Strain gage report
Abstract: with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG
Text: Application Report SPRAA55 - August 2004 Use and Handling of Semiconductor Packages with ENIG Pad Finishes Eddie Moltz DSP Packaging ABSTRACT Electroless Nickel/Immersion Gold plating, or ENIG, is a versatile process and enables fabrication of high-density flip chip BGA substrates needed for high-performance IC chips.
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SPRAA55
Strain gage report
with or without underfill
flip SMT Texas
"Strain Gage"
ENIG
strain rate
texas instruments automotive flip chip
underfill Texas
alternative ENIG
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JIS-C-6429
Abstract: MF-R110-2 USMD1210 MF-R110-2-99 MF-MSMD equivalent alternative ENIG PTC 965
Text: Bourns Lead Free ® Multifuse Polymer PTCs Circuit Protection Solutions 1 Table Of Contents Table Of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
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SS-00254
2002/95/EC
e/MF0406
JIS-C-6429
MF-R110-2
USMD1210
MF-R110-2-99
MF-MSMD equivalent
alternative ENIG
PTC 965
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IPC-9702
Abstract: ipc 9702 Strain gage report bga dye pry black pad strain gage strain gage test IPC9702 4 MUD FR4 1.6mm substrate
Text: FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev Altera Corporation, San Jose, CA, USA abansal@altera.com ABSTRACT PCB assembly and handling operations involving excessive
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EN53x0D
Abstract: AN-101 EN5310 an101 Teflon 25um
Text: Application Note EN53x0D AN-101 January 2006 Rev 1.2 Power Converter Module Package Process Specification for EN5310, EN5330, and EN5360 Converter Modules Introduction This applications note addresses the following topics: • PCB Design Recommendations: o Pad Layout
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EN53x0D
AN-101
EN5310,
EN5330,
EN5360
-EN5310
-EN5330
-EN5360
AN-101
EN5310
an101
Teflon
25um
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sma connector footprint
Abstract: 142-0761-881 SMA End Launch connectors ro4003* substrate midwest microwave Rogers RO4003* characteristic impedance 50 ohm SMA terminators hf combiners RO4003C IPC-4552
Text: Johnson High Frequency End Launch Connectors Emerson Network Power Connectivity Solutions E M E R S O N. C O N S I D E R I T S O LV E D . High Frequency SMA End Launch Connectors Applications High Frequency SMA End Launch Connectors for Microwave PC Board Substrates
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Untitled
Abstract: No abstract text available
Text: connectBlue CB-OWL355 ELECTRICAL AND MECHANICAL DATA SHEET Preliminary data sheet Document Revision Document number: 23035905 Release: May 12, 2014 15:00 Document version: 3 Copyright 2014 connectBlue AB. The contents of this document can be changed by connectBlue AB without prior notice and do not constitute any
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CB-OWL355
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Untitled
Abstract: No abstract text available
Text: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE
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AN-617
AN03272-0-5/12
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QFN PACKAGE thermal resistance
Abstract: No abstract text available
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53XXXUI QFN Package Soldering Guidelines John D. Weld, Ph.D. 11/4/2008 1.0 INTRODUCTION Enpirion’s EP53XXXUI power converter packages are designed with a plastic leadframe
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EP53XXXUI
QFN PACKAGE thermal resistance
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EP53F8QI
Abstract: No abstract text available
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53F8QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP53F8QI power converter packages are designed with a plastic leadframe
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EP53F8QI
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EP5368QI
Abstract: No abstract text available
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5368QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 9/27/2007 1.0 INTRODUCTION Enpirion’s EP5368QI power converter package is designed with a plastic leadframe
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EP5368QI
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pcb fabrication process
Abstract: EP53
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53XXXQI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP53XXXQI power converter packages are designed with a plastic leadframe
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EP53XXXQI
pcb fabrication process
EP53
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EN5311Qi
Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
Text: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package
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EN5311QI
EN5311
IPC-7095
IPC-7095B
QFN PACKAGE thermal resistance
"exposed pad" PCB via
qfn 32 land pattern
qfn stencil
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EN5364QI
Abstract: No abstract text available
Text: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5364QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5364QI power converter packages are designed with a plastic leadframe
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EN5364QI
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en5337qi
Abstract: EN5337 qfn 32 stencil smd be
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5337QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 2/3/2009 1.0 INTRODUCTION Enpirion’s EN5337QI power converter packages are designed with a plastic leadframe
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EN5337QI
EN5337
qfn 32 stencil
smd be
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EN5335QI
Abstract: qfn stencil EN5335Q qfn 32 stencil Thermal vias
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5335QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5335QI power converter packages are designed with a plastic leadframe
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EN5335QI
qfn stencil
EN5335Q
qfn 32 stencil
Thermal vias
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QFN leadframe
Abstract: smt pcb ipc standard
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5362QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5362QI power converter packages are designed with a plastic leadframe
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EP5362QI
QFN leadframe
smt pcb ipc standard
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QFN-6x6 0.5mm
Abstract: QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111
Text: AN3111 Rev 3, 07/2008 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona
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AN3111
QFN-6x6 0.5mm
QFN-6x6 48
qfn 6x6 foot print
qfn 44 PACKAGE footprint
qfn stencil
AN3111
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qfn 32 land pattern
Abstract: EN5396QI QFN footprint QFN leadframe qfn 32 stencil
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5396QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 6/18/2008 1.0 INTRODUCTION Enpirion’s EN5396QI power converter packages are designed with a plastic leadframe
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EN5396QI
qfn 32 land pattern
QFN footprint
QFN leadframe
qfn 32 stencil
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EN5336QI
Abstract: stencil qfn stencil
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5336QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5336QI power converter packages are designed with a plastic leadframe
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EN5336QI
stencil
qfn stencil
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EP5382QI
Abstract: No abstract text available
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5382QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5382QI power converter packages are designed with a plastic leadframe
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EN5394QI
Abstract: QFN leadframe QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394
Text: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5394QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5394QI power converter packages are designed with a plastic leadframe
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EN5394QI
QFN leadframe
QFN PACKAGE thermal resistance
qfn 44 PACKAGE footprint
EN5394
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IPC-7095B
Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
Text: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package
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EN5312QI
IPC-7095B
IPC-7095
7095B
IPC 7095B
en5312
qfn stencil
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qfn 6x6 foot print
Abstract: QFN-6x6 0.5mm AN3111 QFN-6x6 48 nozzle heater sensors-free QFN footprint QFN-6x6 package qfn stencil QFN-48 LAND PATTERN
Text: Freescale Semiconductor Application Note AN3111 Rev 2, 06/2007 Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona
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AN3111
qfn 6x6 foot print
QFN-6x6 0.5mm
AN3111
QFN-6x6 48
nozzle heater
sensors-free
QFN footprint
QFN-6x6 package
qfn stencil
QFN-48 LAND PATTERN
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inspection mirror
Abstract: QFN leadframe QFN PACKAGE thermal resistance qfn stencil
Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5395QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 6/18/2008 1.0 INTRODUCTION Enpirion’s EN5395QI power converter packages are designed with a plastic leadframe
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EN5395QI
inspection mirror
QFN leadframe
QFN PACKAGE thermal resistance
qfn stencil
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