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AN-450Contextual Info: The SO small outline package has been developed to meet customer demand for ever-increasing miniaturization and component density. COMPONENT SIZE COMPARISON S.O. Package AN008766-1 AN008766-3 Standard DIP Package FIGURE 1. AN008766-2 Because of its small size, reliability of the product assembled |
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AN008766-1 AN008766-3 AN008766-2 an008766 AN-450 | |
AN-450Contextual Info: National Semiconductor Application Note 450 Josip Huljev W. K. Boey February 1987 The SO small outline package has been developed to meet customer demand for ever-increasing miniaturization and component density. In order to achieve reliability performance comparable to |
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