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GigaDevice Semiconductor (Beijing) Inc GD25Q64ENIGR IC FLASH 64MBIT SPI/QUAD 8USON
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GD25Q64ENIGR	Reel			3,000	1 - 10 - 100 - 1000 - 10000 $0.83427	Buy Now
Mouser Electronics	GD25Q64ENIGR					1 - 10 - 100 - 1000 - 10000 $0.769	Get Quote
Symmetry Electronics	GD25Q64ENIGR				1	1 $1.2 10 $1 100 $1 1000 $1 10000 $1	Buy Now
GigaDevice Semiconductor (Beijing) Inc GD25Q16ENIGR IC FLASH 16MBIT SPI/QUAD 8USON
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GD25Q16ENIGR	Reel			6,000	1 - 10 - 100 - 1000 - 10000 $0.6175	Buy Now
	GD25Q16ENIGR	Digi-Reel			1	1 $0.87 10 $0.87 100 $0.87 1000 $0.87 10000 $0.87	Buy Now
	GD25Q16ENIGR	Cut Tape			1	1 $0.87 10 $0.87 100 $0.87 1000 $0.87 10000 $0.87	Buy Now
Symmetry Electronics	GD25Q16ENIGR				1	1 $0.78 10 $0.65 100 $0.65 1000 $0.65 10000 $0.65	Buy Now
GigaDevice Semiconductor (Beijing) Inc GD25Q32ENIGR IC FLASH 32MBIT SPI/QUAD 8USON
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GD25Q32ENIGR	Reel			3,000	1 - 10 - 100 - 1000 - 10000 $0.6715	Buy Now
Mouser Electronics	GD25Q32ENIGR					1 - 10 - 100 - 1000 - 10000 $0.595	Get Quote
Symmetry Electronics	GD25Q32ENIGR				1	1 $0.94 10 $0.78 100 $0.78 1000 $0.78 10000 $0.78	Buy Now
GigaDevice Semiconductor (Beijing) Inc GD25B64ENIGR IC FLASH 64MBIT SPI/QUAD 8USON
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GD25B64ENIGR	Reel			3,000	1 - 10 - 100 - 1000 - 10000 $0.84667	Buy Now
Mouser Electronics	GD25B64ENIGR					1 - 10 - 100 - 1000 - 10000 $0.781	Get Quote
Symmetry Electronics	GD25B64ENIGR				1	1 $1.22 10 $1.02 100 $1.02 1000 $1.02 10000 $1.02	Buy Now
GigaDevice Semiconductor (Beijing) Inc GD25WQ32ENIGR IC FLASH 32MBIT SPI/QUAD 8USON
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GD25WQ32ENIGR	Reel			3,000	1 - 10 - 100 - 1000 - 10000 $0.75954	Buy Now
Mouser Electronics	GD25WQ32ENIGR					1 - 10 - 100 - 1000 - 10000 $0.698	Get Quote
Symmetry Electronics	GD25WQ32ENIGR				1	1 $1.08 10 $0.9 100 $0.9 1000 $0.9 10000 $0.9	Buy Now

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ENIG Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Strain gage report Abstract: with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG Text: Application Report SPRAA55 - August 2004 Use and Handling of Semiconductor Packages with ENIG Pad Finishes Eddie Moltz DSP Packaging ABSTRACT Electroless Nickel/Immersion Gold plating, or ENIG, is a versatile process and enables fabrication of high-density flip chip BGA substrates needed for high-performance IC chips.	Original	SPRAA55 Strain gage report with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG	PDF
Sn63pB37 Abstract: FR4 substrate QFE128SD SF-QFE128SD-L-01F Text: 0.4mm typ. 15.42mm [0.607"] 14.05mm [0.553"] 0.2mm 1 Top View 15.42mm [0.607"] 1mm typ. [0.03937"] 0.254mm [0.010"] 1 2 5.17mm [0.203"] 4.56mm [0.179"] Substrate: 0.025"±0.003" FR4/G10 or equivalent high temp material. ENIG finish Pins: shell material- Brass; finish- 10µ" gold over 50µ"	Original	254mm FR4/G10 Sn63Pb37 QFE128SD SF-QFE128SD-L-01F Sn63pB37 FR4 substrate	PDF
Sn63pB37 Abstract: QFE128SD SF-QFE128SD-L-01 Sn96 Text: 0.4mm typ. 15.42mm [0.607"] 14.05mm [0.553"] 0.2mm 1 Top View 15.42mm [0.607"] 1mm typ. [0.03937"] 5.17mm [0.203"] 4.56mm [0.179"] 0.254mm [0.010"] 1 Substrate: 0.025"±0.003" FR4/G10 or equivalent high temp material. ENIG finish 2 Pins: shell material- Brass; finish- 10µ" gold over 50µ"	Original	254mm FR4/G10 Sn63Pb37 QFE128SD SF-QFE128SD-L-01 Sn63pB37 Sn96	PDF
IPC-9702 Abstract: ipc 9702 Strain gage report bga dye pry black pad strain gage strain gage test IPC9702 4 MUD FR4 1.6mm substrate Text: FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev Altera Corporation, San Jose, CA, USA abansal@altera.com ABSTRACT PCB assembly and handling operations involving excessive	Original		PDF
FR406 Abstract: No abstract text available Text: 14-307799-11 12 Ball MicroBGA to 14 Pin .3 Dip Adapter FEATURES: • A cost effective means of bread boarding BGA packages. • Available on .300 [7.62] centers. GENERAL SPECIFICATIONS: • Board material is .062 thick FR406 high temp material with 1 oz. Copper traces, both sides. Finished with ENIG	Original	FR406 C36000 ASTM-B16-00. SAE-AMS-QQN-290.	PDF
SF-PLCC84-J-S-01 Abstract: IPC-4101 Text: 1.170" 0.135" Top View 0.135" 1.170" Ø 0.020" x4 1 Side View 0.207" 2 0.050" typ. 0.017" 1.136" 1.186" 1 2 A Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] per IPC 4101/21, ENIG finish. J-lead: RoHS, 0.050" pitch, 0.056" gap, phosphor bronze pre-plated pure tin finish.	Original	SF-PLCC84-J-S-01 IPC-4101	PDF
Untitled Abstract: No abstract text available Text: TQM879006 1.8-2.7GHz Digital Variable Gain Amplifier Applications 3G / 4G Wireless Infrastructure CDMA, TD-CDMA, WCDMA, LTE Repeaters PTP Radio IF Chains 28-pin 6x6mm leadless SMT package Product Features Functional Block Diagram 1.8-2.7 GHz Frequency Range	Original	TQM879006 28-pin TQM879006	PDF
Untitled Abstract: No abstract text available Text: TQP3M6005 Mid Band Dual LNA 1700-2000 MHz Applications •  Base Station receivers Tower-mounted amplifiers 16-pin 4x4mm leadless SMT package Product Features       Functional Block Diagram 0.36 dB Noise Figure (single channel) 1700-2000 MHz	Original	TQP3M6005 16-pin TQP3M6005	PDF
Untitled Abstract: No abstract text available Text: P/N 96-160M65 160-Position, 0.0256 [0.65] Pitch QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 15x15 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,	Original	96-160M65 160-Position, 15x15 C36000, B16/B16M B579-73 AMS-QQ-N-290 96-160M65-P	PDF
ups PURE SINE WAVE schematic diagram Abstract: 3 phase ups PURE SINE WAVE schematic diagram R262 BR262W30A103E1G BR262W30 electret mems microphone preamplifier BR262 WLCSP-30 BR262W26A103E1G make three phase ups schematic diagram Text: BelaSigna R262 Wideband Voice Capture and Noise Reduction Solution Introduction • Drop−in Solution that Works without Special Tuning • Consistently Captures Voice Regardless of Acoustic Environment or • • • • • • the Orientation of the Handheld Device While in Use	Original	BR262/D ups PURE SINE WAVE schematic diagram 3 phase ups PURE SINE WAVE schematic diagram R262 BR262W30A103E1G BR262W30 electret mems microphone preamplifier BR262 WLCSP-30 BR262W26A103E1G make three phase ups schematic diagram	PDF
jfet j102 Abstract: SLUA372 tda 0470 bq78PL118EVM SLUA524 SLUU481 smd zener diode code z4 USB-TO-GPIO cell balance board users guide Advanced Gas Gauge Host Firmware Guide Text: User's Guide SLUU474 – January 2011 bq78PL116EVM Evaluation Module The bq78PL116EVM Evaluation Module can assist users in evaluating the bq78PL116 PowerLAN Master Gateway Controller. Included in this document are discussions of the board and its operation, the	Original	SLUU474 bq78PL116EVM bq78PL116 jfet j102 SLUA372 tda 0470 bq78PL118EVM SLUA524 SLUU481 smd zener diode code z4 USB-TO-GPIO cell balance board users guide Advanced Gas Gauge Host Firmware Guide	PDF
DSP signaklara Abstract: BR261W26 WLCSP-30 electret mems microphone preamplifier 30-ball BR261W26A101E1G 021V0 voice usage to charge mobile phones block diagram digital mems microphone analog mems microphone preamplifier Text: BelaSigna R261 Advanced Noise Reduction Solution for Voice Capture Devices Introduction • • • • • • • • • • • • Advanced Two−Microphone Noise Reduction Algorithm Preserves Voice Naturalness Supports Close−Talk, Far−Talk and Custom Mode	Original	BR261/D DSP signaklara BR261W26 WLCSP-30 electret mems microphone preamplifier 30-ball BR261W26A101E1G 021V0 voice usage to charge mobile phones block diagram digital mems microphone analog mems microphone preamplifier	PDF
Untitled Abstract: No abstract text available Text: WJZ3030 Broadband Surface Mount Mixer Product Features Product Description Functional Diagram LO • • • • • • • +20 dBm Input IP3 RF: 10 – 500 MHz LO: 10 – 500 MHz IF: 10 – 500 MHz +7 dBm LO Drive Level No Internal Solder Connections Lead Free/RoHS-compliant	Original	WJZ3030 WJZ3030 WJZ3030â 1-800-WJ1-4401 July2007	PDF
Untitled Abstract: No abstract text available Text: WJZ3020 Broadband Surface Mount Mixer Product Features Product Description Functional Diagram LO • • • • • • • +19 dBm Input IP3 RF: 10 – 250 MHz LO: 10 – 250 MHz IF: 10 – 250 MHz +7 dBm LO Drive Level No Internal Solder Connections Lead Free/RoHS-compliant	Original	WJZ3020 WJZ3020 WJZ3020â 1-800-WJ1-4401 July2007	PDF

CC2500 Abstract: No abstract text available Text: 1101 Series A1101R09A The A1101R09A is a high-performance, FCC & IC certified radio module that incorporates the Texas Instruments CC1101 transceiver chip in the industry’s smallest package 9 x 16 x 2.5mm . Features •         	Original	A1101R09A CC1101 A1101R09A 10dBm CC1101, CC110L, CC2500) x100MHz) 1219a CC2500	PDF
implantable medical device Abstract: RSS-210 CC2500 Text: 1101 Series A1101R09C The A1101R09C is a high-performance, FCC & IC certified connectorized radio module that incorporates the Texas Instruments CC1101 transceiver chip in the industry’s smallest package 9 x 12 x 2.5mm . Features •     	Original	A1101R09C CC1101 A1101R09C 10dBm CC1101, CC110L, CC2500) x100MHz) 1219a implantable medical device RSS-210 CC2500	PDF
ZF Embedded Abstract: ZF LINUX DEVICES Text: uit de markt reacties embedded@ k1uwer.nl Nieuws uit Silicon Valley X86-moederbord op chip De eerste winst wordt in het vierde kwartaal van dit jaar verwacht. David Feldman is goed op dreef. De bedenker van het pcic>4-computerkaartenformaat en oprichter van Ampro Computers is enige jaren	OCR Scan	X86-moederbord ZFx86 ZFx86. ZF Embedded ZF LINUX DEVICES	PDF
rgn 1064 Abstract: rgn1064 CA50G Text: VEB ROHRENWERK M Ü H L H A U S E N R G N 1064 ZW EIW EGGLEICHRICHTER o2 SockelscHaltschem a TECHNISCHE Heizung: Heizspannung Heizstrom DATEN Uf lf 4 1,1 V A Grenzwerte: Transform atorspannung U-Trmax 2 x 500 2 x 400 2 x 300 u. w eniger V Max. entnehm barer	OCR Scan	/V/4/26 rgn 1064 rgn1064 CA50G	PDF
AZ12 Abstract: Sprecher Text: VEB RÖHRENWERK MÜHLHAUSEN AZ 12 ZWEIWEGGLEICHRICHTER S ockelschaltschem a Kolbenabm essungen TECHNISCHE Heizung: Heizspannung Heizstrom DATEN Uf lf 4 2,2 V A Grenzwerte: Transform atorspannung U Tr max 2 x 500 2 x 400 2 x 300 u. w eniger V Max. entnehm barer	OCR Scan	/V/4/26 AZ12 Sprecher	PDF
Untitled Abstract: No abstract text available Text: N N S teckverbinder-A usfiihrungen fu r W e llm an telk ab e l A v a ila b le Types of C o n n ecto rs fo r C o rru g ated C ab le Bei T e le g a rtn e r N S teckve rb in d e rn fu r Feeder Kabel w enig fle x ib le und Jum per Kabel (h o c h fle x ib e l) lassen sich 4	OCR Scan		PDF
Untitled Abstract: No abstract text available Text: NOTES: UNLESS OTHERWISE SPECIFIED THIS COMPONENT CONFORMS TO UL6Q950. UL FILE NO. IS: E216117. REFERENCE ONLY. USED PARAMETER OPERATING TEM P DATE TU R N S RATIO 1 : 100 RETURN LO SS, Z OUT = LOSS (M E D IA SIDE, - 1 .2 KHz dB 1 -1 2 5 MAX .1 -4 0 1000BT	OCR Scan	UL6Q950. E216117. 1000BT	PDF
Untitled Abstract: No abstract text available Text: Pulse A TECH N ITRO L COMPANY w w w .pulseeng.com NOTES: UNLESS OTHERWISE SPECIFIED 1. THIS COMPONENT CONFORMS TO UL6Q950. UL FILE NO. IS: E216117. W A R N IN G : THIS CO M PO NENT IS RECO G NIZED BY ONE OR MORE SAFETY AGENC IES S U C H A S UL, VDE, CSA A N D /O R TUV.	OCR Scan	UL6Q950. E216117.	PDF
AZ12 Abstract: az12 telefunken transformatorspannung Text: TELEFUNKEN Netzröhre für W-Heizung direkt geheizt A Z 12 Zweiweggleichrichter Heizspannung Uf 4 Volt Heizstrom lf 2,2 Amp Betriebswerte: siehe Kurven Grenzwerte: beträgt der m axim al entnehm bare Gleichstrom l _ mA Bei einer Transform atorspannung UTr (V eff.)	OCR Scan	2x500 010342-a 010342-b AZ12 az12 telefunken transformatorspannung	PDF
Untitled Abstract: No abstract text available Text: ^ Pulse A TECH N ITRO L COMPANY w w w .pulseeng.com NOTES: UNLESS OTHERWISE SPECIFIED 1. THIS COMPONENT CONFORMS TO UL6Q950. UL FILE NO. IS: E216117. WARNING: THIS COMPONENT IS RECOGNIZED BY ONE OR MORE SAFETY AGENCIES SUCH AS UL, VDE, CSA AND/OR TUV. ALL ENGINEERING CHANGES	OCR Scan	UL6Q950. E216117.	PDF

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ENIG Search Results

ENIG Price and Stock

GigaDevice Semiconductor (Beijing) Inc GD25Q64ENIGR

GigaDevice Semiconductor (Beijing) Inc GD25Q16ENIGR

GigaDevice Semiconductor (Beijing) Inc GD25Q32ENIGR

GigaDevice Semiconductor (Beijing) Inc GD25B64ENIGR

GigaDevice Semiconductor (Beijing) Inc GD25WQ32ENIGR

ENIG Datasheets Context Search

Strain gage report

Sn63pB37

Sn63pB37

IPC-9702

FR406

SF-PLCC84-J-S-01

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ups PURE SINE WAVE schematic diagram

jfet j102

DSP signaklara

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CC2500

implantable medical device

ZF Embedded

rgn 1064

AZ12

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AZ12

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