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WIRE SHEAR PULL MIL-STD Abstract: Mil-Std-883 Wire Bond Pull Method 2011 PH25 Text: Application Note UMS GaAs Wafer Acceptance Tests This application note describes the tests performed by UMS in order to control and guarantee the overall quality of the GaAs MMIC wafers, prior to the individual chip measurement and individual visual inspection. These wafer acceptance tests consist in a	Original	PDF	ANWAT9137 04-JAN-00 WIRE SHEAR PULL MIL-STD Mil-Std-883 Wire Bond Pull Method 2011 PH25

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WIRE SHEAR PULL MIL-STD

Abstract: Mil-Std-883 Wire Bond Pull Method 2011 PH25
Text: Application Note UMS GaAs Wafer Acceptance Tests This application note describes the tests performed by UMS in order to control and guarantee the overall quality of the GaAs MMIC wafers, prior to the individual chip measurement and individual visual inspection. These wafer acceptance tests consist in a

Original

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ANWAT9137 04-JAN-00 WIRE SHEAR PULL MIL-STD Mil-Std-883 Wire Bond Pull Method 2011 PH25