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    AUS303 Search Results

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    AUS303 Price and Stock

    Gembird Electronics Ltd AUS3-03

    USB to SATA adapter; SATA plug,USB C plug; 0.2m; Cablexpert
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME AUS3-03 4 1
    • 1 $8.18
    • 10 $7.15
    • 100 $7.15
    • 1000 $7.15
    • 10000 $7.15
    		Buy Now

    AUS303 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    nitto GE

    Abstract: GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-07 Product Affected: DATE: September 17, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 17mm x 17mm TEBGA-580 (Green) Product Mark


    Original     		PDF A1008-07 TEBGA-580 facilitSD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 SXVX-110BHG SXVX-200BHG SXVX-210BHG nitto GE GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS

    CV-8710

    Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
    Text:  Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010


    Original     		PDF JIG-101 CV-8710 EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy

    KEG1250LKDS

    Abstract: aus303 KE-G1250LKDS G1250LKDS GE100LFCS KE-G1250 GE-100-LFC HL832NX a1008 JESD22-A103
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-06 Product Affected: DATE: August 27, 2010 82P20516DBFG & 82P20516DBFG8 built in 19mm x 19mm FPBGA-484 Date Effective: November 27, 2010


    Original     		PDF A1008-06 82P20516DBFG 82P20516DBFG8 FPBGA-484 JESD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 82P20416DBFG KEG1250LKDS aus303 KE-G1250LKDS G1250LKDS GE100LFCS KE-G1250 GE-100-LFC HL832NX a1008 JESD22-A103

    AUS308

    Abstract: AUS308 thermal kester 256 AUS303 AUS-308 aus5 kester 245 solder wire Lead Free reflow soldering profile BGA
    Text: Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components WP-CHMFGRELLDFR-2.0 White Paper The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that


    Original     		PDF

    PSR4000 AUS308

    Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
    Text: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array


    Original     		PDF HL832 HL832-HS HL832-NB MCL-E-679W MCL-E-679BR MCL-E-679FG GHPL-830 GEA-679N MR600 GHPL-830 PSR4000 AUS308 prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG