core specifications, functional descriptions, software configuration information,
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A3P015,
AGL015,
AGLP030,
AGLP060,
AGLP125.
proasic3e
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Abstract: No abstract text available
Text: Radiation-Tolerant ProASIC 3 Handbook Radiation-Tolerant ProASIC3 Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – Radiation-Tolerant ProASIC3 FPGAs Datasheet
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IR 907
Abstract: No abstract text available
Text: IGLOO Handbook IGLOO Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – IGLOO Datasheet IGLOO Low-Power Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
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PS 229
Abstract: A3P250 A3P400 A3P600 PQ208 QN132 VQ100 cmos switch charge pump A3P100 A3P015
Text: Revision 10 ProASIC3 Flash Family FPGAs with Optional Soft ARM Support Features and Benefits Advanced I/O High Capacity • 15 k to 1 M System Gates • Up to 144 kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal 6 Copper , Flash-Based CMOS
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PS 229
A3P250
A3P400
A3P600
PQ208
QN132
VQ100
cmos switch charge pump
A3P100
A3P015
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E1 3007-2
Abstract: A3P030 A3P060 A3P125 A3P250 A3P400 C8051F120 a3pl
Text: DirectC v2.4 User’s Guide Actel Corporation, Mountain View, CA 94043 2009 Actel Corporation. All rights reserved. Printed in the United States of America Part Number: 5-02-00079-5 Release: May 2009 No part of this document may be copied or reproduced in any form or by any means without prior written
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Abstract: No abstract text available
Text: Revision 9 ProASIC3 nano Flash FPGAs Features and Benefits Advanced I/Os • 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation • Bank-Selectable I/O Voltages—up to 4 Banks per Chip • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V
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ACTEL FUSION AFS1500
Abstract: 50 pin flat ribbon cable DC SERVO MOTOR CONTROL VHDL GF 036 V6 Logic Cross-Reference A54 ZENER AFS600-FG256 AQ3 Series flashpro3 schematic leon3
Text: Actel Fusion Handbook Low-Power Flash Device Handbooks Introduction Device Handbooks contain all the information available to help designers understand and use Actel's devices. Handbook chapters are grouped into sections on the website to simplify navigation. Each chapter of the handbook can be viewed as an individual PDF file.
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A3P1000
Abstract: 160 e7 Datasheet A3P125 FBGA A3P250 A3P030 FBGA A3P600
Text: ProASIC3 Packaging 3 – Package Pin Assignments 48-Pin QFN Pin 1 48 1 Notes: 1. This is the bottom view of the package. 2. The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at
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A3P030
IO82RSB1
IO24RSB0
GEC0/IO73RSB1
IO22RSB0
GEA0/IO72RSB1
A3P1000
160 e7
Datasheet A3P125
FBGA A3P250
FBGA A3P600
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A3P060
Abstract: ProASIC3 A3P250 A3P250 QN68 A3P030 QN132 TQ144 VQ100 ProASIC3 lvds proasic3 a3p125
Text: v1.3 ProASIC3 Flash Family FPGAs with Optional Soft ARM® Support Features and Benefits High Capacity • 15 k to 1 M System Gates • Up to 144 kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • • • • 130-nm, 7-Layer Metal 6 Copper , Flash-Based CMOS Process
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A3P060
ProASIC3 A3P250
A3P250
QN68
A3P030
QN132
TQ144
VQ100
ProASIC3 lvds
proasic3 a3p125
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A3P060
Abstract: A3P125 A3P400 A3P030 FBGA A3P600 A3P1000
Text: ProASIC3 Packaging 3 – Package Pin Assignments 48-Pin QFN Pin 1 48 1 Notes: 1. This is the bottom view of the package. 2. The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at
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48-Pin
A3P030
IO82RSB1
IO24RSB0
GEC0/IO73RSB1
IO22RSB0
GEA0/IO72RSB1
A3P060
A3P125
A3P400
FBGA A3P600
A3P1000
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Abstract: No abstract text available
Text: Revision 10 ProASIC3 nano Flash FPGAs Features and Benefits Advanced I/Os • 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation • Bank-Selectable I/O Voltages—up to 4 Banks per Chip • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V
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Abstract: No abstract text available
Text: Revision 11 ProASIC3 nano Flash FPGAs Features and Benefits Advanced I/Os • 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation • Bank-Selectable I/O Voltages—up to 4 Banks per Chip • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V
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Abstract: A3P600 A3P030 A3P060 A3P1000 A3P125 A3P250 A3P400 PAC10
Text: 2 – ProASIC3 DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Abstract: No abstract text available
Text: Revision 13 ProASIC3 Flash Family FPGAs with Optional Soft ARM Support Features and Benefits Advanced I/O High Capacity • 15 k to 1 M System Gates • Up to 144 kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal 6 Copper , Flash-Based CMOS
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DUAL-PORT STATIC RAM
Abstract: IC transistor linear handbook
Text: ProASIC 3L Low-Power Handbook ProASIC3L Low-Power Flash Device Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – ProASICL Low-Power Datasheet
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RT3PE3000
Abstract: ycl pcb 452 kt 501 transistor 1N12 SP6-3 kt 803 a CEN 2N2222A 1437
Text: Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Actel Fusion Mixed-Signal FPGA for the MicroBlade AdvancedMC Solution Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i
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bm 308 an
Abstract: ICE 10501 TRANSISTOR MARKING YB 826
Text: IGLOOe Handbook IGLOOe Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – IGLOOe Datasheet IGLOOe Low-Power Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
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