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    AMB1608C2450Z10

    Abstract: No abstract text available
    Text: MD-MDE009-0501 Multi-layer chip balun Features Low loss High balance characteristic Specification Parts Number BW Z(Ω) IL VSWR Phase Balance Amp. balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 0.7 1.5 180±10 1.0 AMB1608C2450Z10


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    MD-MDE009-0501 AMB1608C2450Z05 AMB1608C2450Z10 AMB1608C5425Z05 AMB1608C5425Z10 AMB1608C5512Z05 AMB1608C5412Z10 PDF

    AMB1608

    Abstract: No abstract text available
    Text: MD-MDE008-0307 MULTILAYER CHIP BALUN AMB2012 Typ Features • Low loss • High balance characteristic Specification Center Frequency(fo) 2450.0MHz Frequency Range f0 ± 50MHz Insertion Loss 1.0Db max. (f0 ± 50MHz) Unbalance Lmpedance 50Ω Balance impedance


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    MD-MDE008-0307 AMB2012) 50MHz 50MHz) MD-MDE009-0307 AMB1608) AMB1608C2450Z05 AMB1608C2450Z10 AMB1608C2450Z20 AMB1608C5425Z05 AMB1608 PDF

    Untitled

    Abstract: No abstract text available
    Text: MD-MDE009-0711 Multilayer Chip Balun: AMB1608 Series Device Features „ „ „ Applications Miniature Size and Low Profile 1.6mm x 0.8mm x 0.6mm Low Insertion Loss (0.6dB typ. /C2450series) RoHS Compliant Wireless LAN, Bluetooth module WiMAX „ „ Shape & Dimensions


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    MD-MDE009-0711 AMB1608 /C2450series) AMB1608C2450Z05AT PDF

    AMB1608C2450

    Abstract: AMB1608C
    Text: MD-MDE009-0307 Multi-layer chip balun Features Low loss High balance characteristic Specification Amp. BW Z Ω IL VSWR Phase Balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 1.0 1.5 180±10 1.0 AMB1608C2450Z10 2400 - 2500 100


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    MD-MDE009-0307 AMB1608C2450Z05 AMB1608C2450Z10 AMB1608C2450Z20 AMB1608C5425Z05 AMB1608C5512Z10 AMB1608C5425Z10 AMB1608C2450 AMB1608C PDF

    AMB1608C2450

    Abstract: No abstract text available
    Text: MD-MDE009-0307 MULTILAYER CHIP BALUN AMB1608 Typ Features • Low loss • High balance characteristic Specification BW Z(Ω) Parts Number IL VSWR Phase Balance Amp. balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 1.0 1.5


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    MD-MDE009-0307 AMB1608) AMB1608C2450Z05 AMB1608C2450Z10 AMB1608C2450Z20 AMB1608C5425Z05 AMB1608C5512Z10 AMB1608C5425Z10 AMB1608C2450 PDF

    Untitled

    Abstract: No abstract text available
    Text: MD-MDE009-0501 Multi-layer chip balun Features Low loss High balance characteristic Specification Parts Number BW Z(Ω) IL VSWR Phase Balance Amp. balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 0.7 1.5 180±10 1.0 AMB1608C2450Z10


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    MD-MDE009-0501 AMB1608C2450Z05 AMB1608C2450Z10 AMB1608C5425Z05 AMB1608C5425Z10 AMB1608C5512Z05 AMB1608C5512Z10 PDF

    AMB1608C3600Z10A

    Abstract: AMB1608C2450Z05 AMB1608C3600Z05 AMB1608C2450
    Text: MD-MDJ009-0912 積層チップバラン AMB1608 シリーズ [特長] „ „ „ [用途] 小型低背化 1.6mm x 0.8mm x 0.6mm 低損失化 (0.6dB typ. /C2450series) RoHS 指令対応 „ „ „ 無線 LAN, Bluetooth モジュール WiMAX,WiBro モジュール


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    MD-MDJ009-0912 AMB1608 /C2450series) AMB1608C1905Z10AT AMB1608C1960Z10AT AMB1608C2350Z05AT AMB1608C2350Z10AT AMB1608C2450Z05 AMB1608C2450Z10 AMB1608C2500Z05 AMB1608C3600Z10A AMB1608C3600Z05 AMB1608C2450 PDF

    Untitled

    Abstract: No abstract text available
    Text: MD-MDE009-0912 Multilayer Chip Balun: AMB1608 Series Device Features „ „ „ Applications Miniature Size and Low Profile 1.6mm x 0.8mm x 0.6mm Low Insertion Loss (0.6dB typ. /C2450series) RoHS Compliant Wireless LAN, Bluetooth module WiMAX , WiBro „ „


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    MD-MDE009-0912 AMB1608 /C2450series) AMB1608C1905Z10AT AMB1608C1960Z10AT AMB1608C2350Z05AT AMB1608C2350Z10AT AMB1608C2450Z05 AMB1608C2450Z10 AMB1608C2500Z05 PDF