chotherm
Abstract: ASTM d792 ASTM D412 D149 D2240 D257 D374 D412 D624 D792
Text: INSULATORS • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs
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WW-XXYYYY-1671.
381mm)
October1999
chotherm
ASTM d792
ASTM D412
D149
D2240
D257
D374
D412
D624
D792
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T443
Abstract: Chomerics T710 D257 D374 D792 T310 T725 chomerics 77 PARKER HANNIFIN parker
Text: TECHNICAL BULLETIN • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs
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TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
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Untitled
Abstract: No abstract text available
Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE
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D149
Abstract: D150 D2240 D257 D412 E595 astm D150
Text: TpliTM 200 Series Gap Filler Innovative Technology for a Connected World Exceptionally soft, highly compressible gap filler Tpli 200 is a premium gap filler. A unique blend of boron nitride and silicone produce the highest performing interface pad. Tpli™ 200’s exceptional combination of high thermal conductivity and compliancy
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A13519-00
D149
D150
D2240
D257
D412
E595
astm D150
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E1269
Abstract: ADHESIVE GAP PAD SIL-PAD heat capacity ASTM d792 GPVOUS-0.100-AC-0816-NA SIL-PAD D575 SIL-PAD density young D149
Text: SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 11 Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K
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3M Philippines
Abstract: 3M8815 5591S TW-3M tape 3m vhb TC-2810 E3Z-R81-M1J-10.3M
Text: Information or Sales Assistance Contact 3M for the experience of 100 years of solutions for your design and production challenges. 3M Thermally Conductive Interface Pads Through innovative 3M technology, these soft and conformable pads provide high levels of conductivity for the more demanding
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60-3-7rchase
1-1W-10
3M Philippines
3M8815
5591S
TW-3M
tape 3m vhb
TC-2810
E3Z-R81-M1J-10.3M
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K177-353BQ2840
Abstract: K177-NA-353 K1778 TSC209-ZP k177 TSC506-NY K200-AC-403 TSC405-ZP K177-AC-353 K200-AC-353
Text: HEATSINKS & MOUNTINGS MOUNTING HARDWARE THERMAL INTERFACE MATERIALS KOOL-PADS KA150-2AC. Provides an efficient method of mounting heatsinks on to devices such as CPUs, DIL/SMT packages and other similar devices requiring effective transfer of generated heat. Highly conductive aluminium foil with adhesive applied to both sides negates the
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KA150-2AC.
300mm
KA150-2AC-30X30
5-100X100
2-100X100
0-100X100
5000Vrms
K177-353BQ2840
K177-NA-353
K1778
TSC209-ZP
k177
TSC506-NY
K200-AC-403
TSC405-ZP
K177-AC-353
K200-AC-353
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Ultimate Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material Features and Benefits • Thermal conductivity: 1.3 W/m-K • Ultra conformability • Gel-like modulus TYPICAL PROPERTIES OF GAP PAD VO ULTIMATE PROPERTY
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E1269
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SIL-PAD density
Abstract: ACME10256 D149 D150 D2240 D257 D374 D575 D792 ASTM D374
Text: Gap Pad VO Soft Highly Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO SOFT • Thermal conductivity: 0.8 W/m-K • Conformable, low hardness • Enhanced puncture, shear and tear resistance
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E1269
D2240
SIL-PAD density
ACME10256
D149
D150
D2240
D257
D374
D575
D792
ASTM D374
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bergquist
Abstract: SIL-PAD density conductivity ASTM D575 bergquist ultra soft
Text: Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO • Thermal conductivity: 0.8 W/m-K • Enhanced puncture, shear and tear resistance • Conformable gap filling material • Electrically isolating
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E1269
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Ultra Soft-B Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT-B PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • Gel-like modulus
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D149
Abstract: D150 D2240 D257 D412 E595 IPC-TM650
Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These
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A13512-00
T-FLEX600-0707
D149
D150
D2240
D257
D412
E595
IPC-TM650
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus
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D149
Abstract: D150 D2240 D257 D412 E595
Text: TflexTM 600 Series Thermal Gap Filler Innovative Technology for a Connected World Exceptionally soft, highly compressible gap filler Tflex 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a
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A13512-00
D149
D150
D2240
D257
D412
E595
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Thermagon
Abstract: WARTH E1808 Orcus ASTM D412 D149 D150 D2240 D257 D412
Text: T-flex 600 Series T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in
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A13512-00
Thermagon
WARTH
E1808
Orcus
ASTM D412
D149
D150
D2240
D257
D412
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D149
Abstract: D150 D2240 D257 D412 E595
Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These
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Abstract: No abstract text available
Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier
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1500S30
E1269
D2240
1500S30
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In-Sil-8
Abstract: 619-1001 161000F00000 188958F00000 101600F00000 100500F00000
Text: A a v i d Thermalloy Heat Sinks, Conductive Adhesive and Compounds, and IN-SIL-8 Pads ª All material is aluminum alloy with a black, anodized finish unless otherwise noted. Slip-On for TO-92 4 Foot Length Extrusion Cut, Deburred and Washed Not Anodized
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500-Up
575200B00000
O-220
10-Up
574502B00000*
574502B03300*
600502F00000
600552F00000
188958F00000
In-Sil-8
619-1001
161000F00000
188958F00000
101600F00000
100500F00000
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ASTM D374
Abstract: 1500S30
Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K • Highly conformable / low hardness PROPERTY Color IMPERIAL VALUE
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1500S30
1500S30
ASTM D374
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BERGQUIST
Abstract: 3000S30 conductivity
Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 3000S30 PROPERTY Color • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance at very low pressures
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3000S30
3000S30
BERGQUIST
conductivity
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SIL-PAD density
Abstract: ADHESIVE GAP PAD ASTM d792 Sil-Pad C351 D149 D150 D2240 D257 D374
Text: Gap Pad VO Ultra Soft Highly Conformable, Thermally Conductive Material for Filling Air Gaps Features and Benefits Typical Properties of Gap Pad VO UltraSoft Property • Thermal conductivity 1.0 W/m-K Color • Highly conformable nature • Shock absorbing characteristics
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Abstract: No abstract text available
Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance at very low pressures • Highly conformable,“S-Class” softness
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3000S30
3000S30
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